A Unified Creep-Plasticity Theory for Solder Alloys

2009 ◽  
pp. 42-42-18 ◽  
Author(s):  
DL McDowell ◽  
MP Miller ◽  
DC Brooks
Keyword(s):  
Plasticity Theory ◽  
Solder Alloys

scholarly journals 40.1: Invited Paper: Use of flash lamps to achieve non‐equilibrium soldering and assembly using conventional solder alloys

2021 ◽  
Vol 52 (S1) ◽  
pp. 275-275
Author(s):  
Rudy Ghosh ◽  
Vahid Akhavan ◽  
Harry Chou ◽  
Vikram Turkani ◽  
Stan Farnsworth
Keyword(s):  
Solder Alloys ◽  
Non Equilibrium

Constitutive modeling of solder alloys for drop-impact applications

2016 ◽  
Vol 67 ◽  
pp. 135-142 ◽  
Author(s):  
E.H. Wong ◽  
J. Chrisp ◽  
C.S. Selvanayagam ◽  
S.K.W. Seah
Keyword(s):  
Constitutive Modeling ◽  
Drop Impact ◽  
Solder Alloys

VARIATIONAL MULTISCALE ANALYSIS OF SOLIDS WITH STRAIN GRADIENT PLASTIC EFFECTS USING MESHFREE APPROXIMATION

2005 ◽  
Vol 02 (04) ◽  
pp. 601-626 ◽  
Author(s):  
JEOUNG-HEUM YEON ◽  
SUNG-KIE YOUN
Keyword(s):  
Strain Gradient ◽  
Partition Of Unity ◽  
Meshfree Method ◽  
Internal Variable ◽  
Plasticity Theory ◽  
Fine Scale ◽  
Meshfree Approximation ◽  
Gradient Effect ◽  
Classical Plasticity ◽  
Variational Form

A meshfree multiscale method is presented for efficient analysis of solids with strain gradient plastic effects. In the analysis of strain gradient plastic solids, localization due to increased hardening of strain gradient effect appears. Chen-Wang theory is adopted, as a strain gradient plasticity theory. It represents strain gradient effects as an internal variable and retains the essential structure of classical plasticity theory. In this work, the scale decomposition is carried out based on variational form of the problem. Coarse scale is designed to represent global behavior and fine scale to represent local behavior and gradient effect by using the intrinsic length scale. From the detection of high strain gradient region, fine scale region is adopted. Each scale variable is approximated using meshfree method. Meshfree approximation is well suited for adaptivity. As a method of increasing resolution, partition of unity based extrinsic enrichment is used. Each scale problem is solved iteratively. The proposed method is applied to bending of a thin beam and bimaterial shear layer and micro-indentation problems. Size effects can be effectively captured in the results of the analysis.

A Study of Microindentation Hardness Tests by Mechanism-based Strain Gradient Plasticity

2000 ◽  
Vol 15 (8) ◽  
pp. 1786-1796 ◽  
Author(s):  
Y. Huang ◽  
Z. Xue ◽  
H. Gao ◽  
W. D. Nix ◽  
Z. C. Xia
Keyword(s):  
Strain Gradient ◽  
Size Dependence ◽  
Plasticity Theory ◽  
Strain Gradient Plasticity ◽  
Gradient Plasticity ◽  
Hierarchical Framework ◽  
Microindentation Hardness ◽  
Dislocation Hardening ◽  
Hardness Tests ◽  
Micro Indentation

We recently proposed a theory of mechanism-based strain gradient (MSG) plasticity to account for the size dependence of plastic deformation at micron- and submicronlength scales. The MSG plasticity theory connects micron-scale plasticity to dislocation theories via a multiscale, hierarchical framework linking Taylor's dislocation hardening model to strain gradient plasticity. Here we show that the theory of MSG plasticity, when used to study micro-indentation, indeed reproduces the linear dependence observed in experiments, thus providing an important self-consistent check of the theory. The effects of pileup, sink-in, and the radius of indenter tip have been taken into account in the indentation model. In accomplishing this objective, we have generalized the MSG plasticity theory to include the elastic deformation in the hierarchical framework.

Recrystallization and ${\rm Ag}_{3}{\rm Sn}$ Particle Redistribution During Thermomechanical Treatment of Bulk Sn–Ag–Cu Solder Alloys

2013 ◽  
Vol 3 (11) ◽  
pp. 1868-1875 ◽  
Author(s):  
Uttara Sahaym ◽  
Babak Talebanpour ◽  
Sean Seekins ◽  
Indranath Dutta ◽  
Praveen Kumar ◽  
...  
Keyword(s):  
Thermomechanical Treatment ◽  
Solder Alloys

Effect of magnetic field on microstructure and property of Ag-Sn solder alloys

2021 ◽  
pp. 130515
Author(s):  
Yu-qin Wu ◽  
Ze-an Tian ◽  
Fang Liu ◽  
Zi-Hou Yuan ◽  
Chen Wei ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Solder Alloys

scholarly journals Application of ZnO Nanoparticles in Sn99Ag0.3 Cu0.7-Based Composite Solder Alloys

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1545
Author(s):  
Agata Skwarek ◽  
Olivér Krammer ◽  
Tamás Hurtony ◽  
Przemysław Ptak ◽  
Krzysztof Górecki ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Zno Nanoparticles ◽  
Composite Solder ◽  
Void Formation ◽  
Particle Sizes ◽  
Solder Paste ◽  
Solder Alloys ◽  
Ion Microscopy ◽  
Zno Ceramics ◽  
Thermoelectric Parameters

The properties of Sn99Ag0.3Cu0.7 (SACX0307) solder alloy reinforced with ZnO nanoparticles were investigated. The primary ZnO particle sizes were 50, 100, and 200 nm. They were added to a solder paste at a ratio of 1.0 wt %. The wettability, the void formation, the mechanical strength, and the thermoelectric parameters of the composite solder alloys/joints were investigated. Furthermore, microstructural evaluations were performed using scanning electron and ion microscopy. ZnO nanoparticles decreased the composite solder alloys’ wettability, which yielded increased void formation. Nonetheless, the shear strength and the thermoelectric parameters of the composite solder alloy were the same as those of the SACX0307 reference. This could be explained by the refinement effects of ZnO ceramics both on the Sn grains and on the Ag3Sn and Cu6Sn5 intermetallic grains. This could compensate for the adverse impact of lower wettability. After improving the wettability, using more active fluxes, ZnO composite solder alloys are promising for high-power applications.

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