Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness

10.1520/f1894 ◽  
2020 ◽  
Author(s):  
Keyword(s):  
Test Method ◽  
Tungsten Silicide ◽  
Semiconductor Process

TEM characterization of WSix films

1994 ◽  
Vol 52 ◽  
pp. 848-849
Author(s):  
V. C. Kannan ◽  
S. M. Merchant ◽  
R. B. Irwin ◽  
A. K. Nanda ◽  
M. Sundahl ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Vapor Deposition ◽  
High Purity ◽  
Physical Vapor Deposition ◽  
Thermal Treatments ◽  
Rapid Thermal Anneal ◽  
Tungsten Silicide ◽  
Tem Characterization ◽  
Metal Silicides

Metal silicides such as WSi2, MoSi2, TiSi2, TaSi2 and CoSi2 have received wide attention in recent years for semiconductor applications in integrated circuits. In this study, we describe the microstructures of WSix films deposited on SiO2 (oxide) and polysilicon (poly) surfaces on Si wafers afterdeposition and rapid thermal anneal (RTA) at several temperatures. The stoichiometry of WSix films was confirmed by Rutherford Backscattering Spectroscopy (RBS). A correlation between the observed microstructure and measured sheet resistance of the films was also obtained.WSix films were deposited by physical vapor deposition (PVD) using magnetron sputteringin a Varian 3180. A high purity tungsten silicide target with a Si:W ratio of 2.85 was used. Films deposited on oxide or poly substrates gave rise to a Si:W ratio of 2.65 as observed by RBS. To simulatethe thermal treatments of subsequent processing procedures, wafers with tungsten silicide films were subjected to RTA (AG Associates Heatpulse 4108) in a N2 ambient for 60 seconds at temperatures ranging from 700° to 1000°C.

Metrological support of individual blood glucose meters in telemedicine

2019 ◽  
pp. 52-56
Author(s):  
Yu.F. Glukhov ◽  
N.V. Krutikov ◽  
A.V. Ivanov ◽  
N.P. Muravskaya
Keyword(s):  
Blood Glucose ◽  
Blood Glucose Level ◽  
Glucose Level ◽  
Measurement Data ◽  
Test Method ◽  
Level Measurement ◽  
Measurement Devices ◽  
Real Practice ◽  
Health Care Centers ◽  
Medical Measurement

We have studied and analyzed status and metrological supervision of blood glucose monitors, individual devices for a person’s blood glucose level measurement. It has been indicated that nowadays blood glucose monitors like other individual devices for medical measurement are not allowed to be involved in telemedicine public service. This accounts for absence of metrological supervision with these measurement devices in telemedicine. In addition, the key problem is absence of safe methods and means of remote verificaition, calibration and transmission of measurement data to health care centers. The article offers a remote test method for blood glucose monitors using a number of resistors with values correlating with measured blood glucose level. The available method has been successfully trialed in real practice.

Customer’s satisfaction on service quality at Vietnam Technological and Commercial Joint Stock Bank – An Giang Branch

2020 ◽  
Vol 4 (3) ◽  
pp. First
Author(s):  
Tran Minh Hieu ◽  
Nguyen Duong Ngoc Mai Chi
Keyword(s):  
Customer Satisfaction ◽  
Service Quality ◽  
Test Method ◽  
Quality Of Services ◽  
Factors Affecting ◽  
Factors Influencing ◽  
Alpha Reliability ◽  
Survey Results ◽  
Development Orientation

This study applied SERVQUAL scale of Parasuraman et al to measure factors affecting customer satisfaction on service quality at Vietnam Technological and Commercial Joint Stock Bank - An Giang Branch (Techcombank An Giang). The study was conducted to survey 207 customers who have been using the service at Techcombank An Giang. The survey results were analyzed by the Cronbach's Alpha reliability test method, then used Exploratory factor analysis (EFA) to verify and evaluate the scale of service quality. The results of the regression analysis show that customer's satisfaction about service quality at Techcombank An Giang includes four factors: The factor with the highest level is the Empathy with Beta = 0.253, the second of factor is the Responsibility with Beta = 0.248, ranked third in the influence level is the Tangible with Beta = 0.235, and the lowest impact level is the Reliability with Beta = 0.144. The research also uses statistical methods to describe and test the differences of demographic factors with customer's satisfactionon service quality.The analysis results show that there is no difference between customer's satisfaction on service quality and factors such as gender, age, income, number of transaction banks, regular transaction banks, and time to use the service at Techcombank An Giang. Through the research results, the author would like to propose some ideas to improve the quality of services, thereby attracting new customers and importantly, keeping traditional customers because the development orientation of Techcombank is to take care of old customers to cross sell other products of the bank. The Stud results offer a basis for the branch to identify the factors influencing customer satisfaction on their service quality, thereby having an appropriate strategy to improve customer satisfaction.

An evaluation of ECT sample height for small flute board grades and Box Manufacturer’s Certification compliance

TAPPI Journal ◽  
2009 ◽  
Vol 8 (6) ◽  
pp. 24-28
Author(s):  
CORY JAY WILSON ◽  
BENJAMIN FRANK
Keyword(s):  
Compressive Strength ◽  
Compressive Load ◽  
Test Sample ◽  
Test Methods ◽  
Test Method ◽  
Initial Development ◽  
Sample Height ◽  
Relationship Of ◽  
The Relationship ◽  
Corrugated Fiberboard

TAPPI test T811 is the specified method to ascertain ECT relative to box manufacturer’s certification compliance of corrugated fiberboard under Rule 41/ Alternate Item 222. T811 test sample heights were derived from typical board constructions at the time of the test method’s initial development. New, smaller flute sizes have since been developed, and the use of lighter weight boards has become more common. The T811 test method includes sample specifications for typical A-flute, B-flute, and C-flute singlewall (and doublewall and triplewall) structures, but not for newer thinner E-flute or F-flute structures. This research explores the relationship of ECT sample height to measured compressive load, in an effort to determine valid E-flute and F-flute ECT sample heights for use with the T811 method. Through this process, it identifies challenges present in our use of current ECT test methods as a measure of intrinsic compressive strength for smaller flute structures. The data does not support the use of TAPPI T 811 for ECT measurement for E and F flute structures, and demonstrates inconsistencies with current height specifi-cations for some lightweight B flute.

Evaluating hardness and the S-test

TAPPI Journal ◽  
2019 ◽  
Vol 18 (3) ◽  
pp. 161-169
Author(s):  
Doug Cash ◽  
Benjamin Frank
Keyword(s):  
North American ◽  
Test Method ◽  
Load Curve ◽  
Permanent Damage ◽  
Additional Load ◽  
The North ◽  
Complete Failure

The corrugated industry typically quantifies crush resistance using the Concora corrugated medium test (CMT) on fluted medium or flat crush on combined board. These tests compress the materials until the point of complete failure of the flutes. Combined board elastically resists crushing forces until a certain point, the hardness of the structure, while additional load causes permanent damage and deformation. This study investigates how hardness can be measured directly from a load curve collected during CMT (or flat crush) testing and how it varies throughout the North American paper supply. It also explores how hardness correlates with the values obtained from the newly developed S-test. This new test method deserves further study as a potentially more appropriate specification for crush resistance of corrugated medium.

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