Microstructure Evolution and Thermomechanical Fatigue Life of Solder Joints

2009 ◽  
pp. 786-786-16
Author(s):  
B Goldstein ◽  
KL Jerina ◽  
SML Sastry
Keyword(s):  
Fatigue Life ◽  
Microstructure Evolution ◽  
Solder Joints ◽  
Thermomechanical Fatigue

Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints

2017 ◽  
Vol 47 (3) ◽  
pp. 1881-1895 ◽  
Author(s):  
Yong Zuo ◽  
Thomas R. Bieler ◽  
Quan Zhou ◽  
Limin Ma ◽  
Fu Guo
Keyword(s):  
Solder Joints ◽  
Fatigue Behavior ◽  
Thermomechanical Fatigue

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

2021 ◽  
Author(s):  
Tae-Yong Park ◽  
Hyun-Ung Oh
Keyword(s):  
Fatigue Life ◽  
Random Vibration ◽  
Critical Strain ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Mechanical Design ◽  
Ball Grid Array ◽  
Primary Objective ◽  
Circuit Board ◽  
Analytical Approaches

Abstract To overcome the theoretical limitations of Steinberg's theory for evaluating the mechanical safety of the solder joints of spaceborne electronics in a launch random vibration environment, a critical strain-based methodology was proposed and validated in a previous study. However, for the critical strain-based methodology to be used reliably in the mechanical design of spaceborne electronics, its effectiveness must be validated under various conditions of the package mounting locations and the first eigenfrequencies of a printed circuit board (PCB); achieving this validation is the primary objective of this study. For the experimental validation, PCB specimens with ball grid array packages mounted on various board locations were fabricated and exposed to a random vibration environment to assess the fatigue life of the solder joint. The effectiveness of the critical strain-based methodology was validated through a comparison of the fatigue life of the tested packages and their margin of safety, which was estimated using various analytical approaches.

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