High temperature thermal conductivity of platinum microwire by 3ω method

2010 ◽  
Vol 81 (11) ◽  
pp. 114904 ◽  
Author(s):  
Rudra P. Bhatta ◽  
Sezhian Annamalai ◽  
Robert K. Mohr ◽  
Marek Brandys ◽  
Ian L. Pegg ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
3Ω Method

High Temperature Thermal Conductivity Measurements of Quasicrystalline Al70.8Pd20.9Mn8.3

2000 ◽  
Vol 626 ◽  
Author(s):  
Philip S. Davis ◽  
Peter A. Barnes ◽  
Cronin B. Vining ◽  
Amy L. Pope ◽  
Robert Schneidmiller ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Radiative Heat ◽  
Accurate Determination ◽  
Fourth Power ◽  
Radiative Effects ◽  
Radiative Heat Loss ◽  
3Ω Method ◽  
Temperature Range

ABSTRACTWe report measurements of the thermal conductivity on a potential high temperature thermoelectric material, the quasicrystal Al70.8Pd20.9Mn8.3. Thermal conductivity is determined over a temperature range from 30 K to 600 K, using both the steady state gradient method and the 3ω method. Measurements of high temperature thermal conductivity are extremely difficult using standard heat conduction techniques. These difficulties arise from the fact that heat is lost due to radiative effects. The radiative effects are proportional to the temperature of the sample to the fourth power and therefore can lead to large errors in the measured thermal conductivity of the sample, becoming more serious as the temperature increases. For thermoelectric applications in the high temperature regime, the thermal conductivity is an extremely important parameter to determine. The 3ω technique minimizes radiative heat loss terms, which will allow for more accurate determination of the thermal conductivity of Al70.8Pd20.9Mn8.3 at high temperatures. The results obtained using the 3ω method are compared to results from a standard bulk-thermal-conductivity-technique on the same samples over the temperature range, 30 K to 300 K.

WIELAND-K88

Alloy Digest ◽  
2005 ◽  
Vol 54 (12) ◽  
Keyword(s):  
Thermal Conductivity ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Stress Relaxation ◽  
Copper Alloy ◽  
Elevated Temperatures ◽  
Heat Treating ◽  
Relaxation Resistance ◽  
Temperature Performance ◽  
Very High

Abstract Wieland K-88 is a copper alloy with very high electrical and thermal conductivity, good strength, and excellent stress relaxation resistance at elevated temperatures. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: CU-738. Producer or source: Wieland Metals Inc.

High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Small ◽  
2021 ◽  
pp. 2102128
Author(s):  
Taehun Kim ◽  
Seongkyun Kim ◽  
Eungchul Kim ◽  
Taesung Kim ◽  
Jungwan Cho ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Trade Off

La2O3 Doped Y2O3 Stabilized ZrO2 TBC Prepared by EB-PVD

2006 ◽  
Vol 317-318 ◽  
pp. 501-504 ◽  
Author(s):  
Mineaki Matsumoto ◽  
Norio Yamaguchi ◽  
Hideaki Matsubara
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
High Resistance ◽  
Thermal Transport ◽  
Temperature Stability ◽  
High Temperature Stability ◽  
Microstructural Observation ◽  
Low Thermal Conductivity ◽  
Ysz Coating

Effect of La2O3 addition on thermal conductivity and high temperature stability of YSZ coating produced by EB-PVD was investigated. La2O3 was selected as an additive because it had a significant effect on suppressing densification of YSZ. The developed coating showed extremely low thermal conductivity as well as high resistance to sintering. Microstructural observation revealed that the coating had fine feather-like subcolumns and nanopores, which contributed to limit thermal transport. These nanostructures were thought to be formed by suppressing densification during deposition.

Thermoelectric Properties of Semiconducting Intermetallic Compounds: FeGa3and RuGa3

2003 ◽  
Vol 793 ◽  
Author(s):  
Y. Amagai ◽  
A. Yamamoto ◽  
C. H. Lee ◽  
H. Takazawa ◽  
T. Noguchi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Electrical Resistivity ◽  
High Temperature ◽  
Seebeck Coefficient ◽  
Transport Properties ◽  
Figure Of Merit ◽  
Room Temperature ◽  
Thermoelectric Figure Of Merit ◽  
Thermoelectric Figure ◽  
High Seebeck Coefficient

ABSTRACTWe report transport properties of polycrystalline TMGa3(TM = Fe and Ru) compounds in the temperature range 313K<T<973K. These compounds exhibit semiconductorlike behavior with relatively high Seebeck coefficient, electrical resistivity, and Hall carrier concentrations at room temperature in the range of 1017- 1018cm−3. Seebeck coefficient measurements reveal that FeGa3isn-type material, while the Seebeck coefficient of RuGa3changes signs rapidly from large positive values to large negative values around 450K. The thermal conductivity of these compounds is estimated to be 3.5Wm−1K−1at room temperature and decreased to 2.5Wm−1K−1for FeGa3and 2.0Wm−1K−1for RuGa3at high temperature. The resulting thermoelectric figure of merit,ZT, at 945K for RuGa3reaches 0.18.

Anisotropic Thermal Conductivity of a Si/Ge Quantum Dot Superlattice

2000 ◽  
Author(s):  
Theodorian Borca-Tasciuc ◽  
Weili Liu ◽  
Jianlin Liu ◽  
Kang L. Wang ◽  
Gang Chen
Keyword(s):  
Thermal Conductivity ◽  
Quantum Dots ◽  
Molecular Beam ◽  
Conductivity Measurements ◽  
Transport Models ◽  
3Ω Method ◽  
Superlattice Structure ◽  
Anisotropic Thermal Conductivity ◽  
Ge Quantum Dot

Abstract In this work, we present experimental results on the in-plane and cross-plane thermal conductivity characterization of a Si/Ge quantum-dots superlattice structure. The quantum-dots superlattice was grown by molecular-beam-epitaxy and self-organization. The anisotropic thermal conductivity measurements are performed by a differential two-wire 3ω method. The measured in-plane and cross-plane thermal conductivity values show a different temperature behavior. The results are compared and explained with heat transport models in superlattices.

HPHT synthesis and enhanced TE performance of Te and Sn/Se elements binary-doped CoSb3

2019 ◽  
Vol 12 (01) ◽  
pp. 1850105 ◽  
Author(s):  
Hairui Sun ◽  
Pin Lv ◽  
Chao Wang ◽  
Yunxian Liu ◽  
Xiaopeng Jia ◽  
...  
Keyword(s):  
Experimental Data ◽  
Thermal Conductivity ◽  
High Pressure ◽  
High Temperature ◽  
Seebeck Coefficient ◽  
Grain Boundaries ◽  
Preparation Methods ◽  
Synthesis Time ◽  
Lattice Disorder ◽  
Positive Effect

A series of binary-doped CoSb3 with Te and Se/Sn bulk compounds Co4Sb[Formula: see text]TexSny/Sey ([Formula: see text] and 0.6, [Formula: see text] and 0.3), have been successfully prepared via a simple high pressure and high-temperature (HPHT) method. And, the influence of the doping elements on the microstructure of the samples synthesized under diverse pressures and the corresponding TE performance were studied in detail. Comparing with other preparation methods, the synthesis time of HPHT was acutely shortened. The obtained samples contain more grain boundaries, lattice disorder, dislocations and the possible “nanodot”, which have positive effect on reducing thermal conductivity. The experimental data indicate that the absolute values of Seebeck coefficient increases with pressure. What’s more, the thermal conductivities show a monotone decreasing trend as the synthesis pressure rises. The minimum value obtained is 1.93[Formula: see text]Wm[Formula: see text]K[Formula: see text] at normal temperature for Co4Sb[Formula: see text]Te[Formula: see text]Se[Formula: see text] prepared under 3[Formula: see text]GPa.

Sign in / Sign up

Export Citation Format

Share Document