The Effect of Grain Size and Film Thickness on the Thermal Expansion Coefficient of Copper Thin Films

2011 ◽  
Vol 11 (2) ◽  
pp. 1555-1558 ◽  
Author(s):  
Seulgi Hwang ◽  
Youngman Kim
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Thermal Expansion ◽  
Film Thickness ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient

Temperature Dependence of Biaxial Modulus and Thermal Expansion Coefficient of Thin Films Using Wafer Curvature Method

2003 ◽  
Vol 795 ◽  
Author(s):  
M. Capanu ◽  
A. Cervin-Lawry ◽  
A. Patel ◽  
I. Koutsaroff ◽  
P. Woo ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermal Expansion ◽  
Film Thickness ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Stress Measurement ◽  
Fused Silica ◽  
Wafer Curvature ◽  
Disk Method

ABSTRACTThe present work uses wafer curvature (disk) method to measure the temperature variation of the biaxial modulus and the thermal expansion coefficient TEC from 25°C to 205°C. The following thin films were measured: PolySi, low stress LPCVD SixNy and (Ba0.7, Sr0.3)TiO3 (BST). To improve the precision, perfect circular thin wafers were used: 4 inches circular 280μm thick <111>Si and 450μm thick Fused Silica. The measurements were performed using a commercial Tencor FLX2320 Stress Measurement System. The film thickness was measured with Tencor TF1 thin film optical system.

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

Size- and temperature-dependent Young's modulus and size-dependent thermal expansion coefficient of thin films

2016 ◽  
Vol 18 (31) ◽  
pp. 21508-21517 ◽  
Author(s):  
Xiao-Ye Zhou ◽  
Bao-Ling Huang ◽  
Tong-Yi Zhang
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Material Properties ◽  
Essential Role ◽  
Young's Modulus ◽  
Temperature Dependent ◽  
Size Dependent

Surfaces of nanomaterials play an essential role in size-dependent material properties.

Grain size dependence of pure β-eucryptite thermal expansion coefficient

2012 ◽  
Vol 66 (1) ◽  
pp. 68-71 ◽  
Author(s):  
A. Pelletant ◽  
H. Reveron ◽  
J. Chêvalier ◽  
G. Fantozzi ◽  
L. Blanchard ◽  
...  
Keyword(s):  
Grain Size ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Size Dependence

scholarly journals Characterization of Thermal Expansion Coefficient of LPCVD Polycrystalline SiC Thin Films Using Two Section V-beam Actuators

2016 ◽  
Vol 168 ◽  
pp. 1144-1147 ◽  
Author(s):  
S. Thomas ◽  
A. Jovic ◽  
B. Morana ◽  
F. Buja ◽  
A. Gkouzou ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient

Thermal expansion coefficient of polycrystalline silicon and silicon dioxide thin films at high temperatures

2000 ◽  
Vol 87 (9) ◽  
pp. 4189-4193 ◽  
Author(s):  
Haruna Tada ◽  
Amy E. Kumpel ◽  
Richard E. Lathrop ◽  
John B. Slanina ◽  
Patricia Nieva ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Silicon Dioxide ◽  
Thermal Expansion Coefficient ◽  
High Temperatures ◽  
Expansion Coefficient ◽  
Polycrystalline Silicon
Sign in / Sign up

Export Citation Format

Share Document