scholarly journals Physical Properties and Stress Analysis of Low Dielectric Polyimide Films Containing Adamantane Pendant Group

2003 ◽  
Vol 35 (9) ◽  
pp. 697-703 ◽  
Author(s):  
Dong Keun Yoo ◽  
Sang Kyun Lim ◽  
Tae Ho Yoon ◽  
Dukjoon Kim
Keyword(s):  
Physical Properties ◽  
Stress Analysis ◽  
Pendant Group ◽  
Polyimide Films ◽  
Low Dielectric

Novel soluble polyimides containing pyridine and fluorinated units: preparation, characterization, and optical and dielectric properties

RSC Advances ◽  
2016 ◽  
Vol 6 (26) ◽  
pp. 21662-21671 ◽  
Author(s):  
Weibing Dong ◽  
Yue Guan ◽  
Dejing Shang
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Dielectric Properties ◽  
Low Dielectric Constant ◽  
Mechanical And Thermal Properties ◽  
Polyimide Films ◽  
Low Dielectric

To acquire low dielectric constant polyimide films with good mechanical and thermal properties and low CTE applied in microelectronic fields, three novel polyimides containing pyridine and –C(CF3)2– groups were firstly designed and synthesized.

Composition design and properties investigation of BPDA/PDA/TFDB co‐polyimide films with low dielectric permittivity

2019 ◽  
Vol 136 (39) ◽  
pp. 47989 ◽  
Author(s):  
Xiaolan Li ◽  
Huanyu Lei ◽  
Jiacong Guo ◽  
Jianhua Wang ◽  
Shengli Qi ◽  
...  
Keyword(s):  
Dielectric Permittivity ◽  
Polyimide Films ◽  
Composition Design ◽  
Low Dielectric

Optically transparent fluoro-containing polyimide films with low dielectric permeability

2014 ◽  
Author(s):  
V. Kravtsova ◽  
M. Umersakova ◽  
R. Iskakov ◽  
O. Prikhodko ◽  
N. Korobova
Keyword(s):  
Dielectric Permeability ◽  
Polyimide Films ◽  
Low Dielectric ◽  
Optically Transparent

A methodology for the preparation of nanoporous polyimide films with low dielectric constants

2006 ◽  
Vol 510 (1-2) ◽  
pp. 241-246 ◽  
Author(s):  
Lizhong Jiang ◽  
Jiugui Liu ◽  
Dezhen Wu ◽  
Hangquan Li ◽  
Riguang Jin
Keyword(s):  
Dielectric Constants ◽  
Polyimide Films ◽  
Low Dielectric

Surface Plasma Characterization of Polyimide Films for Flexible Electronics

2014 ◽  
Vol 970 ◽  
pp. 132-135 ◽  
Author(s):  
Huseyin Kizil ◽  
Meryem Oznur Pehlivaner ◽  
Levent Trabzon
Keyword(s):  
Flexible Electronics ◽  
Inductively Coupled Plasma ◽  
Treatment Time ◽  
Flexible Substrate ◽  
Oxygen Plasma Treatment ◽  
Polyimide Films ◽  
Complete Wetting ◽  
Force Microscopy ◽  
Inductively Coupled ◽  
Low Dielectric

Flexible electronics have drawn much attention due to vast application possibilities. Polyimide was the substrate of choice as a flexible substrate owing to its properties such as good mechanical strength, high temperature resistance, good dimensional stability, and low dielectric constant. The adhesion between metal and polymer substrate plays a crucial role for reliability of these applications and low adhesion was the cause for most failures. In this study, plasma surface treatments were applied on polyimide surface by inductively coupled plasma (ICP) treatment system. The results of contact angle measurements and atomic force microscopy (AFM) show a large increase in surface roughness with increasing treatment time. Complete wetting was found for both argon and oxygen plasma treatment. Analysis of chemical composition by FTIR reveals an increase in carbon-oxygen functional groups and the concentration of oxygen on the surfaces.

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