Phase diagram investigation and characterisation of ternary Sn In Me (Me = Ag, Cu) lead-free solder systems

2010 ◽  
Vol 39 (1/2) ◽  
pp. 95 ◽  
Author(s):  
Aleksandra Milosavljevic ◽  
Dragana Zivkovic ◽  
Dragan Manasijevic ◽  
Nadezda Talijan ◽  
Vladan Cosovic ◽  
...  
Keyword(s):  
Phase Diagram ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Phase Diagram of Sn-In-Zn System and its Use for Lead-free Solder

1998 ◽  
Vol 14 (12) ◽  
pp. 1098-1103 ◽  
Author(s):  
Zheng Yu-Jun ◽  
◽  
Zhang Qi-Yun
Keyword(s):  
Phase Diagram ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Electrochemical characterization of the Au-In-Sb system

2009 ◽  
Vol 63 (4) ◽  
pp. 289-292 ◽  
Author(s):  
Lidija Gomidzelovic ◽  
Zvonimir Stankovic ◽  
Zoran Stevic ◽  
Dragana Zivkovic
Keyword(s):  
Phase Diagram ◽  
Cyclic Voltammetry ◽  
Physical Characteristics ◽  
Electrochemical Characterization ◽  
Lead Free ◽  
Electrochemical Characteristics ◽  
Lead Free Solder ◽  
Free Solder ◽  
The Moment

The Au-In-Sb system belongs to the group of potential candidates for new lead-free solder materials. Therefore, a lot of investigations concerning its phase diagram and thermodynamic, mechanical, physical characteristics are going on at the moment. Having in mind the significance of such materials application in electronics, it is also very important to study their electrochemical characteristics. In order to give such a characterization, the results of cyclic voltammetry measurements for some alloys in the Au-In-Sb system are presented in this paper.

Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy

2003 ◽  
Author(s):  
Libin Liu ◽  
Cristina Andersson ◽  
Johan Liu ◽  
Y. C. Chan
Keyword(s):  
Phase Diagram ◽  
Ternary Phase ◽  
Ternary Phase Diagram ◽  
Production Capacity ◽  
Eutectic Point ◽  
Alloy System ◽  
Lead Free ◽  
Lead Free Solder ◽  
Peritectic Point ◽  
Free Solder

To select a lead-free solder system, factors such as eutectic/peritectic point, electron negativity, abundance, cost, toxicity of elements, world production capacity, segregation during solidification, possibility to form low melting phases with Pb, among others must be carefully considered. On the basis of thorough analysis of binary phase diagrams of Sn-X-systems (X represents other elements) and the properties of the element X, the Sn-Co-Cu eutectic ternary alloy system has been chosen as a new lead-free solder candidate. In order to find the eutectic point for the Sn-Co-Cu system, the Sn-Co binary system was thoroughly assessed with CALPHAD (CALculation of PHAse Diagram) methods. The ternary phase diagram of Sn-Co-Cu system was extrapolated with the assessed thermodynamic parameters of Sn-Co, Sn-Cu, and Co-Cu system. The eutectic point for L–Sn2Co+(Sn)+Cu6Sn5 is 224.4°C and 0.37%Co and 0.68%Cu and 98.95%Sn.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder
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