Nonlinear Viscoelastic Finite Element Analysis of Adhesive Joints

1988 ◽  
Vol 16 (3) ◽  
pp. 146-170 ◽  
Author(s):  
S. Roy ◽  
J. N. Reddy
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Viscoelastic Behavior ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Element Analysis ◽  
Adhesively Bonded Joints ◽  
Nonlinear Viscoelastic ◽  
Structural Failures ◽  
Updated Lagrangian

Abstract A good understanding of the process of adhesion from the mechanics viewpoint and the predictive capability for structural failures associated with adhesively bonded joints require a realistic modeling (both constitutive and kinematic) of the constituent materials. The present investigation deals with the development of an Updated Lagrangian formulation and the associated finite element analysis of adhesively bonded joints. The formulation accounts for the geometric nonlinearity of the adherends and the nonlinear viscoelastic behavior of the adhesive. Sample numerical problems are presented to show the stress and strain distributions in bonded joints.

FEA of Fatigue Behaviour of Adhesively Bonded Joints

2010 ◽  
Vol 148-149 ◽  
pp. 753-757 ◽  
Author(s):  
Xiao Cong He
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Speed ◽  
Adhesive Bonding ◽  
Fatigue Behaviour ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Element Analysis ◽  
Adhesively Bonded Joints ◽  
Major Factors

Adhesive bonding is a high-speed fastening method which is suitable for joining advanced lightweight sheet materials that are hard to weld. Latest literature relating to finite element analysis (FEA) of fatigue behaviour of adhesively bonded joints is reviewed in this paper. The recent development in FEA of fatigue behaviour of adhesively bonded joints is described with particular reference to three major factors that influence the fatigue behaviour of adhesively bonded joints: failure mechanism, environmental effects and hybrid joining techniques. The main FE methods used in FEA of fatigue behaviour of adhesively bonded joints are discussed and illustrated with brief case studies from the literature.

Research Progress on Finite Element Analysis Methods for Bonded Joints at Different Strain Rates

2014 ◽  
Vol 1049-1050 ◽  
pp. 892-900
Author(s):  
Zhe Min Jia ◽  
Guo Qing Yuan ◽  
David Hui
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Element Analysis ◽  
Adhesively Bonded Joints ◽  
Analysis Methods

Adhesive bonding is one of the effective ways to reduce the weight of structures. Researchers have done lots of numerical analysis and finite element analysis taking into account of the complex stress state in the bonded area, as well as the stress singularity occurs at the overlap edges with a view to efficiently predict the strength and rigidity of adhesively bonded joints. As they may suffer shock or impact loads in practice which leads to high strain rate in structures, analysis methods for adhesively bonded joints differ from that at quasi-static condition for two reasons: one is the mechanical properties of materials, including adhesives and substrates are different at high strain rates, the other is the additional consideration of elastic wave propagation in solid body. This article summaries several finite element analysis methods for adhesively bonded joints at high strain rate developed by domestic and foreign scholars and corresponding experimental standards for determining required parameters of each analytical method and raised some questions that need for further study.

3-D Finite Element Analysis of Bonded Joints under Impact Loading

2010 ◽  
Vol 97-101 ◽  
pp. 763-766 ◽  
Author(s):  
Min You ◽  
Jia Ling Yan ◽  
Xiao Ling Zheng ◽  
Ding Feng Zhu ◽  
Jing Rong Hu
Keyword(s):  
Finite Element ◽  
Elastic Modulus ◽  
Impact Loading ◽  
Bonded Joints ◽  
Lower Edge ◽  
Adhesively Bonded ◽  
Element Analysis ◽  
Adhesively Bonded Joints ◽  
Stress Components ◽  
Adhesive Thickness

The effect of the adhesive thickness and elastic modulus on the stress distribution in the mid-bondline of the adhesively-bonded steel/steel joint under impact loading is analyzed using 3-D finite element method (FEM). The results show that the stress distributed in bondline near the interface was significantly affected by the adhesive thickness and the elastic modulus. When the thickness increased from 1 mm to 2 mm, the values of all the stress components increased evidently along the upper edge of the adhesive but decreased significantly along the lower edge near the loading face. When the elastic modulus of the adhesive was increased, all the stresses increased along either the upper or the lower edge. It is clear that the suitable thickness and the elastic modulus of the adhesive are very important when the adhesively bonded joints subjected to the impacting load.

Control of Void Formation in Adhesively Bonded Joints in the Presence of Filler

2020 ◽  
Vol 2020 (1) ◽  
pp. 000246-000258
Author(s):  
Nina S. Dytiuk ◽  
Thomas F. Marinis ◽  
Joseph W. Soucy
Keyword(s):  
Finite Element ◽  
Open Source ◽  
Void Formation ◽  
Adhesive Joints ◽  
Bonded Joints ◽  
Volatile Species ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Open Source Program ◽  
Source Program

Abstract Adhesively bonded joints are ubiquitous in electronic assemblies that are used in a wide range of applications, which include automotive, medical, military, space and communications. The steady drive to reduce the size of assemblies in all of these applications, while providing increased functionality, generates a need for adhesive joints of higher strength, improved thermal and electrical conductivity and better dielectric isolation. All of these attributes of adhesive joints are degraded by the presence of voids in them. The quest to minimize voids in bonded structures motivated a previous study of their formation in a solvent cast, die bond epoxy film, which undergoes a liquid phase transition during cure. That work is extended in this study by including the effects of various filler morphologies in the adhesive. Fillers are added to adhesives to facilitate handling of thin sheet formats, control bond line thickness and reduce coefficient of thermal expansion. As such, fillers are selected to be inert with respect to the adhesive chemistry, while being readily wetted by it in the liquid state. Common filler morphologies include woven and molded open meshes, fibers chopped to uniform length, and spheres of uniform or distributed diameters. Void formation is influenced by a number factors, which include wettability of the bonded surfaces, adsorbed water, amount of solvent retained in the film, volume of entrapped air, thermal profile of the cure schedule, and clamping pressure during cure. The presence of fillers in the adhesive adds the additional factors of constrained diffusion paths and increased area for void nucleation. We have changed our approach to modeling the diffusion of volatile species in adhesive joints from a finite difference calculation in a uniform adhesive medium used previously, to a finite element model of a complex diffusion space. The open source program Gmsh is used to generate the diffusion space from a set of input parameters. The calculations of concentration profiles and diffusion fluxes of volatile species at the void interface are made using the open source finite element program elmer. As done previously, the position of the void interface is updated by integrating the product of time and flux of diffusing species over the area of the interface. The internal pressure of the void is determined by application of the Young-Laplace equation, while Henry’s law is used to estimate the concentration of diffusing species adjacent to the void interface. The calculation proceeds for a time equivalent to the integral of the time temperature product required to achieve a 70% cure state of the adhesive, at which point the void interface is immobile. The experimental approach is the same as used previously, with the filled adhesive sandwiched between glass slides and cured on a hot plate while imaged through a microscope. Images are automatically captured and analyzed by using the open source program imageJ, which allows us to track the evolution of individual voids as well as the time dependent distribution of the void population. We are working to correlate these experimental results with the predictions of our finite element calculations to allow us to make insightful choices of adhesives and optimize our bonding processes.

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