scholarly journals Vertically aligned carbon nanotube arrays as a thermal interface material

APL Materials ◽  
2019 ◽  
Vol 7 (2) ◽  
pp. 020902 ◽  
Author(s):  
Linquan Ping ◽  
Peng-Xiang Hou ◽  
Chang Liu ◽  
Hui-Ming Cheng
Keyword(s):  
Carbon Nanotube ◽  
Thermal Interface Material ◽  
Nanotube Arrays ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Vertically Aligned

Thermal Interface Materials Based on Vertically Aligned Carbon Nanotube Arrays: A Review

2019 ◽  
Vol 11 (1) ◽  
pp. 3-10 ◽  
Author(s):  
Guangjie Yuan ◽  
Haohao Li ◽  
Bo Shan ◽  
Johan Liu
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Free Standing ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Potential Applications ◽  
Vertically Aligned ◽  
Interface Materials

As the feature size of integrated circuit devices is shrinking to sub-7 nm node, the chip power dissipation significantly increases and mainly converted to the heat. Vertically Aligned Carbon Nanotube arrays (VACNTs) have a large number of outstanding properties, such as high axial thermal conductivity, low expansion coefficient, light-weight, anti-aging, and anti-oxidation. With a dramatic increment of chip temperature, VACNTs and their composites will be the promising materials as Thermal Interface Materials (TIMs), especially due to their high thermal conductivity. In this review, the synthesis, transfer and potential applications of VACNTs have been mentioned. Thermal Chemical Vapor Deposition (TCVD) has been selected for the synthesis of millimeter-scale VACNTs. After that, they are generally transferred to the target substrate for the application of TIMs in the electronics industry, using the solder transfer method. Besides, the preparation and potential applications of VACNTs-based composites are also summarized. The gaps of VACNTs are filled by the metals or polymers to replace the low thermal conductivity in the air and make them free-standing composites films. Compared with VACNTs- metal composites, VACNTs-polymer composites will be more suitable for the next generation TIMs, due to their lightweight, low density and good mechanical properties.

Molecular Beam-Controlled Nucleation and Growth of Vertically Aligned Single-Wall Carbon Nanotube Arrays

2005 ◽  
Vol 109 (35) ◽  
pp. 16684-16694 ◽  
Author(s):  
Gyula Eres ◽  
Anika A. Kinkhabwala ◽  
Hongtao Cui ◽  
David B. Geohegan ◽  
Alexandar A. Puretzky ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Molecular Beam ◽  
Nucleation And Growth ◽  
Nanotube Arrays ◽  
Single Wall Carbon Nanotube ◽  
Single Wall Carbon ◽  
Carbon Nanotube Arrays ◽  
Vertically Aligned ◽  
Controlled Nucleation

Surface-conduction electron-emitter characteristics and fabrication based on vertically aligned carbon nanotube arrays

2017 ◽  
Vol 406 ◽  
pp. 56-61 ◽  
Author(s):  
Yi-Ting Shih ◽  
Kuan-Wei Li ◽  
Shin-ichi Honda ◽  
Pao-Hung Lin ◽  
Ying-Sheng Huang ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Conduction Electron ◽  
Nanotube Arrays ◽  
Electron Emitter ◽  
Carbon Nanotube Arrays ◽  
Vertically Aligned ◽  
Surface Conduction

Denser and taller carbon nanotube arrays on Cu foils useable as thermal interface materials

2015 ◽  
Vol 54 (9) ◽  
pp. 095102 ◽  
Author(s):  
Nuri Na ◽  
Kei Hasegawa ◽  
Xiaosong Zhou ◽  
Mizuhisa Nihei ◽  
Suguru Noda
Keyword(s):  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Carbon Nanotube Arrays ◽  
Interface Materials

Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications

2014 ◽  
Vol 4 (12) ◽  
pp. 1906-1913 ◽  
Author(s):  
Michael T. Barako ◽  
Yuan Gao ◽  
Yoonjin Won ◽  
Amy M. Marconnet ◽  
Mehdi Asheghi ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Nanotube Arrays ◽  
Reactive Metal ◽  
Thermal Interface ◽  
Metal Bonding ◽  
Carbon Nanotube Arrays
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