Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate

2013 ◽  
Vol 20 (4) ◽  
pp. 301-306 ◽  
Author(s):  
Her-Yueh Huang ◽  
Chung-Wei Yang ◽  
Sian-Ze Pan
Keyword(s):  
Carbon Nanotube ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Multiwalled Carbon Nanotube ◽  
Lead Free ◽  
Intermetallic Compound Layer ◽  
Lead Free Solder ◽  
Multiwalled Carbon ◽  
Free Solder

AbstractIn this work, contact angle, spreading area, and isothermal aging tests were conducted to study the difference between Sn-3Ag-0.5Cu lead-free solder and its composite solder at different multiwalled carbon nanotube reinforcement volume fractions. The material interaction between the solder and the substrate at different aging temperatures and times was investigated using scanning electron microscopy elemental analysis. The experimental results indicated that the composite solder had a lower contact angle as well as good spreading area. An intermetallic compound layer was found between the solder and the copper substrate, and the thickness of this reaction layer increased with increasing aging temperature and time. Meanwhile, the intermetallic compound layer of multiwalled carbon nanotube reinforcement composite solder was thicker than that of the Sn-3Ag-0.5Cu lead-free solder. The composite solder with 0.1 vol% multiwalled carbon nanotube reinforcement addition exhibited better comprehensive properties than composite solders with other reinforcement volume fractions.

Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 546-550 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Contact Angle ◽  
Intermetallic Compound ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Solder Paste ◽  
X Ray Diffraction ◽  
Free Solder ◽  
Sic Particle

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.

Morphology and Intermetallic Study of (Sn-8Zn-3Bi)-1Ni Solder under Liquid State Aging

2015 ◽  
Vol 1087 ◽  
pp. 162-166
Author(s):  
Nor Aishah Jasli ◽  
Hamidi Abd Hamid ◽  
Ramani Mayappan
Keyword(s):  
Liquid State ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Time ◽  
Intermetallic Formation ◽  
X Ray ◽  
Ni Addition ◽  
Free Solder ◽  
Scanning Electron

This study investigated the effect of Ni addition on intermetallic formation in the Sn-8Zn-3Bi solder under liquid state aging. The intermetallic compounds were formed by reacting the solder alloy with copper substrate. Different reflow time was used at temperature 220°C. Morphology of the phases formed was observed using scanning electron microscope (SEM) and in order to determine elemental compositions of the phases, energy dispersive x-ray (EDX) was used. The formation of the reaction layer led by Cu5Zn8 intermetallic and then followed by Cu6Sn5 and Cu3Sn when reflow time increases. Keywords: lead free solder, intermetallic, Cu5Zn8, Cu6Sn5, liquid state aging.

scholarly journals Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder

2005 ◽  
Vol 41 (Extra) ◽  
pp. 208-212
Author(s):  
D. Soares ◽  
C. Vilarinho ◽  
J. Barbosa ◽  
R. Silva ◽  
F. Castro
Keyword(s):  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Bismuth Content ◽  
Interface Reactions ◽  
Free Solder

Design of Experiment (DOE) of Powder Metallurgy Technique in Fabricating SnCu/Carbon Lead-Free Composite Solder with Different Mixing Parameters

2014 ◽  
Vol 803 ◽  
pp. 269-272
Author(s):  
Sayyidah Amnah Musa ◽  
Norainiza Saud
Keyword(s):  
Powder Metallurgy ◽  
High Performance ◽  
Composite Solder ◽  
Mixing Time ◽  
Physical And Mechanical Properties ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Best Parameter ◽  
Free Solder

Physical and mechanical properties of a solder joint will be improved by adding the high performance of reinforcement particulates in the monolithic lead-free solder. In this study, 0.1wt% of activated carbon (AC) was added into Sn-0.7Cu lead-free solder which fabricated via powder metallurgy (PM) techniques. Various parameters used in PM technique such as mixing time, compacting load and sintering temperature has been carried out in fabricating the composite solder. In this study, the best mixing time has been optimized. The distribution of carbon in SnCu matrix for each mixing time was observed by using optical microscope. Microstructural observation showed that the increasing in mixing time has increased the number of AC particles to become agglomerated. It is found out that 1hour of mixing time is the best parameter to fabricate SnCu/AC composite solder via powder metallurgy route since the distribution of reinforcement particles has distributed uniformly at the grain boundaries without any agglomeration.

Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls

2013 ◽  
Author(s):  
Akihiro Hirata ◽  
Ikuo Shohji ◽  
Tetsuyuki Tsuchida ◽  
Toshikazu Ookubo
Keyword(s):  
Shear Force ◽  
Lead Free ◽  
Joint Interface ◽  
Intermetallic Compound Layer ◽  
Lead Free Solder ◽  
Ball Shear ◽  
Joint Properties ◽  
Solder Balls ◽  
Plating Solution ◽  
Free Solder

The aim of this study is to investigate the joint properties of Sn-58mass%Bi and Sn-57mass%Bi-0.5mass%Sb low-melting lead-free solder balls on the electroless Ni/Au and Ni/Pd/Au plated Cu electrodes fabricated with a lead-free plating solution. Compared with the conventional Ni plating solution containing lead, the soldered joints with Ni/Au and Ni/Pd/Au electrodes fabricated with the lead-free plating solution showed comparable joint properties. In the joints with Ni/Pd/Au electrodes, ball shear force increased when the Pd layer is dissolved into solder by multi reflows. In both joints with Ni/Au and Ni/Pd/Au electrodes, a part of the Ni layer was dissolved into solder and thus the (Ni,Cu)3Sn4 intermetallic compound layer formed at the joint interface. Ball shear force decreased upon aging due to the growth of the (Ni,Cu)3Sn4 layer at the joint interface.

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