scholarly journals A Positive-Type Alkaline-Developable Photosensitive Polyimide Based on the Poly(amic acid) from 2,2′,6,6′-Biphenyltetracarboxylic Dianhydride and 1,3-Bis(4-aminophenoxy)benzene, and a Diazonaphthoquinone

2006 ◽  
Vol 38 (11) ◽  
pp. 1189-1193 ◽  
Author(s):  
Katsuya Sakayori ◽  
Yuji Shibasaki ◽  
Mitsuru Ueda
e-Polymers ◽  
2016 ◽  
Vol 16 (4) ◽  
pp. 295-302 ◽  
Author(s):  
Yonglin Lei ◽  
Yuanjie Shu ◽  
Jinhua Peng ◽  
Yongjian Tang ◽  
Jichuan Huo

AbstractA series of copolyimides were prepared by thermal imidization of poly(amic acid)s (PAAs) derived from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA), 2,3′,3,4′-biphenyltetracarboxylic dianhydride (a-BPDA), p-phenylenediamine (PDA) and 4,4′-oxydialinine (4,4′-ODA) commonly used for the production of commercial polyimides. The flexible copolyimide films were obtained from that the molar ratio of s-BPDA, a-BPDA, PDA and 4,4′-ODA was 9:1:8:2 (Co-PIs-3), 8:2:9:1 (Co-PIs-5) and 8:2:8:2 (Co-PIs-6). These obtained copolyimide films were characterized by Fourier transform-infrared spectroscopy(FT-IR), wide angle X-ray (WAXD), Thermogravimetric (TG), dynamic mechanical thermal analysis (DMA), thermomechanical analysis (TMA), field-emission scanning electron microscopy (FE-SEM) and mechanical properties measurement. The results showed that three copolyimides remained semi-crystalline and exhibited high glass transition temperature (Tg), high thermal stability, great ultimate tensile strength and low coefficient of thermal expansion (CTE). The Co-PIs-5 had lower crystallinity, lower CTE, greater elongation at break, higher Tg and thermal stability and the greater dense extent, compared with Co-PIs-3 and Co-PIs-6. Structure and property relations of the prepared polyimides were also briefly discussed. The results revealed that the copolymerization of s-BPDA/PDA with a small number of 4,4′-ODA/a-BPDA was a useful means for enhancing flexibility without sacrificing low CTE.


Polymers ◽  
2020 ◽  
Vol 12 (4) ◽  
pp. 859 ◽  
Author(s):  
Masatoshi Hasegawa ◽  
Tomoaki Hishiki

A series of ester-linked diamines, with different lengths and substituents, was synthesized to obtain poly(ester imide)s (PEsIs) having improved properties. A substituent-free ester-linked diamine (AB-HQ) was poorly soluble in N-methyl-2-pyrrolidone at room temperature, which forced the need for polyaddition by adding tetracarboxylic dianhydride solid into a hot diamine solution. This procedure enabled the smooth progress of polymerization, however, accompanied by a significant decrease in the molecular weights of poly(amic acid)s (PAAs), particularly when using hydrolytically less stable pyromellitic dianhydride. On the other hand, the incorporation of various substituents (–CH3, –OCH3, and phenyl groups) to AB-HQ was highly effective in improving diamine solubility, which enabled the application of the simple polymerization process without the initial heating of the diamine solutions, and led to PAAs with sufficiently high molecular weights. The introduction of bulkier phenyl substituent tends to increase the coefficients of thermal expansion (CTE) of the PEsI films, in contrast to that of the small substituents (–CH3, –OCH3). The effects of ester-linked diamines, consisting of longitudinally further extended structures, were also investigated. However, this approach was unsuccessful due to the solubility problems of these diamines. Consequently, the CTE values of the PEsIs, obtained using longitudinally further extended diamines, were not as low as we had expected initially. The effects of substituent bulkiness on the target properties, and the dominant factors for water uptake (WA) and the coefficients of hygroscopic expansion (CHE), are also discussed in this study. The PEsI derived from methoxy-sustituted AB-HQ analog and 3,3′,4,4′-biphenyltetracarboxylic dianhydride achieved well-balanced properties, i.e., a very high Tg (424 °C), a very low CTE (5.6 ppm K−1), a low WA (0.41%), a very low CHE value (3.1 ppm/RH%), and sufficient ductility, although the 26 μm-thick film narrowly missed certification of the V-0 standard in the UL-94V test. This PEsI film also displayed a moderate εr (3.18) and a low tan δ (3.14 × 10−3) at 10 GHz under 50% RH and at 23 °C. Thus, this PEsI system is a promising candidate as a novel dielectric substrate material for use in the next generation of high-performance flexible printed circuit boards operating at higher frequencies (≥10 GHz).


1991 ◽  
Vol 227 ◽  
Author(s):  
M. Hasegawa ◽  
H. Arai ◽  
K. Horie ◽  
R. Yokota ◽  
I. Mita

ABSTRACTThe emission mechanisms of solid PI(BPDA/PDA) derived from biphenyltetracarboxylic dianhydride (BPDA) and p-phenylenediamine (PDA) were examined with the absorption and fluorescence. spectra of model compounds (denoted by M). M(BPDA/CHA) (CHA: cyclohexyl amine) fluoresces at ca. 430 nm in hexafluoro-2-propanol(HFP) solution, while M(BPDA/AN) (AN: aniline) does not. PI(BPDA/PDA) film does not show the monomer fluorescence of biphenyldiimide unit, but shows only intermolecular CT fluorescence peaking at 530–540 nm. This suggests that for PI(BPDA/PDA) film and PI(BPDA/AN) in solution the local excited state of biphenyldiimide units is deactivated owing to intramolecular charge-transfer(CT).The intermolecular CT fluorescence reflecting sensitively molecular packing of PI chains was used to monitor isothermal imidization process of poly(amic acid)(PAA) of BPDA/PDA. The fluorescence of PAA(BPDA/PDA) peaking at 490 nm decreases rapidly and disappears at 30–40% conversion, then the fluorescence of PI(BPDA/PDA) peaking at 540 nm increases gradually during isothermal imidization. The fluorescence intensity at 540 nm increases rapidly as imidization proceeds when imidized at higher temperature. A kinetic study on isothermal imidization shows that the vitrification is strongly related to the reorientation of polymer chains and the final PI structures.


2014 ◽  
Vol 27 (2) ◽  
pp. 211-217 ◽  
Author(s):  
Yusuke Inoue ◽  
Yoshihito Ishida ◽  
Tomoya Higashihara ◽  
Atsushi Kameyama ◽  
Shinji Ando ◽  
...  
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