Hygrothermal Degradation of Sheet Molding Compounds

2008 ◽  
pp. 103-103-16
Author(s):  
AB Hosangadi ◽  
HT Hahn
Keyword(s):  
Molding Compounds ◽  
Hygrothermal Degradation

Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds

2019 ◽  
Vol 99 ◽  
pp. 161-167 ◽  
Author(s):  
Shih-Chieh Chao ◽  
Wei-Chen Huang ◽  
Jen-Hsiang Liu ◽  
Jenn-Ming Song ◽  
Po-Yen Shen ◽  
...  
Keyword(s):  
Lead Frame ◽  
Molding Compounds ◽  
Oxidation Characteristics ◽  
Commercial Copper

Hygrothermal degradation effects on a rubber toughened WPC

2020 ◽  
Vol 31 ◽  
pp. S209-S212 ◽  
Author(s):  
V. Mazzanti ◽  
V. Cavalcoli ◽  
A. Balbo ◽  
F. Mollica
Keyword(s):  
Rubber Toughened ◽  
Hygrothermal Degradation

Air entrapment in sheet molding compounds (SMC)

1986 ◽  
Vol 7 (6) ◽  
pp. 431-434 ◽  
Author(s):  
Dag Slotfeldt-Ellingsen ◽  
Elisabeth Magnus ◽  
Eric Ekern ◽  
Egil Holtmon ◽  
Lars Corneliussen
Keyword(s):  
Air Entrapment ◽  
Molding Compounds

Adhesion Strengths of Epoxy Molding Compounds to Gold-plated Copper Leadframes

2000 ◽  
Vol 73 (1) ◽  
pp. 1-17 ◽  
Author(s):  
Sung Yl ◽  
Jang-Kyo Kim ◽  
Chee Yoon Yue ◽  
Jang-Hsing Hsieh
Keyword(s):  
Molding Compounds

scholarly journals Volumetrical Characterization of Sheet Molding Compounds

Materials ◽  
2010 ◽  
Vol 3 (12) ◽  
pp. 5083-5096 ◽  
Author(s):  
Alfredo Calvimontes ◽  
Karina Grundke ◽  
Anett Müller
Keyword(s):  
Molding Compounds

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

2012 ◽  
Vol 52 (11) ◽  
pp. 2677-2684 ◽  
Author(s):  
Andrej Ivankovic ◽  
Kris Vanstreels ◽  
Daniel Vanderstraeten ◽  
Guy Brizar ◽  
Renaud Gillon ◽  
...  
Keyword(s):  
Elastic Modulus ◽  
Experimental Methods ◽  
Molding Compounds ◽  
Ic Packaging

Alternative procedures for the recycling of sheet molding compounds

1993 ◽  
Vol 12 (1) ◽  
pp. 35-45 ◽  
Author(s):  
S. H. Patel ◽  
K. E. Gonsalves ◽  
S. S. Stivala ◽  
L. Reich ◽  
D. H. Trivedi
Keyword(s):  
Molding Compounds ◽  
Alternative Procedures
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