Shape and height measurement of solder bumps using focus measure difference

2003 ◽  
Author(s):  
Akira Ishii ◽  
Jun Mitsudo ◽  
Shinsuke Mizushima
Keyword(s):  
Height Measurement ◽  
Focus Measure ◽  
Solder Bumps

Digital holography with a set of two close wavelengths for height measurement of solder bumps

2020 ◽  
Vol 59 (SO) ◽  
pp. SOOE03
Author(s):  
Hiroyuki Ishigaki ◽  
Takahiro Mamiya ◽  
Yoshio Hayasaki
Keyword(s):  
Digital Holography ◽  
Height Measurement ◽  
Solder Bumps

Height measurement of solder bumps using twowavelength parallel four-step phase shifting digitalholography

2021 ◽  
Author(s):  
Hiroyuki Ishigaki ◽  
Ikuo Futamura ◽  
Tomoru Okada ◽  
Takahiro Mamiya ◽  
Yoshio Hayasaki
Keyword(s):  
Phase Shifting ◽  
Height Measurement ◽  
Solder Bumps

The Sine Method: An Alternative Height Measurement Technique

2011 ◽  
Author(s):  
Don C. Bragg ◽  
Lee E. Frelich ◽  
Robert T. Leverett ◽  
Will Blozan ◽  
Dale J. Luthringer
Keyword(s):  
Measurement Technique ◽  
Height Measurement

The Use of Precision Selective Area Milling for Failure Analysis of Flip-Chip Packages

2002 ◽  
Author(s):  
George F. Gaut
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Solder Bump ◽  
Selective Area ◽  
Fill Material ◽  
Solder Bumps ◽  
Time Required

Abstract Access to the solder bump and under-fill material of flip-chip devices has presented a new problem for failure analysts. The under-fill and solder bumps have also added a new source for failure causes. A new tool has become available that can reduce the time required to analyze this area of a flip-chip package. By using precision selective area milling it is possible to remove material (die or PCB) that will allow other tools to expose the source of the failure.

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

scholarly journals Height Measurement With Meter Wave MIMO Radar Based on Precise Signal Model Under Complex Terrain

IEEE Access ◽  
2021 ◽  
Vol 9 ◽  
pp. 49980-49989
Author(s):  
Yuwei Song ◽  
Guoping Hu ◽  
Guimei Zheng
Keyword(s):  
Complex Terrain ◽  
Mimo Radar ◽  
Height Measurement ◽  
Signal Model

NSCT and focus measure optimization based multi-focus image fusion

2021 ◽  
pp. 1-13
Author(s):  
N. Aishwarya ◽  
C. BennilaThangammal ◽  
N.G. Praveena
Keyword(s):  
Simulation Analysis ◽  
Structural Information ◽  
Research Area ◽  
Processing Technique ◽  
The Novel ◽  
Phase Congruency ◽  
Focus Measure ◽  
Fused Image ◽  
Focus Image ◽  
Image Pairs

Getting a complete description of scene with all the relevant objects in focus is a hot research area in surveillance, medicine and machine vision applications. In this work, transform based fusion method called as NSCT-FMO, is introduced to integrate the image pairs having different focus features. The NSCT-FMO approach basically contains four steps. Initially, the NSCT is applied on the input images to acquire the approximation and detailed structural information. Then, the approximation sub band coefficients are merged by employing the novel Focus Measure Optimization (FMO) approach. Next, the detailed sub-images are combined using Phase Congruency (PC). Finally, an inverse NSCT operation is conducted on synthesized sub images to obtain the initial synthesized image. To optimize the initial fused image, an initial decision map is first constructed and morphological post-processing technique is applied to get the final map. With the help of resultant map, the final synthesized output is produced by the selection of focused pixels from input images. Simulation analysis show that the NSCT-FMO approach achieves fair results as compared to traditional MST based methods both in qualitative and quantitative assessments.

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