Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

Journal of Adhesion Science and Technology ◽

10.1163/156856108x325055 ◽

2008 ◽

Vol 22 (14) ◽

pp. 1631-1657 ◽

Cited By ~ 16

Author(s):

Y. C. Lin ◽

X. Chen

Keyword(s):

Electronic Packaging ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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Reliability Of Anisotropic Conductive Adhesive Joints In Electronic Packaging Applications

Electrically Conductive Adhesives ◽

10.1163/ej.9789004165922.i-426.68 ◽

2010 ◽

pp. 155-184

Author(s):

Y. C. Lin ◽

X. Chen

Keyword(s):

Electronic Packaging ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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Reliability Testing and Modeling of Anisotropic Conductive Adhesive Joints Under Temperature Cycling Test

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2012.2230399 ◽

2013 ◽

Vol 3 (9) ◽

pp. 1512-1523 ◽

Cited By ~ 7

Author(s):

Kirsi Saarinen ◽

Laura Frisk

Keyword(s):

Adhesive Joints ◽

Temperature Cycling ◽

Conductive Adhesive ◽

Reliability Testing ◽

Cycling Test ◽

Anisotropic Conductive Adhesive ◽

Temperature Cycling Test

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Modelling the effect of voids in anisotropic conductive adhesive joints

Soldering & Surface Mount Technology ◽

10.1108/09540910510579195 ◽

2005 ◽

Vol 17 (1) ◽

pp. 4-12 ◽

Cited By ~ 8

Author(s):

K.K. Lee ◽

N.H. Yeung ◽

Y.C. Chan

Keyword(s):

Adhesive Joints ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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A Multi-physics Simulation Based Parameters Optimization for Anisotropic Conductive Adhesive Interconnection in Electronic Packaging

Intelligent Robotics and Applications - Lecture Notes in Computer Science ◽

10.1007/978-3-540-88518-4_96 ◽

2008 ◽

pp. 896-905

Author(s):

ZhengJia Wang ◽

Yuhui Wang ◽

Zhouping Yin

Keyword(s):

Electronic Packaging ◽

Parameters Optimization ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Simulation Based ◽

Physics Simulation

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Reliability of Self-Assembly Vertical Interconnects in Magnetically Aligned Anisotropic Conductive Adhesive for Electronic Packaging Applications

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2013.2246566 ◽

2013 ◽

Vol 13 (3) ◽

pp. 413-419 ◽

Cited By ~ 1

Author(s):

Sungwook Moon

Keyword(s):

Self Assembly ◽

Electronic Packaging ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Vertical Interconnects ◽

Magnetically Aligned

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Shear strength of anisotropic conductive adhesive joints under hygrothermal aging and thermal cycling

International Journal of Adhesion and Adhesives ◽

10.1016/j.ijadhadh.2011.11.007 ◽

2012 ◽

Vol 33 ◽

pp. 75-79 ◽

Cited By ~ 23

Author(s):

LiLan Gao ◽

Xu Chen ◽

Hong Gao

Keyword(s):

Shear Strength ◽

Thermal Cycling ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Hygrothermal Aging ◽

Anisotropic Conductive Adhesive

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Effects of hygrothermal aging on anisotropic conductive adhesive joints: experiments and theoretical analysis

Journal of Adhesion Science and Technology ◽

10.1163/156856106778456654 ◽

2006 ◽

Vol 20 (12) ◽

pp. 1383-1399 ◽

Cited By ~ 30

Author(s):

Y. C. Lin ◽

X. Chen ◽

Z. P. Wang

Keyword(s):

Theoretical Analysis ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Hygrothermal Aging ◽

Anisotropic Conductive Adhesive

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Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365373 ◽

2006 ◽

Cited By ~ 2

Author(s):

Ales Duraj ◽

Pavel Mach

Keyword(s):

Adhesive Joints ◽

Conductive Adhesive ◽

Diagnostic Tools ◽

Anisotropic Conductive Adhesive

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Effect of misalignment on the electrical characteristics of anisotropic conductive adhesive joints

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008321 ◽

2003 ◽

Cited By ~ 2

Author(s):

S.H. Fan ◽

Y.C. Chan

Keyword(s):

Adhesive Joints ◽

Conductive Adhesive ◽

Electrical Characteristics ◽

Anisotropic Conductive Adhesive

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