scholarly journals Influence of Parameters of Screen Printing on Photoluminescence Properties of Nanophotonic Labels for Smart Packaging

2017 ◽  
Vol 2017 ◽  
pp. 1-12 ◽  
Author(s):  
Olha Hrytsenko ◽  
Vitaliy Shvalagin ◽  
Galyna Grodziuk ◽  
Vasyl Granchak

Smart packaging is becoming more popular on world market as a new type of packaging able to react to changes in a packaged product during storage and informs a customer about the safety of consumption of packaged food. This article investigates the main technological issues of the use of nanophotonic printing inks based on ZnO/SiO2 nanoparticles and polyvinylpyrrolidone (PVP) for printing active elements of smart packaging on paper substrates, concerning material properties and parameters of screen printing. It is determined that the use of ink compositions with medium content of ZnO/SiO2 nanoparticles allows obtaining blue-green and blue shades of luminescence color of screen printed images by changing ink layer thickness on papers with different contents of optical brightness agents (OBAs). The minimum content of ZnO/SiO2 nanoparticles in the developed fluorescent inks leads to blue luminescence colors regardless the contents of OBAs of the papers and ink layer thickness. The luminescence intensity is directly proportional to ink layer thickness and partly depends on the content of OBAs in the selected paper. In order to fabricate nanophotonic elements of smart packaging with predetermined photoluminescence properties, the influence of investigated factors on photoluminescence properties of printed nanophotonic labels should be taken into account.

2018 ◽  
Vol 2018 ◽  
pp. 1-10 ◽  
Author(s):  
Olha Hrytsenko ◽  
Dmytro Hrytsenko ◽  
Vitaliy Shvalagin ◽  
Galyna Grodziuk ◽  
Mikhail Kompanets

Smart packaging functions can be provided by printing functional labels onto packaging materials using inkjet printing and inks with changeable photoluminescence properties. Carbon nanoparticles are considered a perspective fluorescent component of such inks. Ink compositions based on carbon nanoparticles are developed and adapted for inkjet printing on paper packaging materials for producing smart packaging labels. The influence of technological factors of the printing process on the photoluminescence characteristics of the printed images is investigated. The main investigated factors are the concentration of carbon nanoparticles, the relative area of raster elements of a raster field of a tone image, the absorbance and surface smoothness of paper. The resulting parameters are photoluminescence intensity and color. It is found that in case of changes in surface smoothness and absorbance of paper and concentrations of carbon nanoparticles in the ink compositions, the photoluminescence intensity of a printed image changes while its photoluminescence color remains the same. To obtain the highest contrast of tone inkjet-printed images with carbon nanoparticles on papers with any absorbance, the highest concentration of carbon nanoparticles in the ink composition should be used. However, the highest contrast and the highest own photoluminescence intensity of a tone inkjet-printed image with inks with carbon nanoparticles can be achieved only on papers with the lowest absorbance. The most noticeable difference between photoluminescence intensity of printed images on papers with any absorbance can be obtained with the lower concentration of carbon nanoparticles in the ink composition (10 mg/mL). The optimum concentrations of carbon nanoparticles in the composition are determined: for papers with low absorbance—10 mg/mL, and for papers with medium and high absorbance—25 mg/mL. Analytical dependency is created for photoluminescence intensity of images printed with inkjet printing inks with carbon nanoparticles as a function of the studied technological factors. Some design solutions for photoluminescent labels are suggested.


2014 ◽  
Vol 904 ◽  
pp. 121-125 ◽  
Author(s):  
Ji Lan Fu ◽  
Ya Ling Li ◽  
Li Xin Mo ◽  
Yu Wang ◽  
Jun Ran ◽  
...  

The recent dramatic progress in the printed electronics and flexible electronics, due to the universality of the substrates including the foldable and stretchable substrates, has opened a new prospect in the field of future electronics. In this paper, silver nanospheres in large-scale are synthesized, the nanosilver ink with 63.88% silver content are prepared and a new type of highly conductive and far identify distance RFID tags are manufactured. Especially there are no resin and other additives containing in our conductive ink which satisfy the rheological characteristics and process of screen printing. The tags exhibit the best radiation performance own to there is no high temperature sintering in need. The surface resistance of the tags could be 80 mΩ/, and the identify distance reach to 6.0m. Keywords:silver nanoparticles, conductive ink, RFID tags


2018 ◽  
Vol 30 (2) ◽  
pp. 1034-1044 ◽  
Author(s):  
Michal Hatala ◽  
Pavol Gemeiner ◽  
Matej Hvojnik ◽  
Milan Mikula

2018 ◽  
Vol 51 (7-8) ◽  
pp. 583-602
Author(s):  
Nabil Hayeemasae ◽  
Hanafi Ismail

This article proposes a new type of magnetorheological elastomer (MRE) based on natural rubber (NR) and waste natural rubber gloves (wNRg) blends. The material properties of the MRE samples were investigated with specific focus on the curing and swelling kinetics. Two different series were prepared; the first used carbonyl iron (CI) as the single filler in the MRE, whereas the second hybridized CI with carbon black (CB) to prepare an MRE resistant to solvents. The results show that most properties depend strongly on the nature of both fillers. The higher thermal conductivity of the CI caused a substantial decrease in both the scorch and curing times and the activation energy in the curing process. Based on the diffusion study, a higher volume of fillers in the rubber composites resulted in a greater area of blockage and restricted the penetration of the solvent tested throughout the composites, irrespective of whether CI alone or in combination with CB was used in the composites.


2020 ◽  
Vol 507 ◽  
pp. 145047 ◽  
Author(s):  
P. Sopeña ◽  
J.M. Fernández-Pradas ◽  
P. Serra

Author(s):  
Clément M. Gosselin ◽  
Dan Zhang

Abstract In this paper, a new method — named lumped kinetostatic modeling — to analyze the effect of the link flexibility on the mechanism’s stiffness is provided. A new type of mechanism whose degree of freedom (dof) is dependent on a passive constraining leg connecting the base and the platform is introduced and analyzed. With the proposed kinetostatic model, a significant effect of the link flexibility on the mechanism’s precision has been demonstrated. The influence of the changement of structure parameters, including material properties, on the system behavior is discussed. In the paper, the geometric model of this kind of mechanism is first introduced. Then, a lumped kinetostatic model is proposed in order to account for joint and link compliances; some results and design guidelines are obtained. Finally, the optimization of the precision is addressed using a genetic algorithm.


Author(s):  
Wenping Song ◽  
Andrey Ovcharenko ◽  
Guangyu Zhang ◽  
Frank E. Talke

The effect of coating thickness is investigated during transient thermal-mechanical contact between a sphere and a layered surface. The range of coating thicknesses studied was from 0.001≤t/R≤0.1, where t is the coating thickness and R is the radius of the contacting sphere. It was found that for the range of coating thickness and material properties investigated, the coating thickness has only a small effect on the mechanical deformation of the interface. On the other hand, the layer thickness has a large effect on the temperature rise of the interface.


2018 ◽  
Vol 210 ◽  
pp. 04049 ◽  
Author(s):  
Ales Mizera ◽  
Martin Bednarik ◽  
Martin Mizera ◽  
Katarina Tomanova ◽  
Martin Mohorko

To obtain the deeper knowledge about the mechanical behaviour of 3D printed polymeric materials it is necessary to study the material properties from the beginning to the end. The commonly processed polymeric materials (via injection moulding etc.) are already deeply studied and evaluated, but 3D printed specimens in the various orientation build are not yet. In this study the tensile impact test specimens were fabricated via a desktop material extrusion 3D printer Zortrax M200 processing ABS and HIPS in build orientation XY. The 3D printed tensile impact test specimens were examined to compare the effect of layer thickness. Impact pendulum Zwick HIT50P was used for tensile impact tests according to ISO 8256 standard. Optical microscopy was utilized to perform fractography on impact test specimens to explore the effect of the layer thickness on the fracture surface morphology of the failed specimens. This study demonstrates the need for material testing for specific processing as additive manufacturing technologies.


2003 ◽  
Vol 778 ◽  
Author(s):  
Lorraine C. Wang ◽  
Reinhold H. Dauskardt

AbstractControlling material properties over nanometer length scales is crucial for current and emerging high-density microelectronic device packages. Miniaturization of devices is increasingly limited by the ability to “connect” to the device, and the required packaging structures must be fabricated where layer thickness and feature sizes approach micron size scales while achieving the required mechanical, thermal and electrical properties. Second phase additions such as sub-micron sized particles are often added to locally adjust the material properties of constituent layers in the complex package structure. This results in significant variation of mechanical properties over sub-micron length scales. Such manipulation of material structure and its effects on mechanical and interfacial fracture behavior are addressed using experimental and modeling studies. Underfill layers consisting of an epoxy matrix with dispersed silica beads are shown to exhibit variations of elastic and flow properties in excess of three-fold across the layer thickness. Mechanical properties are not only affected by the distribution of second-phase fillers, but also by the adhesion properties of the filler/matrix interface. Interfaces are susceptible to stress corrosion cracking associated with moisture which can lead to progressive debond growth at loads much lower than that required to exceed the critical interface fracture energies. Subcritical debonding is affected by temperature, humidity, and the bond chemistry of the interface. The effects of these variations are considered on the adhesive and subcritical debonding behavior of interfaces between model epoxy underfills and SiNx chip passivation. Implications for other constrained complex layered structures are considered.


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