Influence of Evaporation-Deposition Geometry on Conductive Thin Films
Keyword(s):
Cu Films
◽
There is a striking dependence of the evaporation deposition geometry (i.e. angular distribution of the incident vapor beam) on the properties of deposited conductive films. This paper discusses solderability, adhesion and long-term stability of adhesion of Ti-Pd-Au, Ti-Au and Ti-Cu films. In all cases the above properties were improved by an evaporation deposition geometry with steep angles of the incident vapor beam.
Keyword(s):
Keyword(s):
2011 ◽
Vol 18
(7-8)
◽
pp. 879-884
◽
2015 ◽
Vol 228
◽
pp. 112-117
◽
Keyword(s):
Keyword(s):
2018 ◽
Vol 122
(49)
◽
pp. 28151-28157
◽
2012 ◽
Vol 18
(S2)
◽
pp. 488-489
◽