scholarly journals An Interactive Design System for Hybrid ICs

1981 ◽  
Vol 8 (3-4) ◽  
pp. 221-227
Author(s):  
Hiroshi Shiraishi ◽  
Kaoru Kawamura ◽  
Masaaki Hayashi
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Boards ◽  
High Reliability ◽  
Automatic Generation ◽  
Interactive Design ◽  
Design System ◽  
Time Sharing ◽  
Design Quality ◽  
Mask Design ◽  
Dynamic Checking

In hybrid integrated circuit mask design, the design quality largely depends on the designer's experience and creativity. It is difficult to completely automate the design process as is done with LSIs or printed circuit boards. It is important to incorporate flexibility into the system.This paper describes an interactive design system for laying out hybrid ICs. The system is implemented on a large host computer, and graphic display terminals are connected to it in a time sharing environment. The system provides designers with many interactive facilities which are useful in designing hybrid ICs. In addition to highly interactive dialogue, the system has capabilities such as dynamic checking of the designer's operations against a set of design rules, or automatic generation of standardized element patterns.The system outputs mask information, design documents and so on which are used in the CAM of hybrid ICs. The system is being used at Fujitsu and is contributing to high reliability of the design, and shortening the design period.

Computer Aided Design of Transmission Components of Liquid Stirred Tank

2011 ◽  
Vol 109 ◽  
pp. 711-714
Author(s):  
Ying Jiang ◽  
Jie Liu
Keyword(s):  
Computer Aided Design ◽  
Automatic Generation ◽  
Structure Design ◽  
Stirred Tank ◽  
Design System ◽  
Design Requirement ◽  
Design Efficiency ◽  
The Common ◽  
Aided Design ◽  
Develop System

Secondary develop system can realize design automation of the common parts, so that software system can automatically inquire the chart and get data, then this could really release design personnel and improve the design efficiency. By secondary develop system of stirred tank users can respectively carry on the design according to their own needs. So secondary develop system has the function of automatic generation graphics, and can generate CAD drawings complying with the design requirement, so it reflected the intelligent performance of the design system. Secondary develop system is able to complete the automatic design of common parts, and can greatly improve the quality and efficiency of design, so it has very important use value. This design realizes the function of automatic graphics generation of transmission of stirred tank, and can generate structure design of common belt wheel.

Aluminum Reflow Sputtering

MRS Bulletin ◽  
1995 ◽  
Vol 20 (11) ◽  
pp. 53-56 ◽  
Author(s):  
Kuniko Kikuta
Keyword(s):  
Integrated Circuit ◽  
High Speed ◽  
Lower Cost ◽  
High Reliability ◽  
Device Fabrication ◽  
Damascene Process ◽  
Aspect Ratios ◽  
Multi Level ◽  
Poor Adhesion ◽  
Lower Resistivity

The scaling of integrated-circuit device dimensions in the horizontal direction has caused an increase in aspect ratios of contact holes and vias without a corresponding scaledown in vertical dimensions. Conventional sputtering has become unreliable for handling higher aspect-ratio via/contact holes because of its poor step coverage. Several studies have attempted to overcome this problem by using W-CVD and reflow technology. The W-CVD is used for practical device fabrications. However, this technique has several problems such as poor adhesion to SiO2, poor W surface morphology, greater resistivity than Al, and the need of an etch-back process.Al reflow technology using a conventional DC magnetron sputtering system can simplify device-fabrication processes and achieve high reliability without Al/W interfaces. In particular, the Al reflow technology is profitable for multi-level interconnections in combination with a damascene process by using Al chemical mechanical polishing (CMP). These interconnections are necessary for miniaturized and high-speed devices because they provide lower resistivity than W and simplify fabrication processes, resulting in lower cost.This article describes recent Al reflow sputtering technologies as well as application of via and interconnect metallization.

Hydrodynamic Design System for Pumps Based on 3-D CAD, CFD, and Inverse Design Method

2002 ◽  
Vol 124 (2) ◽  
pp. 329-335 ◽  
Author(s):  
Akira Goto ◽  
Motohiko Nohmi ◽  
Takaki Sakurai ◽  
Yoshiyasu Sogawa
Keyword(s):  
Computer Aided Design ◽  
High Performance ◽  
Design Method ◽  
High Reliability ◽  
Secondary Flows ◽  
System Structure ◽  
Inverse Design ◽  
Design System ◽  
Centrifugal Impeller ◽  
Inverse Design Method

A computer-aided design system has been developed for hydraulic parts of pumps including impellers, bowl diffusers, volutes, and vaned return channels. The key technologies include three-dimensional (3-D) CAD modeling, automatic grid generation, CFD analysis, and a 3-D inverse design method. The design system is directly connected to a rapid prototyping production system and a flexible manufacturing system composed of a group of DNC machines. The use of this novel design system leads to a drastic reduction of the development time of pumps having high performance, high reliability, and innovative design concepts. The system structure and the design process of “Blade Design System” and “Channel Design System” are presented. Then the design examples are presented briefly based on the previous publications, which included a centrifugal impeller with suppressed secondary flows, a bowl diffuser with suppressed corner separation, a vaned return channel of a multistage pump, and a volute casing. The results of experimental validation, including flow fields measurements, were also presented and discussed briefly.

Development of an Adaptive Layout Design System for ELV (End-of-Life Vehicle) Dismantling Plant

2014 ◽  
Vol 510 ◽  
pp. 133-138 ◽  
Author(s):  
Young Tae Sohn ◽  
Myon Woong Park
Keyword(s):  
Environmental Pollution ◽  
End Of Life ◽  
Software Tool ◽  
Resource Depletion ◽  
Industrial Applications ◽  
Layout Design ◽  
Interactive Design ◽  
Design System ◽  
Valuable Resource ◽  
Effective Implementation

In accordance with the increased awareness of resource depletion and environmental pollution, the importance of eco-friendly disposal and recycling of vehicles as a potentially valuable resource is emphasized; in particular, this is important as automobile production and demand continues steadily. In this paper, a systematic dismantling system is proposed to minimize the quantity of ASR by dismantling End-of-Life Vehicles (ELVs) rationally and efficiently. An adaptive layout design system is also provided to aid for the effective implementation of the proposed dismantling system to industrial applications. The proposed dismantling system is based on eco-friendly dismantling and improves not only the recyclability of ELVs, but also the efficiency of the dismantling operations. The adaptive layout design system is a software tool, which allows a layout of a dismantling plant according to the specific requirements of the customers, and estimates the overall figures and capacity of an intended plant by simulation of the dismantling process. This interactive design system can be useful for testing alternative layouts of a dismantling plant customized to meet particular recycling needs.

Sustainable Design Method for E- cigarette Products from the International Perspective

2021 ◽  
Vol 7 (5) ◽  
pp. 1329-1340
Author(s):  
Wang Huajie ◽  
Cheng Jianxin
Keyword(s):  
Product Design ◽  
New Product Development ◽  
Design Method ◽  
New Products ◽  
International Perspective ◽  
Design System ◽  
Brand Value ◽  
Design Evaluation ◽  
Design Quality ◽  
Cultural Experience

Objectives: Tobacco companies from various countries are facing pressure to participate in global competition. How to improve the products’ quality is important for the tobacco companies. In this study, based on the international perspective, the scale of E-cigarette product design evaluation is established, the brand value and cultural experience are integrated into the design activities, the design quality of the product is improved, and the culture is sustainable develop. Methods: This article constructs a product design system based on culture, experience and brand value perspectives by studying outstanding design brands product characteristics, using interviews and focus groups. This system includes design content in five aspects: value, aesthetics, function, innovation, and cultural experience. It further summarizes 20 design indicators. Using the analytic hierarchy process, the weight of the 20 design indicators is scored to determine the importance of guiding the design project. Results: In order to prove the effectiveness of the design index, combined with actual cases, in the process of designing a local brand of E-cigarette products in China, combined with relevant design indexes, compared with the index differences of international brands, focusing on 20 indexes The index with high weight value has studied the advanced aspects of international brand and completed the design of new products. The new proposal of the product was re-evaluated according to the design indicators. The new proposal has been significantly improved in all aspects. Conclusion: The actual results show that the established design indicators have certain guiding value for the development of new products. These indicators can be used as reference standards for design practice, and can also be used as standards for product design evaluation. They also have a certain value of new product development in other fields.

Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 002018-002053
Author(s):  
Swapan Bhattacharya ◽  
Fei Xie ◽  
Daniel F. Baldwin ◽  
Han Wu ◽  
Kelley Hodge ◽  
...  
Keyword(s):  
High Performance ◽  
Printed Circuit Boards ◽  
Process Development ◽  
High Reliability ◽  
Optimum Process ◽  
Process Conditions ◽  
Harsh Environment ◽  
Mechanical Shock ◽  
Large Area ◽  
Reliability Performance

Reworkable underfills and edge bond adhesives are finding increasing utility in high reliability and harsh environment applications. The ASICs and FPGAs often used in these systems typically require designs incorporating large BGAs and ceramic BGAs. For these high reliability and harsh environment applications, these packages typically require underfill or edge bond materials to achieve the needed thermal cycle, mechanical shock and vibration reliability. Moreover, these applications often incorporate high dollar value printed circuit boards (on the order of thousands or tens of thousands of dollars per PCB) hence the need to rework these assemblies and maintain the integrity of the PCB and high dollar value BGAs. This further complicates the underfill requirements with a reworkability component. Reworkable underfills introduce a number of process issues that can result in significant variability in reliability performance. In contrast, edge bond adhesives provide a high reliability solution with substantial benefits over underfills. One interesting question for the large area BGA applications of reworkable underfills and edge bond materials is the comparison of their reliability performance. This paper presents a study of reliability comparison between two robust selected reworkable underfill and edge bond adhesive in a test vehicle including 11mm, 13mm, and 27mm large area BGAs. Process development for those large area BGA applications was also conducted on the underfill process and edge bond process to determine optimum process conditions. For underfill processing, establishing an underfill process that minimizing/eliminates underfill voids is critical. For edge bond processing, establishing an edge bond that maximizes bond area without encapsulating the solder balls is key to achieving high reliability. In addition, this paper also presents a study of new high performance reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies while maintaining good reworkablity. Four edge bond materials (commercially available) were studied and compared for a test vehicles with 12mm BGAs. The reliability testing protocol included board level thermal cycling (−40 to 125°C), mechanical drop testing (2900 G), and random vibration testing (3 G, 10 – 1000 Hz).

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