A Tension-Compression Test Fixture to Determine Bauschinger Effect

1973 ◽  
Vol 1 (4) ◽  
pp. 288 ◽  
Author(s):  
SF Etris ◽  
KC Lieb ◽  
VK Sisca ◽  
IC Moore ◽  
AL Batik ◽  
...  
Keyword(s):  
Compression Test ◽  
Bauschinger Effect ◽  
Test Fixture

Characterization of the Cohesive Strengths of Environmental Barrier Coatings to Ceramic Substrates Using Compression Tests

2002 ◽  
Author(s):  
Shanti V. Nair ◽  
Harry E. Eaton ◽  
Ellen Y. Sun ◽  
Greg C. Ojard
Keyword(s):  
Compression Test ◽  
Standard Test ◽  
Test Method ◽  
Compression Tests ◽  
Ceramic Substrates ◽  
Barrier Coatings ◽  
Test Fixture ◽  
Environmental Barrier Coatings ◽  
Environmental Barrier

The cohesive strengths of environmental barrier coatings applied to silicon carbide substrates were characterized using a compression test containing a strip of coating along a portion of the gage length. The substrate sample design and test fixture are similar to that described in ASTM D 695-96. The theory needed to extract the cohesive/adhesive strengths from the data is presented. The results of the compression tests are compared to the standard test method for the determination of the cohesive/adhesive strengths by the tension-adhesion test (TAT) (ASTM C 633-79). The preliminary results indicate that the onset of failure in the compression tests can be correlated with TAT test results, allowing for the extraction of the cohesive strength of the coating. For this system, this strength was found to be 15–20 MPa. The compression test has the advantage that it can be conducted at elevated temperature without the use of adhesives and, furthermore, is not limited by the adhesive strengths of polymeric adhesives.

A New Compression Test Fixture for Unnotched or Notched Thin Composite Laminates

2000 ◽  
Vol 22 (3) ◽  
pp. 136 ◽  
Author(s):  
WS Johnson ◽  
JE Masters ◽  
DW Wilson ◽  
JD Bardis ◽  
KT Kedward ◽  
...  
Keyword(s):  
Compression Test ◽  
Composite Laminates ◽  
Test Fixture

Multiple recycling of paperboard: Paperboard characteristics and maximum number of recycling cycles— Part I: Multiple recycling of corrugated base paper

TAPPI Journal ◽  
2019 ◽  
Vol 18 (11) ◽  
pp. 631-638
Author(s):  
FREDERIC KREPLIN ◽  
HANS-JOACHIM PUTZ ◽  
SAMUEL SCHABEL
Keyword(s):  
Compression Test ◽  
Production Capacity ◽  
Strength Properties ◽  
Paper Properties ◽  
Corrugated Board ◽  
Laboratory Conditions ◽  
Base Paper ◽  
Study Results ◽  
Short Span ◽  
Multiple Recycling

Paper for recycling is an important fiber source for the production of corrugated base paper. The change in production capacity toward more and more packaging papers affects the composition of paper for recycling and influences the paper quality. This research project investigated the influence of the multiple recycling of five different corrugated base papers (kraftliner, neutral sulfite semichemical [NSSC] fluting, corrugating medium, testliner 2, and testliner 3) on suspension and strength properties under laboratory conditions. The corrugated board base papers were repulped in a low consistency pulper and processed into Rapid-Köthen laboratory sheets. The sheets were then recycled up to 15 times in the same process. In each cycle, the suspension and the paper properties were recorded. In particular, the focus was on corrugated board-specific parameters, such as short-span compression test, ring crush test, corrugating medium test, and burst. The study results indicate how multiple recycling under laboratory conditions affects fiber and paper properties.

Enabling Electro-Optical Failure Analysis within Extreme Compression Test Architecture

2016 ◽  
Author(s):  
Rudolf Schlangen ◽  
Jon Colburn ◽  
Joe Sarmiento ◽  
Bala Tarun Nelapatla ◽  
Puneet Gupta
Keyword(s):  
Failure Analysis ◽  
Compression Test ◽  
Test Pattern ◽  
Pattern Generation ◽  
Output Data ◽  
Test Compression ◽  
Test Loop ◽  
On Chip ◽  
Test Architecture

Abstract Driven by the need for higher test-compression, increasingly many chip-makers are adopting new DFT architectures such as “Extreme-Compression” (XTR, supported by Synopsys) with on-chip pattern generation and MISR based compression of chain output data. This paper discusses test-loop requirements in general and gives Advantest 93k specific guidelines on test-pattern release and ATE setup necessary to enable the most established EFA techniques such as LVP and SDL (aka DLS, LADA) within the XTR test architecture.

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