3D Technology Platform

2011 ◽  
pp. 121-138 ◽  
Author(s):  
Mark Privett
Keyword(s):  
3D Technology ◽  
Technology Platform

The European 3D Technology Platform (e-CUBES)

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000446-000501 ◽  
Author(s):  
Peter Ramm ◽  
Armin Klumpp ◽  
Josef Weber ◽  
Thomas Fritzsch ◽  
Maaike Taklo ◽  
...  
Keyword(s):  
System Integration ◽  
High Performance ◽  
Technological Development ◽  
Low Cost ◽  
Market Potential ◽  
3D Integration ◽  
3D Technology ◽  
Critical Dimensions ◽  
Technology Platform ◽  
Integration Technology

The European 3D technology platform that has been established represents the ensemble of 3D integration technologies which were developed within the e-CUBES project [http://www.ecubes.org]. It became evident that the fabrication of e-CUBES with their need for high-level miniaturization can only be realized by system integration technologies which use the third dimension. The main objective is to provide 3D integration technologies which on the one hand increase the performance sufficiently and at the same time allow for low cost fabrication in order to achieve products with a large market potential. The work was focussed on the requirements coming from application demonstrators. However, other requirements set by taking the visionary approach of developing strongly miniaturized micro/nano-systems were also a major task of the work. Research and technological development was necessary in the following fields in order to achieve the objectives. Seven corresponding technologies were successfully developed building a European platform on 3D Integration. This is considered to be essential output of the e-CUBES project. These are in the 3D integration categoriesVertical System Integration (3D-SOC): Fraunhofer IZM-M's Through-Si Via (TSV) Technology (ICV-SLID) and SINTEF's Hollow Via & Gold Stud Bump Bonding (HoViGo),Chip Stacking (3D-WLP): IMEC / Fraunhofer IZM's Thin-Chip-Integration Technology (TCI/UTCS) and CEA-LETI's Via Belt Technology, and3D Assembly (3D-SIP): 3D-PLUS' High Performance Package-in-Package (HiPPiP) and Wireless Die-on-Die (WDoD) Technologies, as well as Tyndall's Submicron Wire Anisotropic Conductive Film Technology (SW-ACF). Four optimized 3D integration technologies were successfully used in the development of three e-CUBES application demonstrators: Thin-Chip-Integration technology (TCI/UTCS) for Philips' Health & Fitness demonstrator, TSV technology ICV-SLID and HoViGo for Infineon's Automotive demonstrator (TPMS) and Package-in-Package technology HiPPiP for Thales' Aeronautic demonstrator. The 3D integration technologies which form part of the established e-CUBES platform will be presented including key characteristics, critical dimensions, electrical parameters and adaptability to new applications.

3D Technology Platform

2011 ◽  
pp. 139-152
Author(s):  
Scott Sullivan
Keyword(s):  
3D Technology ◽  
Technology Platform

First-Ever Built Magnetically Driven Micropump Using 3D Technology for VAD and ECMO Studies in a Mouse Model

2020 ◽  
Author(s):  
N. Madrahimov ◽  
K. Alhussini ◽  
V. Sales ◽  
D. Radakovic ◽  
K. Penov ◽  
...  
Keyword(s):  
Mouse Model ◽  
3D Technology

National technology platform - SmartGrids Austria

2009 ◽  
Author(s):  
A. Lugmaier ◽  
H. Fechner ◽  
W. Pruggler ◽  
F. Kupzog
Keyword(s):  
Technology Platform ◽  
National Technology

Clinical Utility of an Exoskeleton Robot Using 3-Dimensional Scanner Modeling in Burn Patient: A Case Report

2021 ◽  
Author(s):  
So Young Joo ◽  
Seung Yeol Lee ◽  
Yoon Soo Cho ◽  
Sangho Yi ◽  
Cheong Hoon Seo
Keyword(s):  
Burn Injury ◽  
Hand Function ◽  
Three Dimensional ◽  
The Body ◽  
3D Technology ◽  
Early Management ◽  
3 Dimensional ◽  
Exoskeleton Robot ◽  
Physical Abilities ◽  
Upper Limb Dysfunction

Abstract Hands are the part of the body that are most commonly involved in burns, and the main complications are finger joint contractures and nerve injuries. Hypertrophic scarring cannot be avoided despite early management of acute hand burn injuries, and some patients may need application of an exoskeleton robot to restore hand function. To do this, it is essential to individualize the customization of the robot for each patient. Three-dimensional (3D) technology, which is widely used in the field of implants, anatomical models, and tissue fabrication, makes this goal achievable. Therefore, this report is a study on the usefulness of an exoskeleton robot using 3D technology for patients who lost bilateral hand function due to burn injury. Our subject was a 45-year-old man with upper limb dysfunction of 560 days after a flame and chemical burn injury, with resultant impairment of manual physical abilities. After wearing an exoskeleton robot made using 3D printing technology, he could handle objects effectively and satisfactorily. This innovative approach provided considerable advantages in terms of customization of size and reduction in manufacturing time and costs, thereby showing great potential for use in patients with hand dysfunction after burn injury.

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