The Reflector and Coupler Using Subwavelength High-contrast Grating for Silicon-photonics Light Source

Author(s):  
Hua Wu ◽  
Mingfu Han ◽  
Xia Guo
2011 ◽  
Author(s):  
Constance Chang-Hasnain ◽  
Ming Wu ◽  
Eli Yablonovitch

2008 ◽  
Vol 16 (22) ◽  
pp. 17282 ◽  
Author(s):  
Ye Zhou ◽  
Michael Moewe ◽  
Johannes Kern ◽  
Michael C. Huang ◽  
Connie J. Chang-Hasnain

2019 ◽  
Vol 27 (3) ◽  
pp. 2703 ◽  
Author(s):  
P. F. Wang ◽  
G. Z. Luo ◽  
H. Y. Yu ◽  
Y. J. Li ◽  
M. Q. Wang ◽  
...  

Author(s):  
Frederik Luessmann ◽  
Jana Hartmann ◽  
Hergo-Heinrich Wehmann ◽  
Constantin Hilbrunner ◽  
Joerg Malindretos ◽  
...  

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001663-001681
Author(s):  
Miguel Jimarez

We introduce a high-speed 4x25Gbps, MSA-compliant, QSFP transceiver built on a Silicon Photonics platform. The transceiver integrates high sensitivity receivers, CTLE, clock recovery, modulator drivers and BIST on a TSMC 28nm die connected to the photonic die thru a fine pitch (50um) Copper Pillar interface. A wafer-scale approach, Chip on Wafer, CoW, is used to assemble the electronic die and the light source on to the photonic die, so that the full optical path can be tested, at speed, in loopback configuration in wafer form, using a standard ATE solution. This presentation focuses on the CoW assembly development aspects of the transceiver. Wafer probe and bump, die processing services, CoW assembly and Back End of Line, BEOL, Test Services will be presented.


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