Influence of Electroless Ni-P Coating Bath Parameters on the Strength and Surface Finish

2013 ◽  
Vol 1 (2) ◽  
pp. 15
Author(s):  
K V Arun ◽  
Keyword(s):  
Surface Finish ◽  
Electroless Ni

Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish

2020 ◽  
Vol 49 (8) ◽  
pp. 5003-5008
Author(s):  
I. A. Weng ◽  
H. T. Hung ◽  
W. C. Huang ◽  
C. R. Kao ◽  
Y. H. Chen
Keyword(s):  
Surface Finish ◽  
Electroless Ni

Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability

2010 ◽  
Vol 39 (12) ◽  
pp. 2598-2604 ◽  
Author(s):  
Hitoshi Sakurai ◽  
Alongheng Baated ◽  
Kiju Lee ◽  
Seongjun Kim ◽  
Keun-Soo Kim ◽  
...  
Keyword(s):  
Surface Finish ◽  
Electroless Ni

scholarly journals Effects of Zn-Bearing Flux on Joint Reliability and Microstructure of Sn-3.5Ag Soldering on Electroless Ni-Au Surface Finish

2010 ◽  
Vol 51 (10) ◽  
pp. 1727-1734 ◽  
Author(s):  
Hitoshi Sakurai ◽  
Youichi Kukimoto ◽  
Seongjun Kim ◽  
Alongheng Baated ◽  
Kiju Lee ◽  
...  
Keyword(s):  
Surface Finish ◽  
Joint Reliability ◽  
Electroless Ni

scholarly journals Mechanical Shock Durability Studies of Sn-Ag-Cu-Ni BGA Solder Joints on Electroless Ni-P/Au Surface Finish

2009 ◽  
Vol 2 (1) ◽  
pp. 62-68 ◽  
Author(s):  
Fumiyoshi Kawashiro ◽  
Hajime Yanase ◽  
Masato Ujiie ◽  
Takaki Etou ◽  
Hiroshi Okada
Keyword(s):  
Surface Finish ◽  
Solder Joints ◽  
Mechanical Shock ◽  
Electroless Ni

Evaluation of Surface Finish on Build Up Substrate

2003 ◽  
Author(s):  
L. Y. Hung ◽  
Y. P. Wang ◽  
C. S. Hsiao
Keyword(s):  
Solder Joint ◽  
Surface Finish ◽  
Joint Strength ◽  
Failure Modes ◽  
Electroless Nickel ◽  
Deposition Process ◽  
Sodium Hypophosphite ◽  
Ball Shear ◽  
Phosphorous Content ◽  
Electroless Ni

In recent years, the most explosive technologies in electronic systems have demanded ever-higher functionality, ever-faster circuit speeds, and always increasing interconnection density. Electrolytic and electroless nickel/gold (Ni/Au) deposition process are used commonly to provide flat, solderable pad surface finish on area array (BGA or CSP) packages and printed wiring boards (PWB). The electroless nickel/immersion gold (ENIG) process is widely used which do not requires plating lines for electrolytic plating, better meets the fine pitch wiring requirements. However, ENIG deposition process may cause or contribute to catastrophic, brittle, interfacial solder joint fractures. ENIG plating has previously shown lower reliability at solder joints. This is because Phosphorous segregation at the interface Sn-Ni intermetallic and Ni layer caused poor adhesion at that interface, especially high phosphorous content (10∼15%) of the electroless Ni. There have been many studies verified that Ni3P formation is a major factor, which causes weaker joint strength and flat fracture surface. Owing to sodium hypophosphite (NaH2PO2) was used to provide electron and return Ni ion to deposit on Cu pad for ENIG plating, it is not dodge that phosphorous element exist at the Ni layer. Hence, ph value, temperature and loading factor (plating area/ plating tank volume) in the plating path are controlled to reduce phosphorous content (less than 10%) to avoid Ni3P formation. Furthermore, ENIG has a potential risk of black pad, because Porous Au plating layer caused the oxidation of Ni layer underneath the Au plating to occur solder joint failure and low shear forces after assembly. In order to overcome foregoing problem, a flip chip ball grid array (FCBGA) test vehicle is used to compare three kinds surface finish electroless Ni/Au, direct gold and solder on Cu pad in this study 63Sn/37Pb solder bump is reflowed onto these substrates. High temperature storage test (HTS) is used to evaluate thickness and structure of IMC to affect solder joint attachment reliability. Ball shear test is used to measurement joint strength at various HTS time. Optical microscopy (OM) and scanning electron mcroscopy (SEM) are used to observe failure modes after ball shear.

Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound

2008 ◽  
Vol 37 (6) ◽  
pp. 806-814 ◽  
Author(s):  
Seishi Kumamoto ◽  
Hitoshi Sakurai ◽  
Youichi Kukimoto ◽  
Katsuaki Suganuma
Keyword(s):  
Surface Finish ◽  
Joint Strength ◽  
Electroless Ni
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