Fatigue Characterization of Lead- Free Solders

2012 ◽  
Keyword(s):  
Lead Free ◽  
Lead Free Solders

scholarly journals Phase equilibria investigation and alloys characterization in Sn-In-Ag system

2008 ◽  
Vol 62 (3) ◽  
pp. 148-152
Author(s):  
Aleksandra Milosavljevic ◽  
Dragana Zivkovic ◽  
Dragan Manasijevic ◽  
Nadezda Talijan ◽  
Aleksandar Grujic ◽  
...  
Keyword(s):  
Phase Equilibria ◽  
Xrd Analysis ◽  
Lead Free ◽  
Solder Alloys ◽  
Standard Lead ◽  
Free Solder ◽  
Dsc Method ◽  
Lead Free Solders ◽  
Thermocalc Software

Lead-free soldering has become very popular in the world recently, especially in electronics, because of high ecological demands in industry. Some of lead-free solder alloys are already used in electronic industry, but despite that investigations are still going in order to find suitable replacement for Pb-Sn standard solder. In this paper phase equilibria and characterization of Sn-In-Ag alloys in section In:Ag = 7:3 are investigated. The results of phase diagram calculation are obtained by ThermoCalc software, and characteristic temperatures by DSC method. The results of XRD analysis, optical microscopy, microhardness and electrical conductivity are also presented. These results are given in order to contribute the knowledge about lead-free solders, especially Sn-In-Ag solder alloys, which are potential candidates for replacement standard lead solders.

Thermal property, wettability and interfacial characterization of novel Sn–Zn–Bi–In alloys as low-temperature lead-free solders

2015 ◽  
Vol 84 ◽  
pp. 331-339 ◽  
Author(s):  
Jian-Chun Liu ◽  
Gong Zhang ◽  
Zheng-Hong Wang ◽  
Ju-Sheng Ma ◽  
Katsuaki Suganuma
Keyword(s):  
Low Temperature ◽  
Thermal Property ◽  
Lead Free ◽  
Lead Free Solders

Characterization of Low-Melting-Point Sn-Bi-In Lead-Free Solders

2016 ◽  
Vol 45 (11) ◽  
pp. 5800-5810 ◽  
Author(s):  
Qin Li ◽  
Ninshu Ma ◽  
YongPing Lei ◽  
Jian Lin ◽  
HanGuang Fu ◽  
...  
Keyword(s):  
Melting Point ◽  
Lead Free ◽  
Lead Free Solders

Characterization of Lead-Free Solder Interconnects Reliability Under Torsional Loads

2009 ◽  
Author(s):  
Vikram Srinivas ◽  
Moustafa Al-Bassyiouni ◽  
Michael Osterman ◽  
Michael Pecht
Keyword(s):  
Rapid Assessment ◽  
Lead Free ◽  
Solder Paste ◽  
Solder Interconnects ◽  
Portable Electronics ◽  
Snpb Solder ◽  
Torsional Loads ◽  
Free Solder ◽  
Lead Free Solders

Mechanical torsion loads often arise in portable electronics under life cycle conditions. With increased market pressure, drive to reduce time to market, and varying use conditions, it is critical to develop accelerated tests to evaluate reliability quickly. Mechanical torsion testing can provide a rapid assessment technique to characterize solder interconnect durability. This paper presents an evaluation of select lead-free solders, SAC305 (96.5Sn-3.0Ag-0.5Cu) and SN100C (99.25Sn-0.7Cu-0.05Ni+Ge), under mechanical torsion loading. For comparison, SnPb (63Sn-37Pb) solder was also evaluated. Common test vehicles with resistor 2512 packages were used for these tests. For the mechanical cycle tests, no statistical difference in reliability was observed between SAC305 and SnPb solder paste while SN100C solder pastes were found to exhibit lower durability during Weibull analysis.

Mechanical characterization of Sn–Ag-based lead-free solders

2002 ◽  
Vol 42 (6) ◽  
pp. 951-966 ◽  
Author(s):  
Masazumi Amagai ◽  
Masako Watanabe ◽  
Masaki Omiya ◽  
Kikuo Kishimoto ◽  
Toshikazu Shibuya
Keyword(s):  
Mechanical Characterization ◽  
Lead Free ◽  
Lead Free Solders
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