Ultrafast laser-inscribed nanogratings in sapphire for geometric phase elements

2020 ◽  
Author(s):  
Shuai Xu ◽  
Hua Fan ◽  
Zhen-Ze Li ◽  
Jian-Guan Hua ◽  
Yan-Hao Yu ◽  
...  
2020 ◽  
Vol 9 (1) ◽  
Author(s):  
Masaaki Sakakura ◽  
Yuhao Lei ◽  
Lei Wang ◽  
Yan-Hao Yu ◽  
Peter G. Kazansky

2016 ◽  
Vol 5 (1) ◽  
pp. 1600575 ◽  
Author(s):  
Rokas Drevinskas ◽  
Martynas Beresna ◽  
Jingyu Zhang ◽  
Andrey G. Kazanskii ◽  
Peter G. Kazansky

2021 ◽  
Vol 33 (1) ◽  
pp. 012009
Author(s):  
Aiko Narazaki ◽  
Hideyuki Takada ◽  
Dai Yoshitomi ◽  
Kenji Torizuka ◽  
Yohei Kobayashi

Author(s):  
Jayhoon Chung ◽  
Guoda Lian ◽  
Lew Rabenberg

Abstract Since strain engineering plays a key role in semiconductor technology development, a reliable and reproducible technique to measure local strain in devices is necessary for process development and failure analysis. In this paper, geometric phase analysis of high angle annular dark field - scanning transmission electron microscope images is presented as an effective technique to measure local strains in the current node of Si based transistors.


2020 ◽  
Vol 13 (6) ◽  
pp. 1-15
Author(s):  
ZHANG Guo-dong ◽  
◽  
CHENG Guang-hua ◽  
ZHANG Wei ◽  
Keyword(s):  

1997 ◽  
Vol 481 ◽  
Author(s):  
J. P. Callan ◽  
A. M.-T. Kim ◽  
L. Huangt ◽  
E. N. Glezer ◽  
E. Mazur

ABSTRACTWe use a new broadband spectroscopic technique to measure ultrafast changes in the dielectric function of a material over the spectral range 1.5–3.5 eV following intense 70-fs laser excitation. The results reveal the nature of the phase transformations which occur in the material following excitation. We studied the response of GaAs and Si. For GaAs, there are three distinct regimes of behavior as the pump fluence is increased — lattice heating, lattice disordering, and a semiconductor-to-metal transition.


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