Height measurement of solder bumps using twowavelength parallel four-step phase shifting digitalholography

2021 ◽  
Author(s):  
Hiroyuki Ishigaki ◽  
Ikuo Futamura ◽  
Tomoru Okada ◽  
Takahiro Mamiya ◽  
Yoshio Hayasaki
2020 ◽  
Vol 59 (SO) ◽  
pp. SOOE03
Author(s):  
Hiroyuki Ishigaki ◽  
Takahiro Mamiya ◽  
Yoshio Hayasaki

2003 ◽  
Author(s):  
Akira Ishii ◽  
Jun Mitsudo ◽  
Shinsuke Mizushima

2014 ◽  
Vol 487 ◽  
pp. 298-301
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Nor Shakirina Nadzri ◽  
Christopher John Veriven

A three-dimensional surface measurement using fringe projection technique has received attention among the researches for the last few decades.However choosing the best method is the challenge because one needs to consider the cost, measurement speed, system complexity, measurement accuracy and data reliability to ensure the success of the measurement. This paper focused on the successful manipulation of non-collimated light source and three step phase shifting for height measurement of a lead frame.The measurement done based on pixel determination from the saw tooth image. In addition, the scaling factor technique has been employed for the measurement accuracy. The experimental results achieved a high precision of measurement with simple system and high speed capability.


2014 ◽  
Vol 134 (2) ◽  
pp. 145-152
Author(s):  
Ryuichi Ogahara ◽  
Yuki Kawaura ◽  
Shinichi Iwamoto ◽  
Naohiro Kamikawa ◽  
Masayuki Namba

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