Thermal system diagnostics through signal modeling

2013 ◽  
pp. 469-473
Author(s):  
D Wójcicka-Migasiuk
Keyword(s):  
Thermal System ◽  
Signal Modeling

A New Deprocess Flow of Failure Analysis for MEMS Motion Sensor

2013 ◽  
Author(s):  
Chun-An Huang ◽  
Han-Yun Long ◽  
King-Ting Chiang ◽  
Li Chuang ◽  
Kevin Tsui
Keyword(s):  
Failure Analysis ◽  
Optical Microscopy ◽  
Motion Sensor ◽  
Thermal System ◽  
Layer By Layer ◽  
Sensor Failure ◽  
Process Flow ◽  
New Process ◽  
Cutting System ◽  
Successful Observation

Abstract This paper demonstrates a new de-process flow for MEMS motion sensor failure analysis, using layer by layer deprocessing to locate defect points. Analysis tools used in this new process flow include IR optical microscopy, thermal system, SEM and a cutting system to de-process of MEMS motion sensor and successful observation defect points.

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