Logic Gates and Circuit Components

2017 ◽  
pp. 17-40
Author(s):  
Julio Sanchez ◽  
Maria P. Canton
2017 ◽  
Vol 68 (3) ◽  
pp. 188-193
Author(s):  
Cajethan M. Nwosu ◽  
Anthony I. Umeogamba ◽  
Cosmas U. Ogbuka

AbstractA novel single-phase digital control circuit-based five level inverter (FLI) is presented in this paper. Based on the determined switching angle, one switching cycle of the inverter is divided into segments from which the switching sequence of the inverter switches is digitized. A programmed counter built aroundJ−Kflip flops with logic gates provided the needed switching signals for theH-bridge inverter. Proposed inverter is verified through simulation in a MATLAB/SIMULINK environment and simulation results are given. Simulation results show notable reduction in total harmonic distortion (THD) in the inverter output voltage and load current. With an RL load (of 200 Ω and 0.250H), a single digit THD of 8.5 1% for the inverter load current is realized. Comparison of the novel control circuit-dependent FLI with the conventional and contemporary power-circuit-dependent cascadedH-bridge inverter (CHBI) show that the novel FLI is synthesized with lesser number of power circuit and control circuit components.


Author(s):  
S. Khadpe ◽  
R. Faryniak

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.


2016 ◽  
Vol E99.C (2) ◽  
pp. 285-292 ◽  
Author(s):  
Tran THI THU HUONG ◽  
Hiroshi SHIMADA ◽  
Yoshinao MIZUGAKI

Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.


Author(s):  
Jiko Raut ◽  
Prithidipa Sahoo

Abstract:: Thiol-containing amino acids and peptides play crucial roles in many physiological processses. For example, Cysteine (Cys) and Homocysteine (Hcy) are considered to be related to a number of health disorders such as renal failure, AIDS, Alzheimer’s and Parkinson’s diseases, atherosclerotic cardiovascular diseases, neutral tube defects, and coronary heart disease. Glutathione (GSH), an important tripeptide with a thiol group, performs vital biological functions that are in-volved in combating oxidative stress and maintaining redox homeostasis. Cysteine also plays important roles in our bodies as an antioxidant, a metal cofactor binder in enzymes, and a protein structure stabilizer by disulfide bond formation in the proteins. Hcy are involved in cellular growth and GSH in redox homeostasis. Hence, the rapid, sensitive, and selective de-tection of such biothiols is of considerable importance and significant interest. Different fluorescent chemosensors have been introduced to develop and improve the detection techniques and accuracy of these biothiols. In this review article we have presented some research works to show a guiding principle for the design of effective chemosensors which are highly sensitive and selective for the detection of particular a group of biothiols in aqueous medium. In line with these develop-ments, the researchers have developed novel chemosensors that signal binding events of these above mentioned biothiols through their optical properties. The binding mechanism and properties have also been established with different theoretical studies. Their applications in the form of colorimetric kit, logic gates, live cell imaging, and quantification from different bi-ological samples have also been developed.


2020 ◽  
Vol 10 (4) ◽  
pp. 369-380
Author(s):  
K. Maji ◽  
K. Mukherjee ◽  
A. Raja

All optical tri-state frequency encoded logic gates NOT and NAND are proposed and numerically investigated using TOAD based interferometric switch for the first time to the best of our knowledge. The optical power spectrum, extinction ratio, contrast ration, and amplified spontaneous noise are calculated to analyze and confirm practical feasibility of the gates. The proposed device works for low switching energy and has high contrast and extinction ratio as indicated in this work.


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