scholarly journals Grain and Grain Boundary Structure Evolution Without Texture Changes During Normal Grain Growth in 2-D Al Strips

1999 ◽  
Vol 32 (1-4) ◽  
pp. 187-195 ◽  
Author(s):  
V. Sursaeva ◽  
U. Czubayko ◽  
A. Touflin
Keyword(s):  
Grain Boundary ◽  
Grain Growth ◽  
Columnar Structure ◽  
Boundary Structure ◽  
Structure Evolution ◽  
Grain Boundary Character Distribution ◽  
Grain Boundary Character ◽  
Grain Boundary Structure ◽  
Texture Change ◽  
Character Distribution

Changes of the grain boundary character distribution and texture during normal grain growth have been investigated using the SAC-SEM based method and a 4 circle X-ray texture goniometer on A1 strips with columnar structure. The microstructure of the strips consists of regions with oriented (clusters) and randomly oriented grains. All changes of microstructure are outside the clusters during normal grain growth and consequently no texture change was observed.

Grain Boundary Investigation of AISI 304 Type Steel Using EBSD

2010 ◽  
Vol 659 ◽  
pp. 307-311
Author(s):  
Zoltán Gaál ◽  
Péter János Szabó ◽  
János Ginsztler ◽  
László Dévényi
Keyword(s):  
Grain Boundary ◽  
Evaluation Method ◽  
Boundary Structure ◽  
Grain Boundary Character Distribution ◽  
Grain Boundary Engineering ◽  
Aisi 304 ◽  
Grain Boundary Character ◽  
Treatment Processes ◽  
Grain Boundary Structure ◽  
Electron Back Scattered Diffraction

This paper deals with the investigation of grain boundary engineering processes in case of AISI 304 type austenitic stainless steel. The effects of the thermo-mechanical treatments for the modification of the grain boundary structure are demonstrated on the special grain boundaries. The proper thermo-mechanical treatments can increase the fraction of the CSL-boundaries. Since the CSL-boundaries are resistant against intergranular degradation processes, materials owning enhanced properties can be developed due to these treatments. The investigation of the grain boundary character distribution is carried out by automated electron back scattered diffraction (EBSD) measurements after different thermo-mechanical treatment processes. The effect of the heat treatment duration on the grain boundary structure is examined; the optimal treatment is represented. It is shown by experimental results, that the parameter settings of the evaluation method strongly influence the obtained results.

Selective Grain Growth and Grain Boundary Character Distribution Relationships in Magnetostrictive Fe-Ga Thin Sheets

2018 ◽  
Vol 917 ◽  
pp. 223-227
Author(s):  
Suok Min Na ◽  
Nicholas J. Jones ◽  
Alison B. Flatau
Keyword(s):  
Grain Boundary ◽  
Grain Growth ◽  
Secondary Recrystallization ◽  
High Energy ◽  
Grain Boundary Character Distribution ◽  
Rolled Sheet ◽  
Boundary Character ◽  
Grain Boundary Character ◽  
Character Distribution ◽  
Boundary Character Distribution

Grain growth and grain boundary character distribution relationships in Fe-Ga rolled sheet is investigated to study the influence of H2S gas content in argon on the development of selective grain growth through secondary recrystallization. Abnormal growth of (011) grains was predominant at the low content of H2S gas, while (113) grain growth was well developed at contents higher than 1.33% H2S. On the other hand, the development of (001) grains was challenging to produce because it is very sensitive to the anneal environment and has a relatively low fraction of high energy grain boundaries associated with misorientation angles that determine the mobility of boundaries.

scholarly journals An Investigation on Grain Growth in a Commercial Al–Mg Alloy

1998 ◽  
Vol 30 (3-4) ◽  
pp. 191-206 ◽  
Author(s):  
I. Samajdar ◽  
L. Rabet ◽  
B. Verlinden ◽  
P. Van Houtte
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Grain Growth ◽  
Primary Recrystallization ◽  
Abnormal Grain Growth ◽  
Grain Boundary Character Distribution ◽  
Grain Boundary Character ◽  
Character Distribution ◽  
Boundary Character Distribution ◽  
Selection Of

Alloy AA5182 contains coarse constituent particles and submicron dispersoids. While the former may cause particle stimulated nucleation (PSN) during primary recrystallization, the fine dispersoids may ‘arrest’ grain growth during subsequent annealing. Abnormal grain growth was observed after dissolution/coarsening of the dispersoids. Mainly S [{123}〈634〉] grains, but also some Brass [{011}〈112〉] and Cu [{112}〈111〉] grains, were observed to grow abnormally. Both the grain size and the grain boundary character distribution (GBCD) possibly played a role in the selection of the grains for abnormal grain growth. A dramatic increase in the number fraction of extremely low angle (1−5°) boundaries was observed with annealing, the increase being more at 470°C (when dispersoids were stable and grain growth was arrested more effectively) than at 500°C/530°C (when inhibition to grain growth was less). The nature of the CSL boundaries did not change significantly with annealing time/temperature.

Electromigration properties of multigrain aluminum thin film conductors as influenced by grain boundary structure

2001 ◽  
Vol 16 (7) ◽  
pp. 2124-2129 ◽  
Author(s):  
O. V. Kononenko ◽  
V. N. Matveev ◽  
D. P. Field
Keyword(s):  
Grain Boundary ◽  
Boundary Energy ◽  
Boundary Structure ◽  
Grain Boundary Character Distribution ◽  
Direct Function ◽  
Boundary Character ◽  
Special Boundaries ◽  
Grain Boundary Character ◽  
Grain Boundary Structure ◽  
Interconnect Lines

Electromigration rates in polycrystalline interconnect lines are controlled by grain-boundary diffusion. As such, reliability of such interconnects is a direct function of the grain-boundary character distribution in the lines. In the present work, drift velocity experiments were performed on multicrystalline lines of pure Al to determine the electromigration activation energy of the lines. Lines cut from films processed by partially ionized beam deposition techniques were analyzed. One set of lines was analyzed in the as-deposited condition while the other film was annealed before testing. The measured drift velocities varied dramatically between these two types of films, as did the grain-boundary character distributions measured by orientation imaging. The data were analyzed based on Borisov's equation to obtain mean grain-boundary energies. Grain-boundary energy of the film with poor electromigration performance was calculated to be that reported for random boundaries, while that for the more reliable film was calculated to be that reported for twin boundaries in Al. Percolation theory was used to aid explanation of the results based upon the fraction and connectedness of special boundaries in the films.

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