scholarly journals Device Process Integration: A New Device Fabrication Approach

2010 ◽  
Vol 4 (2) ◽  
Author(s):  
Viswanadam Gautham ◽  
Agarwal Ajay
Keyword(s):  
Integrated Circuits ◽  
Manufacturing Industry ◽  
Yield Loss ◽  
Microelectromechanical Systems ◽  
Process Integration ◽  
Device Fabrication ◽  
Mems Devices ◽  
New Device ◽  
Device Processing ◽  
The Cost

Microelectromechanical systems (MEMS) devices have gained considerable attention in medical and automotive applications due to their vast advantages in fault detection. However, the cost for MEMS devices has been a challenge for the device manufacturing industry due to the final packaging of the devices. It is considered expensive compared with device fabrication in certain applications. Majority of MEMS devices are still housing traditional packaging methods due to difficulty in handling and yield loss. The advanced interconnect solutions based on thin silicon carrier and through silicon via are being developed to interconnect integrated circuits and other devices at high densities. Can such technologies be used for MEMS device interconnections? It is really a challenge for MEMS designers and engineers due to the MEMS elements present in the devices. In this paper, we present a device fabrication process to realize interconnects that are fabricated prior to the MEMS elements are defined and processed in the device wafer. The interconnects are filled by doped polysilicon and device wafers with such prefabricated vertical interconnects can be used as the starting wafers for any device processing including optoelectronic and MEMS. The process details and their characterization are elaborated along with the physical and electrical analysis of such interconnections.

scholarly journals A Review on Key Issues and Challenges in Devices Level MEMS Testing

2016 ◽  
Vol 2016 ◽  
pp. 1-14 ◽  
Author(s):  
Muhammad Shoaib ◽  
Nor Hisham Hamid ◽  
Aamir Farooq Malik ◽  
Noohul Basheer Zain Ali ◽  
Mohammad Tariq Jan
Keyword(s):  
Failure Modes ◽  
Microelectromechanical Systems ◽  
Operating Conditions ◽  
Mems Devices ◽  
Test Technique ◽  
Parallel Testing ◽  
Test Systems ◽  
Key Issues ◽  
Mems Testing ◽  
The Cost

The present review provides information relevant to issues and challenges in MEMS testing techniques that are implemented to analyze the microelectromechanical systems (MEMS) behavior for specific application and operating conditions. MEMS devices are more complex and extremely diverse due to the immersion of multidomains. Their failure modes are distinctive under different circumstances. Therefore, testing of these systems at device level as well as at mass production level, that is, parallel testing, is becoming very challenging as compared to the IC test, because MEMS respond to electrical, physical, chemical, and optical stimuli. Currently, test systems developed for MEMS devices have to be customized due to their nondeterministic behavior and complexity. The accurate measurement of test systems for MEMS is difficult to quantify in the production phase. The complexity of the device to be tested required maturity in the test technique which increases the cost of test development; this practice is directly imposed on the device cost. This factor causes a delay in time-to-market.

scholarly journals Selective W for Coating and Releasing MEMS Devices

1999 ◽  
Vol 605 ◽  
Author(s):  
S. S. Mani ◽  
J. G. Fleming ◽  
J. J. Sniegowski ◽  
M. P. de Boer ◽  
L. W. Irwin ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Microelectromechanical Systems ◽  
Process Integration ◽  
Chemical Vapor ◽  
Deposition Process ◽  
Tungsten Coating ◽  
Mems Devices ◽  
Selective Deposition ◽  
Small Areas ◽  
Conformal Coating

AbstractTwo major problems associated with Si-based MEMS (MicroElectroMechanical Systems) devices are stiction and wear. Surface modifications are needed to reduce both adhesion and friction in micromechanical structures to solve these problems. In this paper, we will present a CVD (Chemical Vapor Deposition) process that selectively coats MEMS devices with tungsten and significantly enhances device durability. Tungsten CVD is used in the integrated-circuit industry, which makes this approach manufacturable. This selective deposition process results in a very conformal coating and can potentially address both stiction and wear problems confronting MEMS processing. The selective deposition of tungsten is accomplished through the silicon reduction of WF6. The self-limiting nature of this selective W deposition process ensures the consistency necessary for process control. The tungsten is deposited after the removal of the sacrificial oxides to minimize stress and process integration problems. Tungsten coating adheres well and is hard and conducting, requirements for device performance. Furthermore, since the deposited tungsten infiltrates under adhered silicon parts and the volume of W deposited is less than the amount of Si consumed, it appears to be possible to release stuck parts that are contacted over small areas such as dimples. The wear resistance of selectively coated W parts has been shown to be significantly improved on microengine test structures.

scholarly journals MEMS development focusing on collaboration using common facilities: a retrospective view and future directions

2021 ◽  
Vol 7 (1) ◽  
Author(s):  
Masayoshi Esashi
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Microelectromechanical Systems ◽  
Pressure Sensors ◽  
Tactile Sensor ◽  
Mems Devices ◽  
Future Directions ◽  
Active Matrix ◽  
Large Scale Integration ◽  
Scale Integration

AbstractI have been developing MEMS (microelectromechanical systems) technology and supporting the industry through collaboration. A facility was built in house on a 20 mm square wafer for use in prototyping MEMS and ICs (integrated circuits). The constructed MEMS devices include commercialized integrated capacitive pressure sensors, electrostatically levitated rotational gyroscopes, and two-axis optical scanners. Heterogeneous integration, which is a MEMS on an LSI (large-scale integration), was developed for sophisticated systems using LSI made in a foundry. This technology was applied for tactile sensor networks for safe robots, multi FBAR filters on LSI, active-matrix multielectron emitter arrays, and so on. The facility used to produce MEMS on 4- and 6-inch wafers was developed based on an old semiconductor factory and has been used as an open hands-on access facility by many companies. Future directions of MEMS research are discussed.

scholarly journals Beyond Silicon

2005 ◽  
Vol 127 (07) ◽  
pp. 30-33 ◽  
Author(s):  
John DeGaspari
Keyword(s):  
Integrated Circuits ◽  
Microelectromechanical Systems ◽  
Semiconductor Industry ◽  
Three Dimensional ◽  
Semiconductor Processing ◽  
Santa Barbara ◽  
Long Time ◽  
The Cost ◽  
New Applications ◽  
The University

This article highlights that engineers are expanding their material world to reduce the cost and tailor performance of microdevices. Microelectromechanical systems evolved from the semiconductor industry, and silicon accounts for the vast majority of MEMS. This is not a surprise, since silicon lends itself well to semiconductor processing, and the designers and engineers of integrated circuits and MEMS understand the material’s characteristics and how to process it. Researchers at the University of California, Santa Barbara, meanwhile, are investigating the use of titanium as a wafer material for MEMS. Noel MacDonald, who heads the research group, said that titanium has advantages over silicon with regard to packaging, material properties, and the ability to create three-dimensional structures. Silicon is sure to be a material of choice among MEMS designers for a long time. But the availability of new materials, both for MEMS themselves and tooling to form microstructures, will open doors for new applications.

Structural changes in silicon-on-insulator material during post-implantation annealing

1986 ◽  
Vol 44 ◽  
pp. 736-737
Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson
Keyword(s):  
Integrated Circuits ◽  
Oxide Layer ◽  
High Speed ◽  
Structural Changes ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Quality ◽  
Radiation Hardened ◽  
Post Implantation ◽  
Very High

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.

An Overview of 300 mm SOI Starting Wafer Quality and Its Yield Detractors

2005 ◽  
Author(s):  
Pei Y. Tsai ◽  
Junedong Lee ◽  
Paul Ronsheim ◽  
Lindsay Burns ◽  
Richard Murphy ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Device Fabrication ◽  
Sampling Plan ◽  
Silicon On Insulator ◽  
Manufacturing Processes ◽  
Circuit Performance ◽  
Characterization Techniques ◽  
Wafer Manufacturing

Abstract A stringent sampling plan is developed to monitor and improve the quality of 300mm SOI (silicon on insulator) starting wafers procured from the suppliers. The ultimate goal is to obtain the defect free wafers for device fabrication and increase yield and circuit performance of the semiconductor integrated circuits. This paper presents various characterization techniques for QC monitor and examples of the typical defects attributed to wafer manufacturing processes.

ANALISIS PERHITUNGAN HARGA POKOK PRODUKSI DAN PENENTUAN HARGA JUAL ATAS PRODUK (Studi Kasus Pada PT Dasa Windu Agung)

2016 ◽  
Vol 1 (2) ◽  
pp. 183-190
Author(s):  
Dwi Urip Wardoyo
Keyword(s):  
Manufacturing Industry ◽  
Sampling Method ◽  
Manufacturing Companies ◽  
Test Analysis ◽  
Automotive Components ◽  
Convenience Sampling ◽  
Cost Of Production ◽  
The Cost ◽  
Keywords Cost

This study aims to determine the determination of the cost of production for products produced by PT. DWA. The Company is engaged in the manufacturing industry specialized in automotive components. Its activity is carried out through a series of production processes, so that expenses spent in the production will be calculated into the cost of the production sold. The population in this study were all manufacturing companies in Jakarta. Convenience sampling method selected one of the companies that get the confidence to assemble three national car project in Indonesia, namely Timor, Bakrie and Maleo. Test analysis used in this study is to test the calculation of full costing with job order costing. This study shows that (a) determination of the cost elements associated with the cost of production and (b) determining the cost of production on a product-based job costing with full costing approach. Keywords: cost of production, full costing

scholarly journals Determining the critical period for weed control in high-yielding cotton using common sunflower as a mimic weed

2019 ◽  
Vol 33 (6) ◽  
pp. 800-807 ◽  
Author(s):  
Graham W. Charles ◽  
Brian M. Sindel ◽  
Annette L. Cowie ◽  
Oliver G. G. Knox
Keyword(s):  
Weed Control ◽  
Critical Period ◽  
Yield Loss ◽  
Field Studies ◽  
Growing Degree Days ◽  
Degree Days ◽  
Weed Density ◽  
High Level ◽  
The Cost ◽  
Planting Season

AbstractField studies were conducted over six seasons to determine the critical period for weed control (CPWC) in high-yielding cotton, using common sunflower as a mimic weed. Common sunflower was planted with or after cotton emergence at densities of 1, 2, 5, 10, 20, and 50 plants m−2. Common sunflower was added and removed at approximately 0, 150, 300, 450, 600, 750, and 900 growing degree days (GDD) after planting. Season-long interference resulted in no harvestable cotton at densities of five or more common sunflower plants m−2. High levels of intraspecific and interspecific competition occurred at the highest weed densities, with increases in weed biomass and reductions in crop yield not proportional to the changes in weed density. Using a 5% yield-loss threshold, the CPWC extended from 43 to 615 GDD, and 20 to 1,512 GDD for one and 50 common sunflower plants m−2, respectively. These results highlight the high level of weed control required in high-yielding cotton to ensure crop losses do not exceed the cost of control.

Mapping of Process-Induced Dopant Redistributions by Electron Holography

2004 ◽  
Vol 10 (4) ◽  
pp. 462-469 ◽  
Author(s):  
Wolf-Dieter Rau ◽  
Alexander Orchowski
Keyword(s):  
Semiconductor Device ◽  
Device Fabrication ◽  
Electron Holography ◽  
Dopant Diffusion ◽  
Fundamental Parameters ◽  
Device Processing ◽  
Device Structures ◽  
Before And After ◽  
Potential Applications ◽  
Junction Potential

We present and review dopant mapping examples in semiconductor device structures by electron holography and outline their potential applications for experimental investigation of two-dimensional (2D) dopant diffusion on the nanometer scale. We address the technical challenges of the method when applied to transistor structures with respect to quantification of the results in terms of the 2Dp–njunction potential and critically review experimental boundary conditions, accuracy, and potential pitfalls. By obtaining maps of the inner electrostatic potential before and after anneals typically used in device processing, we demonstrate how the “vertical” and “lateral” redistribution of boron during device fabrication can directly be revealed. Such data can be compared with the results of process simulation to extract the fundamental parameters for dopant diffusion in complex device structures.

Development of Leather Cutting Board from Plastic Waste

2021 ◽  
Vol 116 (12) ◽  
Author(s):  
Fitsum Etefa Ahmed ◽  
Rotick K. Gideon
Keyword(s):  
Manufacturing Industry ◽  
Data Gathering ◽  
Secondary Data ◽  
Melting Process ◽  
Plastic Waste ◽  
Primary Data ◽  
Local Market ◽  
Plastic Recycling ◽  
Reinforcing Material ◽  
The Cost

Cutting is the process in which goods or garment material are cut and converted into pattern shapes of the goods or garment components. There are two methods of Leather cutting, which are hand cutting and machine cutting. Hand cutting is done with the use of hand knife, cutting board and cutting patterns. Machine cutting can be done using semi-automatic cutting machines or fully-automatic cutting machines. Currently, in Ethiopia, different local and foreign investors are participating in leather products manufacturing. Most of the leather product manufacturing industry and some Small and Medium enterprise’s (SME’s) in the country are using leather cutting machines in order to cut leather goods or garment parts. Most of the industry and SMEs are using imported cutting board made of plastics and rubbers. However, these cutting boards are expensive.   This research aimed at developing a cutting board made from HDPE (High-Density Polyethylene) plastic waste as main material, calcium carbonate as a filler and glass fiber as a reinforcing material. Primary and secondary data gathering techniques were applied simultaneously. Primary data were collected through interview and field observation. Secondary data was gathered by reviewing different literature. The cutting board developed through collecting HDPE plastic waste, washing, shredding and melting the shredded plastic with filler and reinforcing material. The melted plastic poured in to cutting board mold and cooled. The developed cutting board was compared with HDPE cutting board available in the local market. The developed board showed relative compression and hardness properties with the HDPE cutting board available in the market. In the cost analysis, the developed cutting board is cheaper than the cutting board which available in the market. However, the cutting board in the market has better surface texture and quality than the developed cutting board. Melting HDPE plastic waste using metal or clay cooking pots and charcoal fire is a tedious task and smoke from the fire will cause human health problem and will affect environment. Consequently, manual plastic melting method is not feasible for mass production, because it is difficult to control the amount of heat (charcoal fire) during melting process. Based on this the authors recommend using machine based plastic melting and molding during HDPE and related plastic recycling.

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