Low Temperature Silicon Nitride by Hot Wire Chemical Vapour Deposition for the Use in Impermeable Thin Film Encapsulation on Flexible Substrates
2011 ◽
Vol 11
(9)
◽
pp. 8202-8205
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1993 ◽
Vol 17
(1-3)
◽
pp. 185-189
◽
Keyword(s):
Keyword(s):
2001 ◽
Vol 383
(1-2)
◽
pp. 172-177
◽
2007 ◽
Vol 201
(22-23)
◽
pp. 9285-9288
◽
Keyword(s):
Keyword(s):