Grain Size and Film Thickness Effect on the Thermal Expansion Coefficient of FCC Metallic Thin Films

2011 ◽  
Vol 11 (8) ◽  
pp. 7285-7289
Author(s):  
Seulgi Hwang ◽  
Youngman Kim
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Thermal Expansion ◽  
Film Thickness ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Thickness Effect ◽  
Metallic Thin Films

Temperature Dependence of Biaxial Modulus and Thermal Expansion Coefficient of Thin Films Using Wafer Curvature Method

2003 ◽  
Vol 795 ◽  
Author(s):  
M. Capanu ◽  
A. Cervin-Lawry ◽  
A. Patel ◽  
I. Koutsaroff ◽  
P. Woo ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermal Expansion ◽  
Film Thickness ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Stress Measurement ◽  
Fused Silica ◽  
Wafer Curvature ◽  
Disk Method

ABSTRACTThe present work uses wafer curvature (disk) method to measure the temperature variation of the biaxial modulus and the thermal expansion coefficient TEC from 25°C to 205°C. The following thin films were measured: PolySi, low stress LPCVD SixNy and (Ba0.7, Sr0.3)TiO3 (BST). To improve the precision, perfect circular thin wafers were used: 4 inches circular 280μm thick <111>Si and 450μm thick Fused Silica. The measurements were performed using a commercial Tencor FLX2320 Stress Measurement System. The film thickness was measured with Tencor TF1 thin film optical system.

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

Size- and temperature-dependent Young's modulus and size-dependent thermal expansion coefficient of thin films

2016 ◽  
Vol 18 (31) ◽  
pp. 21508-21517 ◽  
Author(s):  
Xiao-Ye Zhou ◽  
Bao-Ling Huang ◽  
Tong-Yi Zhang
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Material Properties ◽  
Essential Role ◽  
Young's Modulus ◽  
Temperature Dependent ◽  
Size Dependent

Surfaces of nanomaterials play an essential role in size-dependent material properties.

Film Thickness Effect on Tensile Properties and Microstructures of Submicron Aluminum Thin Films on Polyimide

1996 ◽  
Vol 436 ◽  
Author(s):  
Y. S. Kang ◽  
P. S. Ho ◽  
R. Knipe ◽  
J. Tregilgas
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Film Thickness ◽  
Metal Film ◽  
Tensile Force ◽  
Thickness Effect ◽  
Published Data ◽  
Free Standing ◽  
Aluminum Films ◽  
Flexible Polymer

AbstractThe mechanical behavior of the metal film on a polymer substrate becomes an important issue in microelectronics metallization. The metal/polymer structure is also useful to investigate the deformation behavior of very thin free-standing metal film since the flexible polymer serves as a deformable substrate. The tensile force-elongation curves have been measured using a microtensile tester for aluminum thin films, deposited on a PMDA-ODA polyimide film, in the thickness range from 60 rum to 480 nm. The stress-strain curves for aluminum films were constructed by subtracting these curves with polyimide curves measured separately. Tensile strength increases linearly with decreasing film thickness from 196 MPa to 408 MPa within the film thickness range studied. This is in good agreement with the published data for free-standing aluminum films in the same thickness range. The measured Young's modulus is lower than the bulk modulus and exhibits no systematic dependence on the film thickness. The microstructures of aluminum films have been examined using a transmission electron microscope (TEM). These films posses the (111)-textured columnar grain structures. Grain sizes exhibit log-normal distributions and the mean grain size increases monotonically with the film thickness. An attempt is made to evaluate the effect of film thickness and grain size on the strength of aluminum thin film and the result is discussed.

Grain size dependence of pure β-eucryptite thermal expansion coefficient

2012 ◽  
Vol 66 (1) ◽  
pp. 68-71 ◽  
Author(s):  
A. Pelletant ◽  
H. Reveron ◽  
J. Chêvalier ◽  
G. Fantozzi ◽  
L. Blanchard ◽  
...  
Keyword(s):  
Grain Size ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Size Dependence

scholarly journals Characterization of Thermal Expansion Coefficient of LPCVD Polycrystalline SiC Thin Films Using Two Section V-beam Actuators

2016 ◽  
Vol 168 ◽  
pp. 1144-1147 ◽  
Author(s):  
S. Thomas ◽  
A. Jovic ◽  
B. Morana ◽  
F. Buja ◽  
A. Gkouzou ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient

Thermal expansion coefficient of polycrystalline silicon and silicon dioxide thin films at high temperatures

2000 ◽  
Vol 87 (9) ◽  
pp. 4189-4193 ◽  
Author(s):  
Haruna Tada ◽  
Amy E. Kumpel ◽  
Richard E. Lathrop ◽  
John B. Slanina ◽  
Patricia Nieva ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Silicon Dioxide ◽  
Thermal Expansion Coefficient ◽  
High Temperatures ◽  
Expansion Coefficient ◽  
Polycrystalline Silicon
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