scholarly journals Wavelength dependence of femtosecond laser ablation threshold of corneal stroma

2008 ◽  
Vol 16 (6) ◽  
pp. 4121 ◽  
Author(s):  
G. Olivié ◽  
D. Giguère ◽  
F. Vidal ◽  
T. Ozaki ◽  
J.-C. Kieffer ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Femtosecond Laser ◽  
Ablation Threshold ◽  
Corneal Stroma ◽  
Femtosecond Laser Ablation ◽  
Wavelength Dependence

scholarly journals Nanoscale-Precision Removal of Copper in Integrated Circuits Based on a Hybrid Process of Plasma Oxidation and Femtosecond Laser Ablation

Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1188
Author(s):  
Shuai Wang ◽  
Yaoyu Wang ◽  
Shizhuo Zhang ◽  
Lingfeng Wang ◽  
Shuai Chen ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Integrated Circuits ◽  
Femtosecond Laser ◽  
Copper Oxide ◽  
Ablation Threshold ◽  
Femtosecond Laser Ablation ◽  
Hybrid Process ◽  
Plasma Oxidation ◽  
Fs Laser ◽  
Application Potential

Copper (Cu) is the main interconnect conductor for integrated circuits (IC), and its processing quality is very important to device performance. Herein, a hybrid process of plasma oxidation and femtosecond laser (fs-laser) ablation was proposed for the nanoscale precision removal of Cu in integrated circuits. In this hybrid process, the surface layer of Cu was oxidized to the copper oxide by plasma oxidation, and then the fs-laser with a laser fluence lower than the Cu ablation threshold was used to remove the copper oxide without damaging the underlying Cu. Theoretically, the surface temperature evolutions of Cu and copper oxide under the femtosecond laser were studied by the two-temperature model, and it was revealed that the ablation threshold of copper oxide is much lower than that of Cu. The experimental results showed that the ablation threshold of copper oxide is lower than that of Cu, which is consistent with the theoretical analysis. Using the hybrid process, a surface roughness of 3 nm and a removal accuracy of 4 nm were obtained in the process of Cu film processing, which were better than those obtained by fs-laser ablation. This demonstrated that the hybrid process has good application potential in the field of copper micromachining.

scholarly journals Femtosecond Laser Ablation of Implantable Materials

2019 ◽  
Author(s):  
Patrick McEligot ◽  
Seth A. Hara ◽  
Susheil Uthamaraj
Keyword(s):  
Laser Ablation ◽  
Femtosecond Laser ◽  
Medical Devices ◽  
Etch Rate ◽  
Ablation Threshold ◽  
Femtosecond Laser Ablation ◽  
Laser Machining ◽  
Work Process ◽  
Machining Quality ◽  
Process Characterization

Femtosecond laser ablation is a powerful tool for the fabrication of medical devices, especially with materials commonly used in implantable micro devices as these materials are often incompatible with traditional machining techniques. Laser machining quality is highly dependent not only on the laser parameters, but also on the material that is being machined and so the process must be characterized for each material of interest. In this work, process characterization is presented for two materials commonly used in implantable micro devices — polyimide and silicon. The ablation threshold and etch rate were determined for femtosecond laser machining with a UV wavelength.

scholarly journals Ridge waveguide lasers in Nd:GGG crystals produced by swift carbon ion irradiation and femtosecond laser ablation

2012 ◽  
Vol 20 (9) ◽  
pp. 9763 ◽  
Author(s):  
Yuechen Jia ◽  
Ningning Dong ◽  
Feng Chen ◽  
Javier R. Vázquez de Aldana ◽  
Sh. Akhmadaliev ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Femtosecond Laser ◽  
Ion Irradiation ◽  
Femtosecond Laser Ablation ◽  
Ridge Waveguide ◽  
Carbon Ion ◽  
Waveguide Lasers ◽  
Ridge Waveguide Lasers
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