scholarly journals Direct observation of structure-assisted filament splitting during ultrafast multiple-pulse laser ablation

2019 ◽  
Vol 27 (7) ◽  
pp. 10050 ◽  
Author(s):  
Feifei Wang ◽  
Changji Pan ◽  
Jingya Sun ◽  
Qingsong Wang ◽  
Yongfeng Lu ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Pulse Laser ◽  
Direct Observation ◽  
Pulse Laser Ablation ◽  
Multiple Pulse

scholarly journals Study on real-time z-scanning of multiple-pulse laser ablation of metal applied in roll-printed electronics

2021 ◽  
Vol 11 (2) ◽  
pp. 509
Author(s):  
Le Phuong Hoang ◽  
Phuong Thao Nguyen ◽  
Thi Kim Cuc Nguyen ◽  
Toan Thang Vu ◽  
Xuan Binh Cao
Keyword(s):  
Laser Ablation ◽  
Real Time ◽  
Pulse Laser ◽  
Printed Electronics ◽  
Pulse Laser Ablation ◽  
Multiple Pulse

Mechanisms of ablation-rate decrease in multiple-pulse laser ablation

2001 ◽  
Vol 73 (2) ◽  
pp. 143-149 ◽  
Author(s):  
E.G. Gamaly ◽  
A.V. Rode ◽  
A. Perrone ◽  
A. Zocco
Keyword(s):  
Laser Ablation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Ablation Rate ◽  
Multiple Pulse ◽  
Rate Decrease

Size control of nanoparticles by multiple-pulse laser ablation

2017 ◽  
Vol 402 ◽  
pp. 330-335 ◽  
Author(s):  
Jiaxin Yu ◽  
Junyi Nan ◽  
Heping Zeng
Keyword(s):  
Laser Ablation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Size Control ◽  
Multiple Pulse

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

Numerical modeling of ultrashort-pulse laser ablation of silicon

2009 ◽  
Vol 255 (17) ◽  
pp. 7605-7609 ◽  
Author(s):  
D.P. Korfiatis ◽  
K.-A. Th. Thoma ◽  
J.C. Vardaxoglou
Keyword(s):  
Numerical Modeling ◽  
Laser Ablation ◽  
Pulse Laser ◽  
Ultrashort Pulse ◽  
Pulse Laser Ablation ◽  
Ultrashort Pulse Laser
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