Elasto-plastic analysis and finite element simulation of thick-walled functionally graded cylinder subjected to combined pressure and thermal loading

2017 ◽  
Vol 24 (4) ◽  
pp. 609-620 ◽  
Author(s):  
Shahryar Alikarami ◽  
Ali Parvizi
Keyword(s):  
Finite Element ◽  
Finite Element Simulation ◽  
Thermal Loading ◽  
Functionally Graded ◽  
Combined Loading ◽  
Plastic Behavior ◽  
Graded Materials ◽  
Perfectly Plastic ◽  
Element Simulation ◽  
Elastic Perfectly Plastic

AbstractAn exact analytical elasto-plastic solution for thick-walled cylinder made of functionally graded materials (FGMs) subjected to combined pressure and thermal loading is presented in this paper. It is assumed that the cylinder is bonded at both ends, the material is radially graded and complies with the elastic perfectly plastic behavior. The relations in determining the plastic zone radius as well as the radial, circumferential, longitudinal and effective stresses in both elastic and plastic zones are obtained for any combined loading condition. Moreover, using ABAQUS/Explicit software, the functionally graded (FG) cylinder is simulated in every respect. Comparison of the present theoretical results with those from a finite element simulation illustrates the accuracy of the present analysis.

Plastic Limit Loads for Through-Wall Cracked Pipes Using Finite Element Limit Analysis

2006 ◽  
Vol 321-323 ◽  
pp. 724-728
Author(s):  
Nam Su Huh ◽  
Yoon Suk Chang ◽  
Young Jin Kim
Keyword(s):  
Finite Element ◽  
Limit Analysis ◽  
Structural Integrity ◽  
Three Dimensional ◽  
Limit Load ◽  
Plastic Behavior ◽  
Plastic Limit ◽  
Integrity Assessment ◽  
Perfectly Plastic ◽  
Elastic Perfectly Plastic

The present paper provides plastic limit load solutions for axial and circumferential through-wall cracked pipes based on detailed three-dimensional (3-D) finite element (FE) limit analysis using elastic-perfectly plastic behavior. As a loading condition, both single and combined loadings are considered. Being based on detailed 3-D FE limit analysis, the present solutions are believed to be valuable information for structural integrity assessment of cracked pipes.

Effects of Imperfections on Bifurcation of Multi-Layer Microstructures of MEMS under Thermal Loading

2007 ◽  
Vol 339 ◽  
pp. 276-280
Author(s):  
Y.T. Yu ◽  
Wei Zheng Yuan ◽  
D.Y. Qiao
Keyword(s):  
Finite Element ◽  
Thermal Expansion ◽  
Finite Element Simulation ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Element Simulation ◽  
Simulation Results ◽  
Structural Bifurcation

Bifurcation of multi-layer microstructures subjected to thermal loading can be harmful for reliability and stability of MEMS structures. In this paper, three imperfections of geometry, coefficient of thermal expansion and thermal loading were introduced to investigate their effects on structural bifurcation by finite element simulation. Results show that bifurcation is strongly influenced by the imperfections. With larger deviation of imperfections, it results in a decreasing temperature to trigger the bifurcation and a gradual beginning of it.

Elasto-Plastic Finite Element Analyses of Two-Dimensional Rolling and Sliding Contact Deformation of Bearing Steel

1989 ◽  
Vol 111 (2) ◽  
pp. 309-314 ◽  
Author(s):  
A. M. Kumar ◽  
G. T. Hahn ◽  
V. Bhargava ◽  
C. Rubin
Keyword(s):  
Finite Element ◽  
Rail Steel ◽  
Kinematic Hardening ◽  
High Hardness ◽  
High Strength ◽  
Bearing Steel ◽  
Sliding Contact ◽  
Plastic Behavior ◽  
Perfectly Plastic ◽  
Elastic Perfectly Plastic

In the past, the mechanics of repeated rolling and sliding contact could only be treated for the idealized, elastic-perfectly-plastic (and isotropic) cyclic materials behavior, albeit approximately. They have not proven useful because the real cyclic plastic behavior of contacting materials is anything but perfectly plastic or isotropic. Using finite element methods, the authors have developed techniques for treating elastic-linear-kinematic hardening-plastic (ELKP) behavior, an idealization that comes much closer to the behavior of low, medium, and high hardness steels. In an earlier paper, the authors have examined rolling and sliding on rail steel, which is much softer than hardened bearing steel and displays quite different ELKP properties. The present paper offers the first results for repeated rolling and sliding for high strength bearing steel ELKP behavior and material properties.

Reliability assessment of ball grid array joints under combined application of thermal and power cycling: solder geometry effect

2020 ◽  
Vol 33 (1) ◽  
pp. 27-33
Author(s):  
Sathish Kumar ◽  
Oleg R. Kuzichkin ◽  
Ahmed Faisal Siddiqi ◽  
Inna Pustokhina ◽  
Aleksandr Yu Krasnopevtsev
Keyword(s):  
Finite Element ◽  
Finite Element Simulation ◽  
Thermal Loading ◽  
Thermal Power ◽  
Electronic System ◽  
Operating Conditions ◽  
Simultaneous Application ◽  
Content Type ◽  
Power Cycling ◽  
Element Simulation

Purpose This study aims to investigate simultaneous power and thermal loading. Design/methodology/approach Finite element method simulations coupled with experiments. Findings The effects of power cycling have been determined. Originality/value This paper aims to testify the combined effects of thermal and power cycling loads on the reliability of solder ball joints with barrel- and hourglass-type geometries in an electronic system. The finite element simulation outcomes showed that the maximum strain energy was accumulated at the edges of barrel-type solder, whereas the hourglass-type was vulnerable at the necking side. It was also found that the hourglass-type solder showed a reliable behavior when the sole thermal cycling was exerted to the electronic system, whereas the barrel-type solder was a better choice under simultaneous application of thermal and power loadings. The experimental results also confirmed the finite element simulation and indicated that the solder joint reliability strongly depends on the geometry of interconnection in different operating conditions. An extensive discussion was presented to shed light on the paramount importance of combined thermal/power cycling on the reliability of solder joints.

Sign in / Sign up

Export Citation Format

Share Document