Study of Rectangular Diaphragm-Microelectromechanical Systems Optical Pressure Sensor

2017 ◽  
Vol 14 (7) ◽  
pp. 3399-3404
Author(s):  
T Sripriya ◽  
V Jeyalakshmi
Author(s):  
Jixiang Jing ◽  
Xiaoshuai An ◽  
Yumeng Luo ◽  
Liang Chen ◽  
Zhiqin Chu ◽  
...  

1990 ◽  
Author(s):  
J. M. Radojewski ◽  
A. Sankowska ◽  
S. Patela ◽  
Z. Bober ◽  
B. W. Licznerski

2010 ◽  
Vol 53 (3) ◽  
pp. 169-175 ◽  
Author(s):  
Noriaki Matsubara ◽  
Shigeru Miyachi ◽  
Yoshitaka Nagano ◽  
Tomotaka Ohshima ◽  
Osamu Hososhima ◽  
...  

1999 ◽  
Author(s):  
Todd F. Miller ◽  
David J. Monk ◽  
Gary O’Brien ◽  
William P. Eaton ◽  
James H. Smith

Abstract Surface micromachining is becoming increasingly popular for microelectromechanical systems (MEMS) and a new application for this process technology is pressure sensors. Uncompensated surface micromachined piezoresistive pressure sensors were fabricated by Sandia National Labs (SNL). Motorola packaged and tested the sensors over pressure, temperature and in a typical circuit application for noise characteristics. A brief overview of surface micromachining related to pressure sensors is described in the report along with the packaging and testing techniques used. The electrical data found is presented in a comparative manner between the surface micromachined SNL piezoresistive polysilicon pressure sensor and a bulk micromachined Motorola piezoresistive single crystal silicon pressure sensor.


Author(s):  
S. Sathyanarayanan ◽  
A. Vimala Juliet

Micromachining technology has greatly benefited from the success of developments in implantable biomedical microdevices. In this paper, microelectromechanical systems (MEMS) capacitive pressure sensor operating for biomedical applications in the range of 20–400 mm Hg was designed. Employing the microelectromechanical systems technology, high sensor sensitivities and resolutions have been achieved. Capacitive sensing uses the diaphragm deformation-induced capacitance change. The sensor composed of a rectangular polysilicon diaphragm that deflects due to pressure applied over it. Applied pressure deflects the 2 µm diaphragm changing the capacitance between the polysilicon diaphragm and gold flat electrode deposited on a glass Pyrex substrate. The MEMS capacitive pressure sensor achieves good linearity and large operating pressure range. The static and thermo electromechanical analysis were performed. The finite element analysis data results were generated. The capacitive response of the sensor performed as expected according to the relationship of the spacing of the plates.


2005 ◽  
Author(s):  
Yoshisumi Endo ◽  
Masashi Ohkawa ◽  
Seishi Sekine ◽  
Takashi Sato

2001 ◽  
Author(s):  
Yuki Shirai ◽  
Takeshi Goto ◽  
Masashi Ohkawa ◽  
Seishi Sekine ◽  
Takashi Sato

Sign in / Sign up

Export Citation Format

Share Document