Carbon nanotube thermal interface material and its application in high brightness LED packages

2008 ◽  
Author(s):  
Kai Zhang
Keyword(s):  
Carbon Nanotube ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
High Brightness

Carbon nanotube thermal interface material for high-brightness light-emitting-diode cooling

2008 ◽  
Vol 19 (21) ◽  
pp. 215706 ◽  
Author(s):  
K Zhang ◽  
Y Chai ◽  
M M F Yuen ◽  
D G W Xiao ◽  
P C H Chan
Keyword(s):  
Carbon Nanotube ◽  
Light Emitting Diode ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
High Brightness ◽  
Light Emitting

Improvement of Thermal Conductivity of Silicone by Carbon Nanotube Array (CNTA)

2014 ◽  
Vol 1061-1062 ◽  
pp. 96-99 ◽  
Author(s):  
Liang Ke Wu ◽  
Ji Ying ◽  
Li Ting Chen
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Laser Flash ◽  
Laser Flash Method ◽  
Thermal Interface Material ◽  
Flash Method ◽  
Nanotube Array ◽  
Thermal Interface ◽  
Carbon Nanotube Array ◽  
Operating Temperatures

In order to improve the thermal conductivity of silicone, we prepared silicone/carbon nanotube array (CNTA) composite by immersing the CNTA into silicone solution and cured at 110 °C. The thermal conductivity of silicone and silicone/CNTA composite was measured by laser flash method at 30 °C, 60 °C, 90 °C, 120 °C, which are usually the operating temperatures. It was found that the thermal conductivity of silicone/CNTA composite increased with the temperature until achieved the plateau near 90 °C. The maximum thermal conductivity of silicone/CNTA composite is 0.674 W/mK, which is 220% higher than that of neat silicone. The excellent thermal conductivity makes the composite a promising thermal interface material.

Design, Synthesis, and Performance of a Carbon Nanotube/Metal Foil Thermal Interface Material

2007 ◽  
Author(s):  
Baratunde A. Cola ◽  
Xianfan Xu ◽  
Timothy S. Fisher
Keyword(s):  
Carbon Nanotube ◽  
Thermal Performance ◽  
Thermal Conduction ◽  
Thermal Interface Material ◽  
Metal Foil ◽  
Thermal Interface ◽  
Design Synthesis ◽  
Cnt Arrays ◽  
And Performance ◽  
Contact Spots

The thermal performance of an interface material comprised of a metal foil with dense, vertically oriented carbon nanotube (CNT) arrays synthesized on both of its surfaces is characterized for rough and smooth interfaces. The CNT/foil deforms in the interfaces by two mechanisms, CNT deformation and foil deformation, that may significantly increase the number of CNT contact spots on both sides of the foil. As a result, the thermal conduction at the CNT-array-free-tip interfaces is greatly increased from previous measurements.

Molecular Dynamics Simulations of Nanotube-Polymer Composites for Use as Thermal Interface Material

2003 ◽  
Author(s):  
S. Mahajan ◽  
G. Subbarayan ◽  
B. G. Sammakia ◽  
W. Jones
Keyword(s):  
Carbon Nanotube ◽  
Thermal Management ◽  
Cell Model ◽  
Thermal Interface Material ◽  
Design Parameters ◽  
Intermediate Step ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Scale Properties ◽  
Interface Materials

Thermal management in microelectronics is an important issue due to the projected increase in power dissipation in the electronic devices over the next 5–10 years. We seek a solution to this problem by exploring carbon nanotube-polymer matrix composites for use as thermal interface materials because of the reported high thermal conductivity and other remarkable thermal and mechanical properties of nanotubes. As an intermediate step to finding the composites’ conductivity, it is important to validate the use carbon nanotubes by calculating its diffusivity and conductivity first. This would facilitate later the estimating of important design parameters for thermal interface materials such as thermal diffusivity and conductivity. As polymer molecules are on the same size scale as nanotubes and the interaction at the polymer/nanotube interface is highly dependent on the molecular structure and bonding, Molecular Dynamic (MD) simulation is used to estimate the nano-scale properties. In this paper, until cell model consisting of a carbon nanotube was used and the diffusivity was measured. These findings would have implications in improving the thermal management efficiency and consequently improve the performance and reliability of future microelectronic devices.

scholarly journals Vertically aligned carbon nanotube arrays as a thermal interface material

APL Materials ◽  
2019 ◽  
Vol 7 (2) ◽  
pp. 020902 ◽  
Author(s):  
Linquan Ping ◽  
Peng-Xiang Hou ◽  
Chang Liu ◽  
Hui-Ming Cheng
Keyword(s):  
Carbon Nanotube ◽  
Thermal Interface Material ◽  
Nanotube Arrays ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Vertically Aligned

Characterization of Carbon Nanotube Array Based Thermal Interface Material After Bonding Process

2010 ◽  
Author(s):  
Rong-Shiuan Chu ◽  
Yang Zhao ◽  
Arun Majumdar
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Contact Resistance ◽  
Target Surface ◽  
Thermal Interface Material ◽  
Bonding Layer ◽  
Nanotube Array ◽  
Thermal Interface ◽  
Carbon Nanotube Array ◽  
Overall Resistance

Vertically Aligned Carbon Nanotube (CNT) Arrays are promising to use as advanced thermal interface material. While possessing high thermal conductivity for an individual tube, carbon nanotube array based thermal interface materials (TIMs) fell short of expectations due to poor CNTs-target surface contacts. Investigations suggested that the overall resistance can be potentially reduced to less than 1 m2-K/MW by increasing the number of tubes to target surface contacts. This paper use chromium/gold/indium assisted thermal pressure-bonding to enhance contacts. A CNT array with 12.7% areal density was bonded to an experimental glass surface with 2-μm indium bonding layer and 10 nm-chromium/150 nm-gold adhesion layers under pressure of 196 KPa and temperature of 350 °C. Phase sensitive photothermal reflectance method was used for thermal measurement. The overall resistance, including CNTs-glass contact resistance and effective CNT array thermal resistance, is 1.1 m2-K/MW ± 27%. Although the contact resistance was reduced to 0.39 m2-K/MW ± 15%, the effective thermal conductivity of the post-bonded 80 μm long CNTs was 114 W/m-K ± 22%, which was lower than the expected lower bound of the thermal conductivity of 12.7% filled CNT array. It was suggested that the deformation of CNT array after mechanical bonding reduced its performance.

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