Improvement of current blocking for GaN-based LEDs by treatments of Ar plasma on p-GaN surface

2013 ◽  
pp. 261-264
Author(s):  
X Zeng ◽  
S Chang ◽  
H Lo ◽  
Shih-Chang Shei
Keyword(s):  
2013 ◽  
Vol 2013 ◽  
pp. 1-5
Author(s):  
X. F. Zeng ◽  
S. C. Shei ◽  
H. M. Lo ◽  
S. J. Chang

We successfully demonstrated that the Arplasmatreatment p-GaN surface increased the contact resistance of ITO/P-GaN serving as injection current deflection layer under the electrode pad. It was found that theVfvalues of the two LEDs at 20 mA were approximately 3.3 V. Under a 20 mA current injection, it was found that output powers of conventional LED and Ar-plasma-treatment LED on p-GaN surfaces were 9.8 and 11.08 mW, respectively. We can increase the output power of GaN LEDs in 13% due to current blocking on the surface of p-GaN under the electrode pad by inserting the treatment with Ar plasma. It was also found that, after the reliability test for 72 hours the half lifetimes of conventional LEDs and LEDs with Ar-plasma treatment on p-GaN surface were about 49% and 55%, corresponding to the initial intensity, respectively.


Materials ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1595
Author(s):  
Nomin Lim ◽  
Yeon Sik Choi ◽  
Alexander Efremov ◽  
Kwang-Ho Kwon

This research work deals with the comparative study of C6F12O + Ar and CF4 + Ar gas chemistries in respect to Si and SiO2 reactive-ion etching processes in a low power regime. Despite uncertain applicability of C6F12O as the fluorine-containing etchant gas, it is interesting because of the liquid (at room temperature) nature and weaker environmental impact (lower global warming potential). The combination of several experimental techniques (double Langmuir probe, optical emission spectroscopy, X-ray photoelectron spectroscopy) allowed one (a) to compare performances of given gas systems in respect to the reactive-ion etching of Si and SiO2; and (b) to associate the features of corresponding etching kinetics with those for gas-phase plasma parameters. It was found that both gas systems exhibit (a) similar changes in ion energy flux and F atom flux with variations on input RF power and gas pressure; (b) quite close polymerization abilities; and (c) identical behaviors of Si and SiO2 etching rates, as determined by the neutral-flux-limited regime of ion-assisted chemical reaction. Principal features of C6F12O + Ar plasma are only lower absolute etching rates (mainly due to the lower density and flux of F atoms) as well as some limitations in SiO2/Si etching selectivity.


2011 ◽  
Vol 109 (2) ◽  
pp. 023301 ◽  
Author(s):  
J. Henriques ◽  
E. Tatarova ◽  
C. M. Ferreira
Keyword(s):  

1991 ◽  
Vol 27 (8) ◽  
pp. 661 ◽  
Author(s):  
H. Hamada ◽  
M. Shono ◽  
S. Honda ◽  
R. Hiroyama ◽  
K. Matsukawa ◽  
...  

2018 ◽  
Vol 225 ◽  
pp. 121-127 ◽  
Author(s):  
Laura Pastor-Pérez ◽  
Victor Belda-Alcázar ◽  
Carlo Marini ◽  
M. Mercedes Pastor-Blas ◽  
Antonio Sepúlveda-Escribano ◽  
...  

2009 ◽  
Vol 11 (5) ◽  
pp. 576-581 ◽  
Author(s):  
Zhang Suzhen ◽  
Cheng Cheng ◽  
Lan Yan ◽  
Meng Yuedong

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