Effect of misalignment on the electrical characteristics of anisotropic conductive adhesive joints

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008321 ◽

2003 ◽

Cited By ~ 2

Author(s):

S.H. Fan ◽

Y.C. Chan

Keyword(s):

Adhesive Joints ◽

Conductive Adhesive ◽

Electrical Characteristics ◽

Anisotropic Conductive Adhesive

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Reliability Testing and Modeling of Anisotropic Conductive Adhesive Joints Under Temperature Cycling Test

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2012.2230399 ◽

2013 ◽

Vol 3 (9) ◽

pp. 1512-1523 ◽

Cited By ~ 7

Author(s):

Kirsi Saarinen ◽

Laura Frisk

Keyword(s):

Adhesive Joints ◽

Temperature Cycling ◽

Conductive Adhesive ◽

Reliability Testing ◽

Cycling Test ◽

Anisotropic Conductive Adhesive ◽

Temperature Cycling Test

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Modelling the effect of voids in anisotropic conductive adhesive joints

Soldering & Surface Mount Technology ◽

10.1108/09540910510579195 ◽

2005 ◽

Vol 17 (1) ◽

pp. 4-12 ◽

Cited By ~ 8

Author(s):

K.K. Lee ◽

N.H. Yeung ◽

Y.C. Chan

Keyword(s):

Adhesive Joints ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

Electrically Conductive Adhesives ◽

10.1201/b12245-12 ◽

2008 ◽

pp. 165-192

Keyword(s):

Electronic Packaging ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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Shear strength of anisotropic conductive adhesive joints under hygrothermal aging and thermal cycling

International Journal of Adhesion and Adhesives ◽

10.1016/j.ijadhadh.2011.11.007 ◽

2012 ◽

Vol 33 ◽

pp. 75-79 ◽

Cited By ~ 23

Author(s):

LiLan Gao ◽

Xu Chen ◽

Hong Gao

Keyword(s):

Shear Strength ◽

Thermal Cycling ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Hygrothermal Aging ◽

Anisotropic Conductive Adhesive

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Effects of hygrothermal aging on anisotropic conductive adhesive joints: experiments and theoretical analysis

Journal of Adhesion Science and Technology ◽

10.1163/156856106778456654 ◽

2006 ◽

Vol 20 (12) ◽

pp. 1383-1399 ◽

Cited By ~ 30

Author(s):

Y. C. Lin ◽

X. Chen ◽

Z. P. Wang

Keyword(s):

Theoretical Analysis ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Hygrothermal Aging ◽

Anisotropic Conductive Adhesive

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Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints

2006 29th International Spring Seminar on Electronics Technology ◽

10.1109/isse.2006.365373 ◽

2006 ◽

Cited By ~ 2

Author(s):

Ales Duraj ◽

Pavel Mach

Keyword(s):

Adhesive Joints ◽

Conductive Adhesive ◽

Diagnostic Tools ◽

Anisotropic Conductive Adhesive

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Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

Journal of Adhesion Science and Technology ◽

10.1163/156856108x325055 ◽

2008 ◽

Vol 22 (14) ◽

pp. 1631-1657 ◽

Cited By ~ 16

Author(s):

Y. C. Lin ◽

X. Chen

Keyword(s):

Electronic Packaging ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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Investigation of Electrical Contact Mechanism for Anisotropic Conductive Adhesive Joints After the Thermocompression

IEEE Transactions on Device and Materials Reliability ◽

10.1109/tdmr.2012.2210554 ◽

2013 ◽

Vol 13 (1) ◽

pp. 54-65 ◽

Cited By ~ 8

Author(s):

Su-Tsai Lu ◽

Han-Min Chu ◽

Wen-Hwa Chen

Keyword(s):

Electrical Contact ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Contact Mechanism

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Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431) ◽

10.1109/adhes.2000.860588 ◽

2002 ◽

Cited By ~ 21

Author(s):

Y.C. Chan ◽

K.C. Hung ◽

C.W. Tang ◽

C.M.L. Wu

Keyword(s):

Flip Chip ◽

Adhesive Joints ◽

Conductive Adhesive ◽

Degradation Mechanisms ◽

Anisotropic Conductive Adhesive

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Investigation of Mechanical and Electrical Characteristics for Cracked Conductive Particle in Anisotropic Conductive Adhesive (ACA) Assembly

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2008.916802 ◽

2008 ◽

Vol 31 (2) ◽

pp. 361-369 ◽

Cited By ~ 9

Author(s):

Bin Xie ◽

X.Q. Shi ◽

Han Ding

Keyword(s):

Conductive Adhesive ◽

Electrical Characteristics ◽

Conductive Particle ◽

Anisotropic Conductive Adhesive

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