Monolithic Integration of WDM Light Source for Silicon Photonics by Cascade of Al2O3: Er3+ DFB Lasers

Author(s):  
Purnawirman ◽  
N. Li ◽  
E. S. Magden ◽  
G. Singh ◽  
J. D. B. Bradley ◽  
...  
Author(s):  
Felix Eltes ◽  
Daniele Caimi ◽  
Christian Mai ◽  
Georg Winzer ◽  
Despoina Petousi ◽  
...  

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001663-001681
Author(s):  
Miguel Jimarez

We introduce a high-speed 4x25Gbps, MSA-compliant, QSFP transceiver built on a Silicon Photonics platform. The transceiver integrates high sensitivity receivers, CTLE, clock recovery, modulator drivers and BIST on a TSMC 28nm die connected to the photonic die thru a fine pitch (50um) Copper Pillar interface. A wafer-scale approach, Chip on Wafer, CoW, is used to assemble the electronic die and the light source on to the photonic die, so that the full optical path can be tested, at speed, in loopback configuration in wafer form, using a standard ATE solution. This presentation focuses on the CoW assembly development aspects of the transceiver. Wafer probe and bump, die processing services, CoW assembly and Back End of Line, BEOL, Test Services will be presented.


2017 ◽  
Vol 42 (9) ◽  
pp. 1772 ◽  
Author(s):  
Purnawirman ◽  
Nanxi Li ◽  
E. Salih Magden ◽  
Gurpreet Singh ◽  
Michele Moresco ◽  
...  

Author(s):  
Zhechao Wang ◽  
Carl Junesand ◽  
Wondwosen Metaferia ◽  
Chen Hu ◽  
Sebastian Lourdudoss ◽  
...  

Author(s):  
M. Smiciklas ◽  
G. Sanders ◽  
L. Strandjord ◽  
W. Williams ◽  
E. Benser ◽  
...  

Optica ◽  
2019 ◽  
Vol 6 (4) ◽  
pp. 473 ◽  
Author(s):  
Yan Zhang ◽  
Qingyang Du ◽  
Chuangtang Wang ◽  
Takian Fakhrul ◽  
Shuyuan Liu ◽  
...  

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