scholarly journals A Review on Key Issues and Challenges in Devices Level MEMS Testing

2016 ◽  
Vol 2016 ◽  
pp. 1-14 ◽  
Author(s):  
Muhammad Shoaib ◽  
Nor Hisham Hamid ◽  
Aamir Farooq Malik ◽  
Noohul Basheer Zain Ali ◽  
Mohammad Tariq Jan

The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market.

Author(s):  
Sai B. Koppaka ◽  
Leslie M. Phinney

Undesirable adhesion in microelectromechanical systems (MEMS) is referred to as stiction and is a principal failure mechanism in surface-micromachined MEMS devices. Adhesive failures can occur in a number of ways. The adhesive failures that occur during the release stage, which includes the etching of sacrificial layers, the subsequent chemical treatments, and the drying processes, are referred to as release-related stiction and failures that occur while the device is in operation are referred to as in-use stiction. A method of repairing these stiction-failed structures released from isopropyl alcohol (IPA) by Nd:YAG laser irradiation is described by Rogers et al. [1]. The current paper reports the effectiveness of the laser repair process and the corresponding thermomechanical model predictions for microcantilevers that have failed due to release from water, octadecyltrichlorosilane (OTS) and supercritical CO2 drying, along with IPA released structures. The paper also discusses the efficiency of the model and the laser repair process for devices that have failed due to in-use stiction. The results show that the laser repair process is very effective for both failure modes and that the model predicts the laser repair of cantilevers that have failed due to release-related stiction much better than for in-use stiction failed cantilevers.


2010 ◽  
Vol 4 (2) ◽  
Author(s):  
Viswanadam Gautham ◽  
Agarwal Ajay

Microelectromechanical systems (MEMS) devices have gained considerable attention in medical and automotive applications due to their vast advantages in fault detection. However, the cost for MEMS devices has been a challenge for the device manufacturing industry due to the final packaging of the devices. It is considered expensive compared with device fabrication in certain applications. Majority of MEMS devices are still housing traditional packaging methods due to difficulty in handling and yield loss. The advanced interconnect solutions based on thin silicon carrier and through silicon via are being developed to interconnect integrated circuits and other devices at high densities. Can such technologies be used for MEMS device interconnections? It is really a challenge for MEMS designers and engineers due to the MEMS elements present in the devices. In this paper, we present a device fabrication process to realize interconnects that are fabricated prior to the MEMS elements are defined and processed in the device wafer. The interconnects are filled by doped polysilicon and device wafers with such prefabricated vertical interconnects can be used as the starting wafers for any device processing including optoelectronic and MEMS. The process details and their characterization are elaborated along with the physical and electrical analysis of such interconnections.


1996 ◽  
Vol 429 ◽  
Author(s):  
R. Singh ◽  
R. Sharangpani ◽  
K. C. Cherukuri ◽  
Y. Chen ◽  
D. M. Dawson ◽  
...  

AbstractThe growth and advancement of the electronic and photonic industry in the 21 st century hinges on revolutionary new processing techniques that will overcome some of the most fundamental limitations of conventional methods. Rapid isothermal processing (RIP) based on incoherent radiation as the source of optical and thermal energy can play a major role in designing processing systems that offer the tight process control, low thermal budgets, low microscopic defects, high throughput and high yields required for almost every semiconductor device. Conventional RIP can be further optimized by fully exploiting the contribution of quantum photoeffects. The improved performance and reliability offered by RIP will make it the mainstream technology for the green manufacture of microelectronics, optoelectronics, solar cells, flat panel displays and microelectromechanical systems. Key issues related to the cost of ownership, design of RIP system based on the full utilization of photo–thermal effects and model based control systems are described. New experimental results for a number of processing steps are provided. These results demonstrate the importance of advanced RIP systems in providing better performance and lower defects for future devices.


Proceedings ◽  
2020 ◽  
Vol 56 (1) ◽  
pp. 18
Author(s):  
Luca Mauri ◽  
Anna Della Porta ◽  
Alessio Corazza ◽  
Marco Moraja

Getter materials are technically proven and industrially well-implemented solutions for maintaining a vacuum inside electronic devices to assure long lifetimes and proper operating conditions. The pressure requirements of some hermetically packaged microelectromechanical systems (MEMS) devices, such as gyroscopes, accelerometers, infrared (IR) bolometers, and digital mirrors, are very stringent. The internal pressure can be as low as in the 10−3 mbar range. Due to the desorption phenomena of gaseous species from the internal surfaces, the vacuum inside such hermetically sealed electronic devices tends to degrade over time and, in the worst case, can affect the proper operation of the device. The integration of a special nanostructured getter film is an effective way to preserve and guarantee the performance of such devices. In addition to the getter material, there is also the need to develop and customize analytical techniques for post-process vacuum quality control and reliability checks of hermetic bonding, which are extremely important for the assessment of a device’s overall performance, lifetime, and manufacturing process yield.


The choice of cost-effective method of anticorrosive protection of steel structures is an urgent and time consuming task, considering the significant number of protection ways, differing from each other in the complex of technological, physical, chemical and economic characteristics. To reduce the complexity of solving this problem, the author proposes a computational tool that can be considered as a subsystem of computer-aided design and used at the stage of variant and detailed design of steel structures. As a criterion of the effectiveness of the anti-corrosion protection method, the cost of the protective coating during the service life is accepted. The analysis of existing methods of steel protection against corrosion is performed, the possibility of their use for the protection of the most common steel structures is established, as well as the estimated period of effective operation of the coating. The developed computational tool makes it possible to choose the best method of protection of steel structures against corrosion, taking into account the operating conditions of the protected structure and the possibility of using a protective coating.


2019 ◽  
Vol 14 (1) ◽  
pp. 5-11
Author(s):  
S. Rajasekaran ◽  
S. Muralidharan

Background: Increasing power demand forces the power systems to operate at their maximum operating conditions. This leads the power system into voltage instability and causes voltage collapse. To avoid this problem, FACTS devices have been used in power systems to increase system stability with much reduced economical ratings. To achieve this, the FACTS devices must be placed in exact location. This paper presents Firefly Algorithm (FA) based optimization method to locate these devices of exact rating and least cost in the transmission system. Methods: Thyristor Controlled Series Capacitor (TCSC) and Static Var Compensator (SVC) are the FACTS devices used in the proposed methodology to enhance the voltage stability of power systems. Considering two objectives of enhancing the voltage stability of the transmission system and minimizing the cost of the FACTS devices, the optimal ratings and cost were identified for the devices under consideration using Firefly algorithm as an optimization tool. Also, a model study had been done with four different cases such as normal case, line outage case, generator outage case and overloading case (140%) for IEEE 14,30,57 and 118 bus systems. Results: The optimal locations to install SVC and TCSC in IEEE 14, 30, 57 and 118 bus systems were evaluated with minimal L-indices and cost using the proposed Firefly algorithm. From the results, it could be inferred that the cost of installing TCSC in IEEE bus system is slightly higher than SVC.For showing the superiority of Firefly algorithm, the results were compared with the already published research finding where this problem was solved using Genetic algorithm and Particle Swarm Optimization. It was revealed that the proposed firefly algorithm gives better optimum solution in minimizing the L-index values for IEEE 30 Bus system. Conclusion: The optimal placement, rating and cost of installation of TCSC and SVC in standard IEEE bus systems which enhanced the voltage stability were evaluated in this work. The need of the FACTS devices was also tested during the abnormal cases such as line outage case, generator outage case and overloading case (140%) with the proposed Firefly algorithm. Outputs reveal that the recognized placement of SVC and TCSC reduces the probability of voltage collapse and cost of the devices in the transmission lines. The capability of Firefly algorithm was also ensured by comparing its results with the results of other algorithms.


2017 ◽  
Vol 139 (4) ◽  
Author(s):  
Samuel F. Asokanthan ◽  
Soroush Arghavan ◽  
Mohamed Bognash

Effect of stochastic fluctuations in angular velocity on the stability of two degrees-of-freedom ring-type microelectromechanical systems (MEMS) gyroscopes is investigated. The governing stochastic differential equations (SDEs) are discretized using the higher-order Milstein scheme in order to numerically predict the system response assuming the fluctuations to be white noise. Simulations via Euler scheme as well as a measure of largest Lyapunov exponents (LLEs) are employed for validation purposes due to lack of similar analytical or experimental data. The response of the gyroscope under different noise fluctuation magnitudes has been computed to ascertain the stability behavior of the system. External noise that affect the gyroscope dynamic behavior typically results from environment factors and the nature of the system operation can be exerted on the system at any frequency range depending on the source. Hence, a parametric study is performed to assess the noise intensity stability threshold for a number of damping ratio values. The stability investigation predicts the form of threshold fluctuation intensity dependence on damping ratio. Under typical gyroscope operating conditions, nominal input angular velocity magnitude and mass mismatch appear to have minimal influence on system stability.


Author(s):  
Brittany Goldsmith ◽  
Elizabeth Foyt ◽  
Madhu Hariharan

As offshore field developments move into deeper water, one of the greatest challenges is in designing riser systems capable of overcoming the added risks of more severe environments, complicated well requirements and uncertainty of operating conditions. The failure of a primary riser component could lead to unacceptable consequences, including environmental damage, lost production and possible injury or loss of human life. Identification of the risks facing riser systems and management of these risks are essential to ensure that riser systems operate without failure. Operators have recognized the importance of installing instrumentation such as global positioning systems (GPS), vessel motion measurement packages, wind and wave sensors and Acoustic Doppler Current Profiler (ADCP) units to monitor vessel motions and environmental conditions. Additionally, high precision monitoring equipment has been developed for capturing riser response. Measured data from these instruments allow an operator to determine when the limits of acceptable response, predicted by analysis or determined by physical limitations of the riser components, have been exceeded. Regular processing of measured data through automated routines ensures that integrity can be quickly assessed. This is particularly important following extreme events, such as a hurricane or loop current. High and medium alert levels are set for each parameter, based on design analysis and operating data. Measured data is compared with these alert levels, and when an alert level is reached, further response evaluation or inspection of the components in question is recommended. This paper will describe the role of offshore monitoring in an integrity management program and discuss the development of alert levels based on potential failure modes of the riser systems. The paper will further demonstrate how this process is key for an effective integrity management program for deepwater riser systems.


2011 ◽  
Vol 80-81 ◽  
pp. 850-854
Author(s):  
Yi Shen Xu ◽  
Ji Hua Gu ◽  
Zhi Tao

Stiction is one of the most important and almost unavoidable problems in MEMS, which usually occurs when the restoring forces of the microstructures are unable to overcome the interfacial forces. Stiction could compromise the performance and reliability of the MEMS devices or may even make them malfunction. One of the pivotal process of advancing the performance and reliability of MEMS is to comprehend the failure modes and failure mechanisms of these microdevices. This article provides a critical investigation on the stiction failure mechanisms of the micromachined electrostatic comb-drive structures, which is significant to improve the reliability of microdevices, especially for microfilters, microgrippers, microaccelerometers, microgyroscopes, microrelays, and so on.


2004 ◽  
Vol 50 (2) ◽  
pp. 83-90 ◽  
Author(s):  
A. Durán Moreno ◽  
B.A. Frontana-Uribe ◽  
R.M. Ramírez Zamora

The feasibility of the electro-Fenton process to generate simultaneously both of the Fenton's reagent species (Fe2+/H2O2), was assessed as a potentially more economical alternative to the classical Fenton's reaction to produce reclaimed water. An air-saturated combined wastewater (mixture of municipal and laboratory effluents) was treated in discontinuous and continuous reactors at pH = 3.5. The discontinuous reactor was a 2 L electrochemical laboratory cell fitted with concentric graphite and iron electrodes. The continuous reactor tests used a pilot treatment system comprising the aforementioned electrochemical cell, two clarifiers and one sand filter. Several tests were carried out at different conditions of reaction time (0-60 min) and electrical current values (0.2-1.0 A) in the discontinuous reactor. The best operating conditions were 60 min and 1 A without filtration of effluents. At these conditions, in discontinuous and continuous reactors with filtration, the COD, turbidity and color removal were 65-74.8%, 77-92.3% and 80-100%, respectively. Fecal and total coliforms, Escherichia coli, Shigella and Salmonella sp. were not detected at the end of the pilot treatment system. Electrogeneration of the Fenton's reagent is also economical; its cost is one-fifth the cost reported for Advanced Primary Treatment.


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