scholarly journals Microstructure Analysis of Magnesium Alloy Electrodes in Seawater Batteries

2021 ◽  
Vol 18 (2) ◽  
pp. 242-248
Author(s):  
Rezza Ruzuqi ◽  
Victor Danny Waas ◽  
Muhammad Ali Ulath
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Corrosion Resistance ◽  
Electron Beam ◽  
Magnesium Alloy ◽  
Microstructural Analysis ◽  
Fine Powder ◽  
Test Material ◽  
Accurate Information ◽  
Scanning Electron

Microstructural analysis has been performed on magnesium alloy electrodes, the material used for saltwater lantern batteries. This research aims to obtain detailed and accurate information needed to support the analysis of magnesium alloy corrosion resistance caused by the electrolysis process using various analytical methods in SEM(Scanning Electron Microscopy). It is a tool that uses an electron beam to display the surface structure and composition of a test material. The test carried out on this magnesium alloy electrode is to crush the electrode into a fine powder. Then the powder is put into a container for SEM-EDS testing. Magnifications start from 1,000xuntil 15,000x. The results showed that the greater the magnification on the microscope, the more it was seen that the lumps looked brittle. Then on the surface of the magnesium alloy electrodes, 58.00 wt% magnesium material is contained.

Corrosion Resistance of Medical Stainless Steel Obtained by Non-Vacuum Electron Beam Cladding

2019 ◽  
Vol 946 ◽  
pp. 73-78 ◽  
Author(s):  
Ivan V. Ivanov ◽  
Elizaveta I. Tkachenko ◽  
Alexander Thoemmes
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Stainless Steel ◽  
Corrosion Resistance ◽  
Electron Beam ◽  
Crevice Corrosion ◽  
Corrosion Test ◽  
Dynamic Polarization ◽  
Biological Media ◽  
Scanning Electron

Pitting and crevice corrosion resistance of 321 stainless steel and non-vacuum electron-beam cladded stainless steel have been investigated by using potentio-dynamic polarization curve plotting. Lock-Ringer Salt Solution (LRSS) was used as biological media for corrosion test measurements. Microstructural research of samples after corrosion was carried out by using scanning electron microscopy. The experimental results show that the cladded stainless steel possesses higher pitting and crevice corrosion resistance.

High Resolution Scanning Electron Microscopy

1991 ◽  
Vol 49 ◽  
pp. 478-479
Author(s):  
David Joy ◽  
James Pawley
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Beam ◽  
Electron Microscope ◽  
High Resolution ◽  
Scanning Electron Microscope ◽  
Electron Probe ◽  
Impact Point ◽  
Interaction Volume ◽  
Scanning Electron

The scanning electron microscope (SEM) builds up an image by sampling contiguous sub-volumes near the surface of the specimen. A fine electron beam selectively excites each sub-volume and then the intensity of some resulting signal is measured. The spatial resolution of images made using such a process is limited by at least three factors. Two of these determine the size of the interaction volume: the size of the electron probe and the extent to which detectable signal is excited from locations remote from the beam impact point. A third limitation emerges from the fact that the probing beam is composed of a finite number of discrete particles and therefore that the accuracy with which any detectable signal can be measured is limited by Poisson statistics applied to this number (or to the number of events actually detected if this is smaller).

Investigation of Die Tilting of Packages with Single and Multi-chips

2018 ◽  
Author(s):  
Lo Chea Wee ◽  
Tan Sze Yee ◽  
Gan Sue Yin ◽  
Goh Cin Sheng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Beam ◽  
Optical Microscopy ◽  
Device Performance ◽  
Electronic Components ◽  
Area Of Interest ◽  
On Chip ◽  
Scanning Electron

Abstract Advanced package technology often includes multi-chips in one package to accommodate the technology demand on size & functionality. Die tilting leads to poor device performance for all kinds of multi-chip packages such as chip by chip (CbC), chip on chip (CoC), and the package with both CbC and CoC. Traditional die tilting measured by optical microscopy and scanning electron microscopy has capability issue due to wave or electron beam blocking at area of interest by electronic components nearby. In this paper, the feasibility of using profilemeter to investigate die tilting in single and multi-chips is demonstrated. Our results validate that the profilemeter is the most profound metrology for die tilting analysis especially on multi-chip packages, and can achieve an accuracy of <2μm comparable to SEM.

scholarly journals Microstructural Analysis of Fractured Orthopedic Implants

Materials ◽  
2021 ◽  
Vol 14 (9) ◽  
pp. 2209
Author(s):  
Mateusz Kopec ◽  
Adam Brodecki ◽  
Grzegorz Szczęsny ◽  
Zbigniew L. Kowalewski
Keyword(s):  
Physical Activity ◽  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Fracture Behavior ◽  
Locking Plate ◽  
Microstructural Analysis ◽  
Pure Titanium ◽  
Orthopedic Implants ◽  
Mechanical Loads ◽  
Scanning Electron

In this paper, fracture behavior of four types of implants with different geometries (pure titanium locking plate, pure titanium femoral implant, Ti-6Al-4V titanium alloy pelvic implant, X2CrNiMo18 14-3 steel femoral implant) was studied in detail. Each implant fractured in the human body. The scanning electron microscopy (SEM) was used to determine the potential cause of implants fracture. It was found that the implants fracture mainly occurred in consequence of mechanical overloads resulting from repetitive, prohibited excessive limb loads or singular, un-intendent, secondary injures. Among many possible loading types, the implants were subjected to an excessive fatigue loads with additional interactions caused by screws that were mounted in their threaded holes. The results of this work enable to conclude that the design of orthopedic implants is not fully sufficient to transduce mechanical loads acting over them due to an increasing weight of treated patients and much higher their physical activity.

Influence of Fly Ash on Corrosion Resistance of Refractory Forsterite-Spinel Ceramics

2021 ◽  
Vol 325 ◽  
pp. 181-187
Author(s):  
Martin Nguyen ◽  
Radomír Sokolář
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Corrosion Resistance ◽  
Fly Ash ◽  
Raw Materials ◽  
X Ray Diffraction ◽  
X Ray ◽  
Transition Zones ◽  
Refractory Ceramics ◽  
Scanning Electron

This article examines the influence of fly ash on corrosion resistance of refractory forsterite-spinel ceramics by molten iron as a corrosive medium. Fly ash in comparison with alumina were used as raw materials and sources of aluminium oxide for synthesis of forsterite-spinel refractory ceramics. Raw materials were milled, mixed in different ratios into two sets of mixtures and sintered at 1550°C for 2 hours. Samples were characterized by X-ray diffraction analysis and thermal dilatometric analysis. Crucibles were then made from the fired ceramic mixtures and fired together with iron at its melting point of 1535°C for 5 hours. The corrosion resistance was evaluated by scanning electron microscopy on the transition zones between iron and ceramics. Mixtures with increased amount of spinel had higher corrosion resistance and mixtures with fly ash were comparable to mixtures with alumina in terms of corrosion resistance and refractory properties.

Microstructure Analysis of Electron-Beam Brazed γ-Titanium Aluminide

2011 ◽  
Vol 690 ◽  
pp. 153-156
Author(s):  
Uwe Reisgen ◽  
Simon Olschok ◽  
Alexander Backhaus
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Beam ◽  
Titanium Aluminide ◽  
Titanium Aluminides ◽  
Microstructure Analysis ◽  
Energy Dispersive ◽  
X Ray ◽  
Scanning Electron

This paper gives an account of research which has been carried out on electron-beam brazed specimens made of high-Niobium γ-titanium aluminides. The microstructure in the brazing area of two different brazes (TiCuNi and Ni 102) is explained and analysed via scanning electron microscopy and energy dispersive X-ray spectroscopy.

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