scholarly journals Reliability Assessment Methodology for Massive Manufacturing Using Multi-Function Equipment

Complexity ◽  
2018 ◽  
Vol 2018 ◽  
pp. 1-8 ◽  
Author(s):  
M. López-Campos ◽  
F. Kristjanpoller ◽  
P. Viveros ◽  
R. Pascual
Keyword(s):  
Reliability Analysis ◽  
Generating Function ◽  
Production System ◽  
Manufacturing Process ◽  
Textile Industry ◽  
Reliability Assessment ◽  
Operating Conditions ◽  
Failure Behavior ◽  
Assessment Methodology

Experience reveals that reliability varies depending on the characteristics of operation. The manufacturing process based on multifunction equipment gives a usual case of variation in operating conditions. This work presents a methodology for the reliability analysis of multifunction processes, using the RCM approach, and a modification of the Universal Generating Function (UGF) under a massive manufacturing context. The result is a characterization of reliability, for each piece of equipment and for the production system. The methodology is applied in a workshop of a textile industry, where there is prior evidence that the failure behavior varies according to the type of function executed by multifunction machines.

SEM/EDS Characterization of Uncommon Metal Whiskers and Determination of Underlying Growth Mechanisms

2018 ◽  
Author(s):  
D. Basak ◽  
L. H. Ponce
Keyword(s):  
Reliability Analysis ◽  
Case Studies ◽  
Whisker Growth ◽  
Innovation Systems ◽  
Growth Mechanisms ◽  
Crystal Oscillator ◽  
Analysis Laboratory ◽  
Investigative Techniques

Abstract Two case-studies on uncommon metals whiskers, performed at the Reliability Analysis Laboratory (RAL) of Northrop Grumman Innovation Systems, are presented. The components analyzed are an Oven Controlled Crystal Oscillator (OCXO) and an Electromechanical Relay. Investigative techniques were used to determine the chemical and physical makeup of the metal whiskers and develop an understanding of the underlying effects and mechanisms that caused the conditions conducive to whisker growth.

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

Treatment system response to transient AOX (adsorbable organic halogen) loadings

1997 ◽  
Vol 35 (2-3) ◽  
pp. 85-91
Author(s):  
D. A. Barton ◽  
J. D. Woodruff ◽  
T. M. Bousquet ◽  
A. M. Parrish
Keyword(s):  
Paper Industry ◽  
Model Development ◽  
Operating Conditions ◽  
System Response ◽  
Additional Information ◽  
Organic Halogen ◽  
Aox Removal ◽  
Variable Operating Conditions ◽  
Plant Shutdown

If promulgated as proposed, effluent guidelines for the U.S. pulp and paper industry will impose average monthly and maximum daily numerical limits of discharged AOX (adsorbable organic halogen). At this time, it is unclear whether the maximum-day variability factor used to establish the proposed effluent guidelines will provide sufficient margin for mills to achieve compliance during periods of normal but variable operating conditions within the pulping and bleaching processes. Consequently, additional information is needed to relate transient AOX loadings with final AOX discharges. This paper presents a simplistic dynamic model of AOX decay during treatment. The model consists of hydraulic characterization of an activated sludge process and a first-order decay coefficient for AOX removal. Data for model development were acquired by frequent collection of influent and effluent samples at a bleach kraft mill during a bleach plant shutdown and startup sequence.

scholarly journals Critical Review of EMC Standards for the Measurement of Radiated Electromagnetic Emissions from Transit Line and Rolling Stock

Energies ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 759
Author(s):  
Andrea Mariscotti
Keyword(s):  
Time Distribution ◽  
Communication Systems ◽  
Electromagnetic Compatibility ◽  
Transportation Systems ◽  
Operating Conditions ◽  
Rolling Stock ◽  
Intrinsic Variability ◽  
Statistical Characterization ◽  
Electromagnetic Emissions

Accurate and comprehensive methods for the assessment of radiated electromagnetic emissions in modern electric transportation systems are a necessity. The characteristics and susceptibility of modern victim signaling and communication radio services, operating within and outside the right-of-way, require an update of the measurement methods integrating or replacing the swept frequency technique with time domain approaches. Applicable standards are the EN 50121 (equivalent to the IEC 62236) and Urban Mass Transport Association (UMTA) with additional specifications from project contracts. This work discusses the standardized methods and settings, and the representative operating conditions, highlighting areas where improvements are possible and opportune (statistical characterization of measurement results, identification and distinction of emissions and line resonances, and narrowband and broadband phenomena). In particular for the Electromagnetic Compatibility (EMC) assessment with new Digital Communication Systems, the characterization of time distribution of spectral properties is discussed, e.g., by means of Amplitude Probability Distribution and including time distribution information. The problem of determination of site and setup uncertainty and repeatability is also discussed, observing on one hand the lack of clear indications in standards and, on the other hand, the non-ideality and intrinsic variability of measurement conditions (e.g., rolling stock operating conditions, synchronization issues, and electric arc intermittence).

Thermomechanical Response of Materials and Interfaces in Electronic Packaging: Part I—Unified Constitutive Model and Calibration

1997 ◽  
Vol 119 (4) ◽  
pp. 294-300 ◽  
Author(s):  
C. S. Desai ◽  
J. Chia ◽  
T. Kundu ◽  
J. L. Prince
Keyword(s):  
Laboratory Test ◽  
Constitutive Modeling ◽  
Electronic Packaging ◽  
Cyclic Fatigue ◽  
Failure Behavior ◽  
Thermomechanical Response ◽  
Disturbed State Concept ◽  
Test Behavior ◽  
New Criterion

The disturbed state concept (DSC) presented here provides a unified and versatile methodology for constitutive modeling of thermomechanical response of materials and interfaces/joints in electronic chip-substrate systems. It allows for inclusion of such important features as elastic, plastic and creep strains, microcracking and degradation, strengthening, and fatigue failure. It provides the flexibility to adopt different hierarchical versions in the range of simple (e.g., elastic) to sophisticated (thermoviscoplastic with microcracking and damage), depending on the user’s specific need. This paper presents the basic theory and procedures for finding parameters in the model based on laboratory test data and their values for typical solder materials. Validation of the models with respect to laboratory test behavior and different criteria for the identification of cyclic fatigue and failure, including a new criterion based on the DSC and design applications, are presented in the compendium paper (Part II, Desai et al., 1997). Based on these results, the DSC shows excellent potential for unified characterization of the stress-strain-strength and failure behavior of engineering materials in electronic packaging problems.

scholarly journals Characterization of Requeijão and technological optimization of its manufacturing process

1996 ◽  
Vol 30 (3-4) ◽  
pp. 363-376 ◽  
Author(s):  
M.E. Pintado ◽  
J.A.Lopes da Silva ◽  
F.X. Malcata
Keyword(s):  
Manufacturing Process

scholarly journals Reliability Assessment with Varying Operating Conditions

Procedia CIRP ◽  
2016 ◽  
Vol 50 ◽  
pp. 796-801
Author(s):  
Julia Lindén ◽  
Anders Söderberg ◽  
Ulf Sellgren
Keyword(s):  
Reliability Assessment ◽  
Operating Conditions

Modeling multi-state system reliability analysis in a power station under fatal and nonfatal shocks: a simulation approach

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Mohammad Reza Pourhassan ◽  
Sadigh Raissi ◽  
Arash Apornak
Keyword(s):  
Reliability Analysis ◽  
System Reliability ◽  
System Performance ◽  
Failure Process ◽  
State System ◽  
Failure Behavior ◽  
Simulation Approach ◽  
Critical System ◽  
Content Type ◽  
System Reliability Analysis

PurposeIn some environments, the failure rate of a system depends not only on time but also on the system condition, such as vibrational level, efficiency and the number of random shocks, each of which causes failure. In this situation, systems can keep working, though they fail gradually. So, the purpose of this paper is modeling multi-state system reliability analysis in capacitor bank under fatal and nonfatal shocks by a simulation approach.Design/methodology/approachIn some situations, there may be several levels of failure where the system performance diminishes gradually. However, if the level of failure is beyond a certain threshold, the system may stop working. Transition from one faulty stage to the next can lead the system to more rapid degradation. Thus, in failure analysis, the authors need to consider the transition rate from these stages in order to model the failure process.FindingsThis study aims to perform multi-state system reliability analysis in energy storage facilities of SAIPA Corporation. This is performed to extract a predictive model for failure behavior as well as to analyze the effect of shocks on deterioration. The results indicate that the reliability of the system improved by 6%.Originality/valueThe results of this study can provide more confidence for critical system designers who are engaged on the proper system performance beyond economic design.

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