scholarly journals Synthesis of Photoreactive Imidazole Derivatives and Thermal Curing Reaction of Epoxy Resins Catalyzed by Photo-Generated Imidazole

1997 ◽  
Vol 29 (5) ◽  
pp. 450-456 ◽  
Author(s):  
Tadatomi Nishikubo ◽  
Atsushi Kameyama ◽  
Yoshiyasu Toya
Keyword(s):  
Epoxy Resins ◽  
Thermal Curing ◽  
Imidazole Derivatives ◽  
Curing Reaction

scholarly journals Photo-generation of Poly-functional Thiol and Thermal Curing Reaction of Epoxy Resins Using the Thiol

1994 ◽  
Vol 26 (7) ◽  
pp. 864-867 ◽  
Author(s):  
Tadatomi Nishikubo ◽  
Atsushi Kameyama ◽  
Koutaro Kashiwagi
Keyword(s):  
Epoxy Resins ◽  
Thermal Curing ◽  
Curing Reaction

Synthesis of Three Novel Aromatic Biazomethine Liquid- Crystalline Epoxy Resins and Curing Reaction with Aromatic Diamine

2011 ◽  
Vol 216 ◽  
pp. 34-38
Author(s):  
Jun Gang Gao ◽  
Xiao Na Zhang ◽  
Yong Gang Du
Keyword(s):  
Melting Point ◽  
Epoxy Resins ◽  
Liquid Crystalline ◽  
Diphenyl Ether ◽  
Hydroxyl Group ◽  
Aromatic Diamine ◽  
Curing Reaction ◽  
Ozawa Equation ◽  
Liquid Crystalline Epoxy ◽  
Clearing Temperature

Three class of novel liquid crystalline epoxy resins containing azomething groups: N,N’-Bis[4-(2,3-epoxypropoxy)benzylidene]-4,4-diamino-diphenyl ether (p-BEPBDDE), N,N’-Bis[4-(2,3-epoxypropoxy)benzylidene]-4,4-diamino-diphenyl methane (p-BEPBDDM) and N,N’-Bis[(4-(2,3-epoxypropoxy)-benzyliden)-1,4- phenylene diamine] (p-BEPBPD) were synthesized and characterized. The results show that p-BEBDDE and p-BEBDDM belong to smectic texture and melting point is 239.5 and 178 oC, respectively. The p-BEPBD is nematic texture between its melting temperature (Tm) of 192 oC and clearing temperature (Ti) of 238 oC. The curing reaction can be described by Ozawa equation, and the alcohol-hydroxyl group can accelerate the curing reaction and decrease Ea in DSC experiment.

Warpage Behaviors of System-in-Packages on a Substrate Strip

2018 ◽  
Vol 2018 (1) ◽  
pp. 000344-000348
Author(s):  
Eric Ouyang ◽  
Billy Ahn ◽  
SeonMo Gu ◽  
Jim Hsu ◽  
Yonghyuk Jeong ◽  
...  
Keyword(s):  
Material Characterization ◽  
Epoxy Resins ◽  
Curing Process ◽  
Molding Compound ◽  
Advanced Material ◽  
Curing Reaction ◽  
Different Types ◽  
The Impact ◽  
Compound Materials ◽  
Kinetics Of

Abstract In this paper, the impact of two different types of warpage, strip warpage and system-in-packages (SiP) module warpage, are considered and studied, both experimentally and numerically. An advanced material characterization method is also conducted to study the curing reaction and Pressure-Volume-Temperature-Cure (PVTC) kinetics of the packages. The curing reaction of epoxy resins, as a function of temperature and activation energies, is experimentally determined. During the curing process, the viscosity of epoxy resins change with temperature and conversion rate. The Castro-Macosko model is adopted to describe the rheological properties of epoxy resins. Experimentally, we have prepared substrate strip samples with different component density and molding compound materials. Each substrate strip contains eighteen system-in-packages. The warpages of all substrate strips and all the system-in-package modules were measured, compared, and correlated.

A Kinetic Analysis of a Thermal Curing Reaction of a Silicon Resin in Solid State

2014 ◽  
pp. 63-72
Author(s):  
Florence Vivier ◽  
Diego Santamaria ◽  
Diego Pellerej ◽  
Pietro Buonfico ◽  
Marco Sangermano
Keyword(s):  
Solid State ◽  
Kinetic Analysis ◽  
Thermal Curing ◽  
Curing Reaction ◽  
Silicon Resin

scholarly journals Tuning Exothermic Curing Reaction of Hydrogenated Bisphenol A Epoxy Resins for Stone Conservation

2012 ◽  
Vol 28 (2) ◽  
pp. 131-139 ◽  
Author(s):  
Yong-Seok Choi ◽  
You-Jin Park ◽  
Yong-Soo Kang ◽  
Jong-Ok Won ◽  
Jeong-Jin Kim ◽  
...  
Keyword(s):  
Bisphenol A ◽  
Epoxy Resins ◽  
Stone Conservation ◽  
Curing Reaction
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