Mechanical Reliability Improvement

Mechanical Reliability Improvement—Probability and Statistics for Experimental Testing

Technometrics ◽

10.1198/tech.2003.s171 ◽

2003 ◽

Vol 45 (4) ◽

pp. 367-368

Author(s):

Charles Annis

Keyword(s):

Experimental Testing ◽

Mechanical Reliability ◽

Reliability Improvement ◽

Probability And Statistics

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Mechanical reliability improvement by the internal resorption type laser dicing

The Proceedings of Mechanical Engineering Congress Japan ◽

10.1299/jsmemecj.2017.j2210202 ◽

2017 ◽

Vol 2017 (0) ◽

pp. J2210202

Author(s):

Daisuke KAWAGUCHI ◽

Yusuke SEKIMOTO ◽

Hiroki KIYOTA ◽

Keisuke HARA ◽

Yasunori IGASAKI

Keyword(s):

Mechanical Reliability ◽

Reliability Improvement

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Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices

Journal of Welding and Joining ◽

10.5781/jwj.2019.37.5.7 ◽

2019 ◽

Vol 37 (5) ◽

pp. 477-481

Author(s):

Byung-Seung Yim ◽

Jin-Nam Kim ◽

Jong-Min Kim

Keyword(s):

Material Properties ◽

Electronic Devices ◽

Mechanical Reliability ◽

Reliability Improvement ◽

Underfill Material

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Mechanical reliability improvement with proper package design in CSP

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188844 ◽

2003 ◽

Author(s):

N. Kao ◽

Y.P. Wang ◽

C.S. Hsiao

Keyword(s):

Mechanical Reliability ◽

Package Design ◽

Reliability Improvement

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Development of Reliability Improvement Process for Reducing Noises from the Drive Shaft in Automobiles

Journal of Applied Reliability ◽

10.33162/jar.2020.12.20.4.313 ◽

2020 ◽

Vol 20 (4) ◽

pp. 313-323

Author(s):

Hyukchoon Yun ◽

Suneung Ahn ◽

Suk Joo Bae

Keyword(s):

Drive Shaft ◽

Reliability Improvement ◽

Improvement Process

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Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package

Korean Journal of Metals and Materials ◽

10.3365/kjmm.2010.48.11.1035 ◽

2010 ◽

Vol 48 (11) ◽

pp. 1035-1040 ◽

Cited By ~ 13

Author(s):

Young-Chul Lee ◽

Kwang-Seok Kim ◽

Ji-Hyuk Ahn ◽

Jeong-Won Yoon ◽

Min-Kwan Ko ◽

...

Keyword(s):

Solder Joint ◽

Mechanical Reliability

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Reliability Improvement of Ground Fault Protection System Using an S-Type Horn Attachment Gap in AC Feeding System

IEEJ Transactions on Industry Applications ◽

10.1541/ieejias.129.949 ◽

2009 ◽

Vol 129 (10) ◽

pp. 949-956

Author(s):

Kohji Ajiki ◽

Hiroaki Morimoto ◽

Fumiyuki Shimokawa ◽

Shinya Sakai ◽

Kazuomi Sasaki ◽

...

Keyword(s):

Protection System ◽

Feeding System ◽

Reliability Improvement ◽

Ground Fault ◽

Fault Protection ◽

Ground Fault Protection

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An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

ISTFA 2009: Conference Proceedings from the 35th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2009p0001 ◽

2009 ◽

Author(s):

Michael Hertl ◽

Diane Weidmann ◽

Alex Ngai

Keyword(s):

Thermal Stress ◽

Failure Analysis ◽

Deformation Measurement ◽

Stress Conditions ◽

Analysis Approach ◽

New Approach ◽

Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

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