Hygrothermal Effects on Failure Mechanisms of Composite/Steel Bonded Joints

2008 ◽  
pp. 353-353-19 ◽  
Author(s):  
A Roy ◽  
E Gontcharova-Bénard ◽  
J-L Gacougnolle ◽  
P Davies
Keyword(s):  
Failure Mechanisms ◽  
Bonded Joints ◽  
Composite Steel

Interfacial Fracture Analysis of Adhesive-Bonded Joints

2008 ◽  
Vol 33-37 ◽  
pp. 327-332 ◽  
Author(s):  
Won Seock Kim ◽  
Jung Ju Lee
Keyword(s):  
Fracture Toughness ◽  
Fracture Mechanics ◽  
Adhesion Strength ◽  
Interfacial Fracture ◽  
Lap Joints ◽  
Bonded Joints ◽  
Load Bearing ◽  
Interfacial Fracture Mechanics ◽  
Adhesive Bonded Joints ◽  
Composite Steel

The failure in an adhesive-bonded structure starts at the interface, and the interfacial fracture is of interest whenever adhesion between different materials is concerned. One of primary factors limiting the application of adhesive-bonded joints to structural design is the lack of a good evaluation tool for adhesion strength to predict the load-bearing capacity of boned joints. The adhesion strength of composite/steel bonding has been evaluated using interfacial fracture mechanics characterization. The energy release rate of a composite/steel interfacial crack was compared with the fracture toughness of the interface, which was measured from bi-material end notched flexure (ENF) specimens, to predict the failure loads of bi-material lap joints. Fracture toughness, IIc G , was regarded as a property of the interface rather than a property of the adhesive. The results show that interfacial fracture mechanics characterization of adhesion strength can be a practical engineering tool for predicting the load-bearing capacities of adhesive-bonded joints.

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

Real-time cryo-deformation of polypropylene and impact-modified polypropylene in the transmission electron microscope

1993 ◽  
Vol 51 ◽  
pp. 892-893
Author(s):  
Robert C. Cieslinski ◽  
H. Craig Silvis ◽  
Daniel J. Murray
Keyword(s):  
Electron Microscope ◽  
Transmission Electron Microscope ◽  
Failure Mechanisms ◽  
Brittle Transition ◽  
Molded Part ◽  
Transmission Electron ◽  
Solvent Cast ◽  
The Impact ◽  
Annealed Copper ◽  
Dynamic Plane

An understanding of the mechanical behavior polymers in the ductile-brittle transition region will result in materials with improved properties. A technique has been developed that allows the realtime observation of dynamic plane stress failure mechanisms in the transmission electron microscope. With the addition of a cryo-tensile stage, this technique has been extented to -173°C, allowing the observation of deformation during the ductile-brittle transition.The technique makes use of an annealed copper cartridge in which a thin section of bulk polymer specimen is bonded and plastically deformed in tension in the TEM using a screw-driven tensile stage. In contrast to previous deformation studies on solvent-cast films, this technique can examine the frozen-in morphology of a molded part.The deformation behavior of polypropylene and polypropylene impact modified with EPDM (ethylene-propylene diene modified) and PE (polyethylene) rubbers were investigated as function of temperature and the molecular weight of the impact modifier.

Nonlinear Viscoelastic Finite Element Analysis of Adhesive Joints

1988 ◽  
Vol 16 (3) ◽  
pp. 146-170 ◽  
Author(s):  
S. Roy ◽  
J. N. Reddy
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Viscoelastic Behavior ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Element Analysis ◽  
Adhesively Bonded Joints ◽  
Nonlinear Viscoelastic ◽  
Structural Failures ◽  
Updated Lagrangian

Abstract A good understanding of the process of adhesion from the mechanics viewpoint and the predictive capability for structural failures associated with adhesively bonded joints require a realistic modeling (both constitutive and kinematic) of the constituent materials. The present investigation deals with the development of an Updated Lagrangian formulation and the associated finite element analysis of adhesively bonded joints. The formulation accounts for the geometric nonlinearity of the adherends and the nonlinear viscoelastic behavior of the adhesive. Sample numerical problems are presented to show the stress and strain distributions in bonded joints.

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