Reduction of High Temperature Thermal Conductivity of Thin-Wall Ceramic Spheres

2009 ◽  
pp. 464-464-12 ◽  
Author(s):  
AT Chapman ◽  
JK Cochran ◽  
TR Ford ◽  
SD Furlong ◽  
DL McElroy
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Thin Wall ◽  
Wall Ceramic

Design Development of High Temperature Manifold Converter Using Thin Wall Ceramic Substrate

1997 ◽  
Author(s):  
K. Umehara ◽  
T. Yamada ◽  
T. Hijikata ◽  
M. Makino ◽  
F. Katsube
Keyword(s):  
High Temperature ◽  
Ceramic Substrate ◽  
Thin Wall ◽  
Design Development ◽  
Wall Ceramic

WIELAND-K88

Alloy Digest ◽  
2005 ◽  
Vol 54 (12) ◽  
Keyword(s):  
Thermal Conductivity ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Stress Relaxation ◽  
Copper Alloy ◽  
Elevated Temperatures ◽  
Heat Treating ◽  
Relaxation Resistance ◽  
Temperature Performance ◽  
Very High

Abstract Wieland K-88 is a copper alloy with very high electrical and thermal conductivity, good strength, and excellent stress relaxation resistance at elevated temperatures. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: CU-738. Producer or source: Wieland Metals Inc.

High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Small ◽  
2021 ◽  
pp. 2102128
Author(s):  
Taehun Kim ◽  
Seongkyun Kim ◽  
Eungchul Kim ◽  
Taesung Kim ◽  
Jungwan Cho ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Trade Off

La2O3 Doped Y2O3 Stabilized ZrO2 TBC Prepared by EB-PVD

2006 ◽  
Vol 317-318 ◽  
pp. 501-504 ◽  
Author(s):  
Mineaki Matsumoto ◽  
Norio Yamaguchi ◽  
Hideaki Matsubara
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
High Resistance ◽  
Thermal Transport ◽  
Temperature Stability ◽  
High Temperature Stability ◽  
Microstructural Observation ◽  
Low Thermal Conductivity ◽  
Ysz Coating

Effect of La2O3 addition on thermal conductivity and high temperature stability of YSZ coating produced by EB-PVD was investigated. La2O3 was selected as an additive because it had a significant effect on suppressing densification of YSZ. The developed coating showed extremely low thermal conductivity as well as high resistance to sintering. Microstructural observation revealed that the coating had fine feather-like subcolumns and nanopores, which contributed to limit thermal transport. These nanostructures were thought to be formed by suppressing densification during deposition.

Thermoelectric Properties of Semiconducting Intermetallic Compounds: FeGa3and RuGa3

2003 ◽  
Vol 793 ◽  
Author(s):  
Y. Amagai ◽  
A. Yamamoto ◽  
C. H. Lee ◽  
H. Takazawa ◽  
T. Noguchi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
High Temperature ◽  
Seebeck Coefficient ◽  
Transport Properties ◽  
Figure Of Merit ◽  
Room Temperature ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
High Seebeck Coefficient

ABSTRACTWe report transport properties of polycrystalline TMGa3(TM = Fe and Ru) compounds in the temperature range 313K<T<973K. These compounds exhibit semiconductorlike behavior with relatively high Seebeck coefficient, electrical resistivity, and Hall carrier concentrations at room temperature in the range of 1017- 1018cm−3. Seebeck coefficient measurements reveal that FeGa3isn-type material, while the Seebeck coefficient of RuGa3changes signs rapidly from large positive values to large negative values around 450K. The thermal conductivity of these compounds is estimated to be 3.5Wm−1K−1at room temperature and decreased to 2.5Wm−1K−1for FeGa3and 2.0Wm−1K−1for RuGa3at high temperature. The resulting thermoelectric figure of merit,ZT, at 945K for RuGa3reaches 0.18.

HPHT synthesis and enhanced TE performance of Te and Sn/Se elements binary-doped CoSb3

2019 ◽  
Vol 12 (01) ◽  
pp. 1850105 ◽  
Author(s):  
Hairui Sun ◽  
Pin Lv ◽  
Chao Wang ◽  
Yunxian Liu ◽  
Xiaopeng Jia ◽  
...  
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
High Pressure ◽  
High Temperature ◽  
Seebeck Coefficient ◽  
Grain Boundaries ◽  
Preparation Methods ◽  
Synthesis Time ◽  
Lattice Disorder ◽  
Positive Effect

A series of binary-doped CoSb3 with Te and Se/Sn bulk compounds Co4Sb[Formula: see text]TexSny/Sey ([Formula: see text] and 0.6, [Formula: see text] and 0.3), have been successfully prepared via a simple high pressure and high-temperature (HPHT) method. And, the influence of the doping elements on the microstructure of the samples synthesized under diverse pressures and the corresponding TE performance were studied in detail. Comparing with other preparation methods, the synthesis time of HPHT was acutely shortened. The obtained samples contain more grain boundaries, lattice disorder, dislocations and the possible “nanodot”, which have positive effect on reducing thermal conductivity. The experimental data indicate that the absolute values of Seebeck coefficient increases with pressure. What’s more, the thermal conductivities show a monotone decreasing trend as the synthesis pressure rises. The minimum value obtained is 1.93[Formula: see text]Wm[Formula: see text]K[Formula: see text] at normal temperature for Co4Sb[Formula: see text]Te[Formula: see text]Se[Formula: see text] prepared under 3[Formula: see text]GPa.

Layered tellurides: stacking faults induce low thermal conductivity in the new In2Ge2Te6 and thermoelectric properties of related compounds

2017 ◽  
Vol 5 (36) ◽  
pp. 19406-19415 ◽  
Author(s):  
Robin Lefèvre ◽  
David Berthebaud ◽  
Oleg Lebedev ◽  
Olivier Pérez ◽  
Célia Castro ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Thermoelectric Properties ◽  
Stacking Faults ◽  
Layered Compound ◽  
Low Thermal Conductivity ◽  
Related Compounds

A new ternary layered compound In2Ge2Te6, belonging to the hexatellurogermanate family has been synthesized from the reaction of appropriate amounts of the pure elements at high temperature in sealed silica tubes.

High temperature thermal conductivity of platinum microwire by 3ω method

2010 ◽  
Vol 81 (11) ◽  
pp. 114904 ◽  
Author(s):  
Rudra P. Bhatta ◽  
Sezhian Annamalai ◽  
Robert K. Mohr ◽  
Marek Brandys ◽  
Ian L. Pegg ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
3Ω Method
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