scholarly journals Role of each step in combined treatment of reactive ion etching and dynamic chemical etching for improving the laser-induced damage resistance of fused silica

2021 ◽  
Author(s):  
Ting Shao ◽  
Zhaohua Shi ◽  
Laixi Sun ◽  
Xin Ye ◽  
Jin Huang ◽  
...  
Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1226
Author(s):  
Wanli Zhang ◽  
Feng Shi ◽  
Ci Song ◽  
Ye Tian ◽  
Yongxiang Shen

The enhancement of laser damage resistance of fused silica optics was a hotspot in scientific research. At present, a variety of modern processes have been produced to improve the laser induced damage threshold (LIDT) of fused silica optics. They included pre-treatment processes represented by flexible computer controlled optical surfacing (CCOS), magnetorheological finishing (MRF), ion beam finishing (IBF), and post-treatment processes represented by dynamic chemical etching (DCE). These have achieved remarkable results. However, there are still some problems that need to be solved urgently, such as excessive material removal, surface accuracy fluctuation in the DCE process, and the pollution in MRF process, etc. In view of above problems, an MRF, CCOS, IBF and shallow DCE combined technique was used to process fused silica optics. The surface morphology could be greatly controlled and chemical etching depth was reduced, while the LIDT increased steadily. After processing by this combined technique, the LIDT increased to 12.1 J/cm2 and the laser damage resistance properties of fused silica were significantly enhanced. In general, the MRF, IBF, CCOS and shallow DCE combined technique brought much help to the enhancement of laser damage resistance of fused silica, and could be used as a process route in the manufacturing process of fused silica.


2016 ◽  
Vol 41 (19) ◽  
pp. 4464 ◽  
Author(s):  
Laixi Sun ◽  
Jin Huang ◽  
Hongjie Liu ◽  
Xin Ye ◽  
Jingjun Wu ◽  
...  

Silicon ◽  
2019 ◽  
Vol 12 (2) ◽  
pp. 425-432 ◽  
Author(s):  
Hui Ye ◽  
Yaguo Li ◽  
Qiao Xu ◽  
Wei Yang ◽  
Chen Jiang

2016 ◽  
Vol 55 (9) ◽  
pp. 2252 ◽  
Author(s):  
Liang Lv ◽  
Ping Ma ◽  
Jinyong Huang ◽  
Xiang He ◽  
Chao Cai ◽  
...  

2019 ◽  
Vol 9 (9) ◽  
pp. 1804
Author(s):  
Amal Kabalan

Silicon micropillars have been suggested as one of the techniques for improving the efficiency of devices. Fabrication of micropillars has been done in several ways—Metal Assisted Chemical Etching (MACE) and Reactive Ion Etching (RIE) being the most popular techniques. These techniques include etching through the surface which results in surface damage that affects the carrier lifetime. This paper presents a study that compares the carrier lifetime of micropillars fabricated using RIE and MACE methods. It also looks at increasing carrier lifetime by surface treatment using three main approaches: surface passivation by depositing Al2O3, surface passivation by depositing SiO2/SiN, and surface passivation by etching using KOH and Hydrofluoric Nitric Acetic (HNA) solution. It was concluded that passivating with SiO2 and SiN results in the highest carrier lifetime on the MACE and RIE pillars.


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