scholarly journals A Two-Step Global Maximum Error Controller-Based TPWL MOR with POD Basis Vectors and Its Applications to MEMS

2017 ◽  
Vol 2017 ◽  
pp. 1-20
Author(s):  
Ying Liu ◽  
Xiaodong Wang
Keyword(s):  
Microelectromechanical Systems ◽  
Piecewise Linear ◽  
Selection Procedure ◽  
Maximum Error ◽  
Original Method ◽  
Global Maximum ◽  
Mems Devices ◽  
Rlc Circuit ◽  
Proper Orthogonal ◽  
Linearization Point

In our previous study, we have proposed a linearization point (LP) selection method based on a global maximum error controller for the trajectory piecewise-linear (TPWL) method. It has been demonstrated that this method has many advantages over other existing methods. In this paper, a more efficient version of this method is presented, which introduces a preliminary LP selection procedure and constructs projection matrix by the proper orthogonal decomposition (POD) method. Compared with the original method, the improved method takes much less time for extracting a reduced-order model (ROM) of similar quality and gets some other benefits (such as being easier to implement, having lower memory requirement, and enhanced flexibility). The effectiveness of the new method is fully demonstrated by a diode transmission line RLC circuit. And then, the method is applied to three more complicated microelectromechanical systems (MEMS) devices, which are a micromachined switch, an electrostatic micropump diaphragm, and a thermomechanical in-plane microactuator.

High transparency flexible sensor for pressure and proximity sensing

2018 ◽  
Vol 32 (32) ◽  
pp. 1850394 ◽  
Author(s):  
Dan Bu ◽  
Si Qi Li ◽  
Yun Ming Sang ◽  
Cheng Jun Qiu
Keyword(s):  
Indium Tin Oxide ◽  
Pressure Range ◽  
Piecewise Linear ◽  
High Sensitivity ◽  
Maximum Error ◽  
Piecewise Linear Function ◽  
Good Repeatability ◽  
Flexible Pressure Sensor ◽  
Human Finger ◽  
Proximity Sensing

A high-sensitivity and high-transmittance flexible pressure sensor is presented in this paper. Using polydimethylsiloxane (PDMS) sensing film to cover indium tin oxide (ITO) electrodes interdigitated on the polyethylene terephthalate (PET) substrate, an interdigital capacitance (IDC) structure is constructed. The pressure and proximity sensing characteristics of the fabricated IDC sensor are investigated. The experiment results show that the IDC sensor has the piecewise linear function in different pressure range, especially sensitive to the low-pressure range with the pressure sensitivity of 6.64 kPa[Formula: see text]. Moreover, it has a good repeatability with the maximum error rate of 2.73% and a high transmittance over 90% in the wavelength range from 400 nm to 800 nm. As a human finger approaches or leaves, the proximity sensing characteristic emerges, with a maximum sensing distance of about 20 cm.

Model reduction of aerothermodynamic for hypersonic aerothermoelasticity based on POD and Chebyshev method

2018 ◽  
Vol 233 (10) ◽  
pp. 3734-3748
Author(s):  
Yan Xiaoxuan ◽  
Han Jinglong ◽  
Zhang Bing ◽  
Yuan Haiwei
Keyword(s):  
Computational Cost ◽  
Maximum Error ◽  
Control Surface ◽  
Alternative Approach ◽  
Average Maximum ◽  
Optimization And Control ◽  
Efficient Alternative ◽  
Computational Fluid Dynamics Cfd ◽  
And Control ◽  
Proper Orthogonal

Accurate modeling of aerothermodynamics with low computational cost takes on a crucial role for the optimization and control of hypersonic vehicles. This study examines three reduced-order models (ROMs) to provide a reliable and efficient alternative approach for obtaining the aerothermodynamics of a hypersonic control surface. Coupled computational fluid dynamics (CFD) and computational thermostructural dynamics (CTSD) approaches are used to generate the snapshots for ROMs considering the interactions between aerothermodynamics, structural dynamics and heat transfer. One ROM adopts a surrogate approach named Kriging. The second ROM is constructed by the combination of Proper Orthogonal Decomposition (POD) and Kriging, namely, POD-Kriging. The accuracy of Kriging-based ROM is higher than that of POD-Kriging-based ROM, but the efficiency is lower. Therefore, to address the shortcomings of the above two approaches, a new ROM is developed that is composed of POD and modified Chebyshev polynomials, namely, POD-Chebyshev. The ROM based on POD-Chebyshev has the best precision and efficiency among the three ROMs and generally has less than 2% average maximum error for the studied problem.

Microsensors, MEMS and NEMS Based Complex Adaptive Smart Devices and Systems

2001 ◽  
Author(s):  
Vijay K. Varadan
Keyword(s):  
Self Assembly ◽  
Communication Systems ◽  
Microelectromechanical Systems ◽  
System Level ◽  
Smart Devices ◽  
Mems Devices ◽  
Wafer Level ◽  
Sensors And Actuators ◽  
Complex Adaptive ◽  
Microelectronics Industry

Abstract The microelectronics industry has seen explosive growth during the last thirty years. Extremely large markets for logic and memory devices have driven the development of new materials, and technologies for the fabrication of even more complex devices with features sizes now down at the sub micron level. Recent interest has arisen in employing these materials, tools and technologies for the fabrication of miniature sensors and actuators and their integration with electronic circuits to produce smart devices and MicroElectroMechanical Systems (MEMS). This effort offers the promise of: 1. Increasing the performance and manufacturability of both sensors and actuators by exploiting new batch fabrication processes developed for the IC and microelectronics industry. Examples include micro stereo lithographic and micro molding techniques. 2. Developing novel classes of materials and mechanical structures not possible previously, such as diamond like carbon, silicon carbide and carbon nanotubes, micro-turbines and micro-engines. 3. Development of technologies for the system level and wafer level integration of micro components at the nanometer precision, such as self-assembly techniques and robotic manipulation. 4. Development of control and communication systems for MEMS devices, such as optical and RF wireless, and power delivery systems.

MEMS-Enabled Smart Beam-Steering Antennas

2014 ◽  
pp. 183-203
Author(s):  
Hadi Mirzajani ◽  
Habib Badri Ghavifekr ◽  
Esmaeil Najafi Aghdam
Keyword(s):  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Beam Steering ◽  
Smart Antennas ◽  
Phase Shifters ◽  
Rapid Rate ◽  
Mems Devices ◽  
Batch Fabrication ◽  
Mems Technology ◽  
Smart Beam

In recent years, Microelectromechanical Systems (MEMS) technology has seen a rapid rate of evolution because of its great potential for advancing new products in a broad range of applications. The RF and microwave devices and components fabricated by this technology offer unsurpassed performance such as near-zero power consumption, high linearity, and cost effectiveness by batch fabrication in respect to their conventional counterparts. This chapter aims to give an in-depth overview of the most recently published methods of designing MEMS-based smart antennas. Before embarking into the different techniques of beam steering, the concept of smart antennas is introduced. Then, some fundamental concepts of MEMS technology such as micromachining technologies (bulk and surface micromachining) are briefly discussed. After that, a number of RF MEMS devices such as switches and phase shifters that have applications in beam steering antennas are introduced and their operating principals are completely explained. Finally, various configurations of MEMS-enabled beam steering antennas are discussed in detail.

A Renewal Weakest-Link Model of Strength Distribution of Polycrystalline Silicon MEMS Structures

2019 ◽  
Vol 86 (8) ◽  
Author(s):  
Zhifeng Xu ◽  
Roberto Ballarini ◽  
Jia-Liang Le
Keyword(s):  
Experimental Data ◽  
Polycrystalline Silicon ◽  
Microelectromechanical Systems ◽  
Strength Distribution ◽  
Material Strength ◽  
Mems Devices ◽  
Efficient Computation ◽  
Weakest Link ◽  
Large Size ◽  
The Stability

Experimental data have made it abundantly clear that the strength of polycrystalline silicon (poly-Si) microelectromechanical systems (MEMS) structures exhibits significant variability, which arises from the random distribution of the size and shape of sidewall defects created by the manufacturing process. Test data also indicated that the strength statistics of MEMS structures depends strongly on the structure size. Understanding the size effect on the strength distribution is of paramount importance if experimental data obtained using specimens of one size are to be used with confidence to predict the strength statistics of MEMS devices of other sizes. In this paper, we present a renewal weakest-link statistical model for the failure strength of poly-Si MEMS structures. The model takes into account the detailed statistical information of randomly distributed sidewall defects, including their geometry and spacing, in addition to the local random material strength. The large-size asymptotic behavior of the model is derived based on the stability postulate. Through the comparison with the measured strength distributions of MEMS specimens of different sizes, we show that the model is capable of capturing the size dependence of strength distribution. Based on the properties of simulated random stress field and random number of sidewall defects, a simplified method is developed for efficient computation of strength distribution of MEMS structures.

scholarly journals Stability Improvement of Flexible Shallow Shells Using Neutron Radiation

Materials ◽  
2020 ◽  
Vol 13 (14) ◽  
pp. 3187
Author(s):  
Anton V. Krysko ◽  
Jan Awrejcewicz ◽  
Irina V. Papkova ◽  
Vadim A. Krysko
Keyword(s):  
Temperature Field ◽  
Neutron Irradiation ◽  
Microelectromechanical Systems ◽  
Neutron Radiation ◽  
Middle Surface ◽  
Aviation Industry ◽  
Irradiation Effect ◽  
Structural Members ◽  
Mems Devices ◽  
Shallow Shells

Microelectromechanical systems (MEMS) are increasingly playing a significant role in the aviation industry and space exploration. Moreover, there is a need to study the neutron radiation effect on the MEMS structural members and the MEMS devices reliability in general. Experiments with MEMS structural members showed changes in their operation after exposure to neutron radiation. In this study, the neutron irradiation effect on the flexible MEMS resonators’ stability in the form of shallow rectangular shells is investigated. The theory of flexible rectangular shallow shells under the influence of both neutron irradiation and temperature field is developed. It consists of three components. First, the theory of flexible rectangular shallow shells under neutron radiation in temperature field was considered based on the Kirchhoff hypothesis and energetic Hamilton principle. Second, the theory of plasticity relaxation and cyclic loading were taken into account. Third, the Birger method of variable parameters was employed. The derived mathematical model was solved using both the finite difference method and the Bubnov–Galerkin method of higher approximations. It was established based on a few numeric examples that the irradiation direction of the MEMS structural members significantly affects the magnitude and shape of the plastic deformations’ distribution, as well as the forces magnitude in the shell middle surface, although qualitatively with the same deflection the diagrams of the main investigated functions were similar.

Wafer-Level Strength and Fracture Toughness Testing of Surface-Micromachined MEMS Devices

1999 ◽  
Vol 605 ◽  
Author(s):  
H. Kahn ◽  
N. Tayebi ◽  
R. Ballarini ◽  
R.L. Mullen ◽  
A.H. Heuer
Keyword(s):  
Fracture Toughness ◽  
Tensile Strength ◽  
Microelectromechanical Systems ◽  
Reliability Prediction ◽  
Bend Strength ◽  
Mems Devices ◽  
Wafer Level ◽  
Toughness Testing ◽  
Loading Devices

AbstractDetermination of the mechanical properties of MEMS (microelectromechanical systems) materials is necessary for accurate device design and reliability prediction. This is most unambiguously performed using MEMS-fabricated test specimens and MEMS loading devices. We describe here a wafer-level technique for measuring the bend strength, fracture toughness, and tensile strength of MEMS materials. The bend strengths of surface-micromachined polysilicon, amorphous silicon, and polycrystalline 3C SiC are 5.1±1.0, 10.1±2.0, and 9.0±1.0 GPa, respectively. The fracture toughness of undoped and P-doped polysilicon is 1.2±0.2 MPa√m, and the tensile strength of polycrystalline 3C SiC is 3.2±1.2 GPa. These results include the first report of the mechanical strength of micromachined polycrystalline 3C SiC.

Resonant Fatigue Testing of Cantilever Specimens Prepared from Thin Films

2008 ◽  
Vol 1139 ◽  
Author(s):  
Kwangsik Kwak ◽  
Masaaki Otsu ◽  
Kazuki Takashima
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Cantilever Beam ◽  
Microelectromechanical Systems ◽  
Fatigue Testing ◽  
Crystalline Silicon ◽  
Gold Foil ◽  
Fatigue Properties ◽  
Mems Devices ◽  
Testing Method

AbstractFatigue properties of thin film materials are extremely important to design durable and reliable microelectromechanical systems (MEMS) devices. However, it is rather difficult to apply conventional fatigue testing method of bulk materials to thin films. Therefore, a fatigue testing method fitted to thin film materials is required. In this investigation, we have developed a fatigue testing method that uses a resonance of cantilever type specimen prepared from thin films. Cantilever beam specimens with dimensions of 1(W) × 3(L) × 0.01(t) mm3 were prepared from Ni-P amorphous alloy thin films and gold foils. In addition, cantilever beam specimens with dimension of 3(L) × 0.3(W) × 0.005(t) mm3 were also prepared from single crystalline silicon thin films. These specimens were fixed to a holder that is connected to an golddio speaker used as an actuator, and were resonated in bending mode. In order to check the validity of this testing method, Young's moduli of these specimens were measured from resonant frequencies. The average Young's modulus of Ni-P was 108 GPa and that of gold foil specimen was 63 GPa, and these values were comparable with those measured by other techniques. This indicates that the resonance occurred theoretically-predicted manner and this testing method is valid for measuring the fatigue properties of thin films. Resonant fatigue tests were carried out for these specimens by changing amplitude range of resonance, and S-N curves were successfully obtained.

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