The life prediction on typical coatings of Printed Circuit Board through accelerated degradation modeling

2015 ◽  
pp. 2113-2117
Author(s):  
Liwei Sun ◽  
Xiaohui Wang ◽  
Guilin Zhang ◽  
Jinquan Xuan ◽  
Jian Gao
Keyword(s):  
Life Prediction ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Accelerated Degradation ◽  
Degradation Modeling

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

2013 ◽  
Author(s):  
Takahiro Omori ◽  
Kenji Hirohata ◽  
Tomoko Monda ◽  
Minoru Mukai
Keyword(s):  
Crack Propagation ◽  
Life Prediction ◽  
Large Scale ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Electronic Packages ◽  
Printed Circuit ◽  
Bga Package ◽  
The Relationship

There is high demand for fatigue life prediction of solder joints in electronic packages such as ball grid arrays (BGAs). A key component of fatigue life prediction technology is a canary device, which warns of the impending risk of failure through loss of function before other important parts become severely impaired. In a BGA package, thermal fatigue of solder joints normally starts from the solder joints at the outermost part of the package. This can be taken advantage of by using the outermost solder joints as canary devices for detecting the degree of cumulative mechanical fatigue damage. To accurately estimate the lifetimes of other functional solder joints, it is essential to understand the relationship between the fatigue lives of canary joints and other functional joints. Damage path simulation is therefore proposed for predicting the crack propagation in solder joints on electronic packages through numerical simulation. During the process of designing the layout of canary joints and other joints, it is very useful to know not only the relationship between the fatigue lives of the canary and other joints, but also the path of crack propagation through all joints. This paper presents a method for estimating the relationship between the fatigue lives of canary joints and other joints by using damage path simulation. Some BGA packages mounted on a printed circuit board are modeled to demonstrate the process of estimating the lifetime of each joint under thermal cycle loading. A large-scale finite element model is used to accurately represent the geometrical properties of the printed circuit board and package. Both crack initiation and crack propagation processes can be simultaneously evaluated by modeling all of the solder joints on each package. The results show that damage path simulation and large-scale modeling are useful for determining the layout of canary joints in electronic packages.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips

2006 ◽  
Author(s):  
Jun-Xian Fu ◽  
Shukri Souri ◽  
James S. Harris
Keyword(s):  
Reliability Analysis ◽  
Printed Circuit Board ◽  
Light Emitting Diode ◽  
Circuit Board ◽  
Light Emitting ◽  
Printed Circuit ◽  
Root Cause ◽  
Micro Cracks ◽  
Temperature And Humidity

Abstract Temperature and humidity dependent reliability analysis was performed based on a case study involving an indicator printed-circuit board with surface-mounted multiple-die red, green and blue light-emitting diode chips. Reported intermittent failures were investigated and the root cause was attributed to a non-optimized reflow process that resulted in micro-cracks and delaminations within the molding resin of the chips.

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