Combined Modes of Heat Transfer for Electronic Equipment

2000 ◽  
Keyword(s):  
Heat Transfer ◽  
Electronic Equipment

Turbulent Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources

1994 ◽  
Vol 116 (3) ◽  
pp. 577-587 ◽  
Author(s):  
S. H. Kim ◽  
N. K. Anand
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Electronic Equipment ◽  
Turbulent Heat Transfer ◽  
Turbulent Heat ◽  
Computational Domain ◽  
Heat Sources ◽  
Parallel Plates ◽  
Wide Range ◽  
Independent Parameters

Two-dimensional turbulent heat transfer between a series of parallel plates with surface mounted discrete block heat sources was studied numerically. The computational domain was subjected to periodic conditions in the streamwise direction and repeated conditions in the cross-stream direction (Double Cyclic). The second source term was included in the energy equation to facilitate the correct prediction of a periodically fully developed temperature field. These channels resemble cooling passages in electronic equipment. The k–ε model was used for turbulent closure and calculations were made for a wide range of independent parameters (Re, Ks/Kf, s/w, d/w, and h/w). The governing equations were solved by using a finite volume technique. The numerical procedure and implementation of the k–ε model was validated by comparing numerical predictions with published experimental data (Wirtz and Chen, 1991; Sparrow et al., 1982) for a single channel with several surface mounted blocks. Computations were performed for a wide range of Reynolds numbers (5 × 104–4 × 105) and geometric parameters and for Pr = 0.7. Substrate conduction was found to reduce the block temperature by redistributing the heat flux and to reduce the overall thermal resistance of the module. It was also found that the increase in the Reynolds number decreased the thermal resistance. The study showed that the substrate conduction can be an important parameter in the design and analysis of cooling channels of electronic equipment. Finally, correlations for the friction factor (f) and average thermal resistance (R) in terms of independent parameters were developed.

scholarly journals Numerical Assessment of Heat Transfer and Entropy Generation of a Porous Metal Heat Sink for Electronic Cooling Applications

Energies ◽  
2020 ◽  
Vol 13 (15) ◽  
pp. 3851
Author(s):  
Hamed Rasam ◽  
Prosun Roy ◽  
Laura Savoldi ◽  
Shabnam Ghahremanian
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Entropy Generation ◽  
Heat Sink ◽  
Cooling System ◽  
Solid Phase ◽  
Porous Metal ◽  
Electronic Equipment ◽  
Bejan Number ◽  
Pore Density

In the present study, the thermal performance of an electronic equipment cooling system is investigated. The heat sink used in the current cooling system consists of a porous channel with a rectangular cross-section that is assumed to be connected directly to the hot surface of an electronic device. In this modeling, a fully developed flow assumption is used. The Darcy–Brinkman model was used to determine the fluid flow field. Since using the local thermal equilibrium (LTE) model may provide results affected by the error in metal foams, in the present research, an attempt has first been made to examine the validity range of this model. The local thermal non-equilibrium (LTNE) model taking into account the viscous dissipation effect was then used to determine the temperature field. To validate the numerical solution, the computed results were compared with other studies, and an acceptable agreement was observed. Analysis of the temperature field shows that if the fluid–solid-phase thermal conductivity ratio is 1 or the Biot number has a large value, the difference between the temperature of the solid phase and the fluid phase decreases. Moreover, the effect of important hydrodynamic parameters and the porous medium characteristics on the field of hydrodynamic, heat, and entropy generation was studied. Velocity field analysis shows that increasing the pore density and reducing the porosity cause an increase in the shear stress on the walls. By analyzing the entropy generation, it can be found that the irreversibility of heat transfer has a significant contribution to the total irreversibility, leading to a Bejan number close to 1. As a guideline for the design of a porous metal heat sink for electronic equipment, the use of porous media with low porosity reduces the total thermal resistance and improves heat transfer, reducing the total irreversibility and the Bejan number. Moreover, the increasing of pore density increases the specific porous surface; consequently, it reduces the total irreversibility and Bejan number and improves the heat transfer.

Sixty-Five Years of Extended Surface Technology (1922–1987)

1988 ◽  
Vol 41 (9) ◽  
pp. 321-364 ◽  
Author(s):  
Allan D. Kraus
Keyword(s):  
Heat Transfer ◽  
Mass Transfer ◽  
Heat And Mass Transfer ◽  
Heat Exchangers ◽  
Electronic Equipment ◽  
Numerical Analyses ◽  
Compact Heat Exchangers ◽  
Extended Surface ◽  
Mathematical Techniques

The extended surface literature from 1922 to 1987 is reviewed. The review begins with the classic NACA report of Harper and Brown published in 1922 and concludes with the works of Marto, Wanniarachchi, Rose, Mitrou, and Razelos published in 1986. A section entitled “The Beginnings” traces the accomplishments of the pioneers and it covers the period from 1922 to 1945 which coincides with the publication of Gardner’s landmark paper. At this point, a chronological approach is abandoned in favor of a categorization into topical areas. These are the elimination of the Murray–Gardner assumptions, boiling and condensation, experimental endeavors, compact heat exchangers, internally finned configurations, numerical analyses, optimizations, analyses of finned arrays, and additional topics including the use of extended surface to augment heat transfer, heat transfer in electrical and electronic equipment, purely mathematical techniques, and heat and mass transfer.

scholarly journals Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

2021 ◽  
Vol 39 (2) ◽  
pp. 451-459
Author(s):  
Zhengde Wang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Electronic Devices ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Source Analysis ◽  
Power Electronic ◽  
Cooling Performance ◽  
Scheme Design

In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

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