scholarly journals The Synthesis of Highly Aligned Cupric Oxide Nanowires by Heating Copper Foil

2011 ◽  
Vol 2011 ◽  
pp. 1-8 ◽  
Author(s):  
Jianbo Liang ◽  
Naoki Kishi ◽  
Tetsuo Soga ◽  
Takashi Jimbo
Keyword(s):  
Grain Size ◽  
Thermal Oxidation ◽  
Copper Foil ◽  
Smooth Surface ◽  
Cupric Oxide ◽  
The Other ◽  
Oxide Nanowires ◽  
Oxidation Method ◽  
Copper Foils ◽  
Grain Size And Orientation

We have investigated the effects of grain size and orientation of copper substrates for the growth of cupric oxide nanowires by thermal oxidation method. Long, less-roughness, high-density, and aligned cupric oxide nanowires have been synthesized by heating (200) oriented copper foils with small grain size in air gas. Long and aligned nanowires of diameter around 80 nm can only be formed within a short temperature range from 400 to 700°C. On the other hand, uniform, smooth-surface, and aligned nanowires were not formed in the case of larger crystallite size of copper foils with (111) and (200) orientation. Smaller grain size of copper foil with (200) orientation is favorable for the growth of highly aligned, smooth surface, and larger-diameter nanowires by thermal oxidation method.

Cross-sectional characterization of cupric oxide nanowires grown by thermal oxidation of copper foils

2010 ◽  
Vol 257 (1) ◽  
pp. 62-66 ◽  
Author(s):  
JianBo Liang ◽  
Naoki Kishi ◽  
Tetsuo Soga ◽  
Takashi Jimbo
Keyword(s):  
Thermal Oxidation ◽  
Cupric Oxide ◽  
Cross Sectional ◽  
Oxide Nanowires ◽  
Copper Foils

Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil

2013 ◽  
Author(s):  
Takuya Nagayama ◽  
Hiroaki Yoshida ◽  
Ikuo Shohji
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Copper Foil ◽  
Disodium Salt ◽  
The Other ◽  
Hydroxyethyl Cellulose ◽  
Fatigue Properties ◽  
Electrolytic Copper ◽  
Effect Of Additives ◽  
Sulfopropyl Disulfide

The effect of additives in electrolyte on mechanical properties of electrolytic copper foil was investigated. Bis-(3-sulfopropyl)-disulfide disodium salt (SPS), animal protein of low molecular (PBF) and hydroxyethyl cellulose (HEC) were added in electrolyte as additives. The additive amount of SPS was changed in this study. The addition of SPS is effective to improve tensile strength and hardness of electrolytic copper foil. With increasing the additive amount of SPS, the grain of electrolytic copper became finer and thus its hardness and elastic modulus increased. On the other hand, fatigue properties improved when the additive amount of SPS decreased and the grain size of electrolytic copper became relative large.

Synthesis of CuO nanowires on Cu-foil using thermal oxidation method, a novel annealing process

2016 ◽  
Vol 30 (05) ◽  
pp. 1650039 ◽  
Author(s):  
Hosein Eshghi ◽  
Mehdi Torabi Goodarzi
Keyword(s):  
Electron Microscopy ◽  
Thermal Oxidation ◽  
Cupric Oxide ◽  
Band Gap Energy ◽  
Optical Investigation ◽  
Spectra Analysis ◽  
Oxidation Method ◽  
Cuo Nanowires ◽  
Air Atmosphere ◽  
Crystallite Sizes

Cupric oxide (CuO) nanowires (NWs) on Cu-foils were prepared by thermal oxidation method in air atmosphere using two annealing manners (continuous and steps) in the temperature ranges of 400–500[Formula: see text]C and 400–600[Formula: see text]C. Morphology and microstructure of the NWs was studied using field effect scanning electron microscopy (FESEM), X-ray diffractogram (XRD), transmission electron microscopy (TEM) and selected area electron diffraction (SAED). Optical reflectance spectrum was used for the optical investigation of the layers. We found the NWs formed have two different morphologies, curved and straight, with diameters between 50 nm and 200 nm and lengths between 5 [Formula: see text]m and 10 [Formula: see text]m. SAED pattern of a single NW revealed as a CuO single crystal with monoclinic structure. The reflectance spectra analysis based on Kubelka–Munk method showed that the band gap energy of the CuO NWs are varying in the range of 1.40–1.47 eV depending on the crystallite sizes of the NWs, a confirmation for the happening of the quantum confined effect in these samples.

scholarly journals Cupric oxide nanowires on three-dimensional copper foam for application in click reaction

RSC Advances ◽  
2017 ◽  
Vol 7 (16) ◽  
pp. 9567-9572 ◽  
Author(s):  
Chunxia Wang ◽  
Fan Yang ◽  
Yan Cao ◽  
Xing He ◽  
Yushu Tang ◽  
...  
Keyword(s):  
Thermal Oxidation ◽  
Heterogeneous Catalysts ◽  
Click Reaction ◽  
Cupric Oxide ◽  
Three Dimensional ◽  
Dipolar Cycloaddition ◽  
Oxide Nanowires ◽  
Copper Foam ◽  
Additional Support ◽  
Cu Foam

CuO nanowires can be synthesized by facile thermal oxidation of 3D Cu foam in air, which were found to be effective heterogeneous catalysts for the 1,3-dipolar cycloaddition reactions without using any additional support and bases.

scholarly journals Structural behavior of rf magnetron sputtered cupric oxide (CuO) films

2020 ◽  
Vol 25 (2) ◽  
pp. 1-7 ◽  
Author(s):  
Ali Khilkhal ◽  
Abdalhussain A. Khadayeir
Keyword(s):  
Thin Film ◽  
Grain Size ◽  
Cupric Oxide ◽  
Rf Sputtering ◽  
Average Diameter ◽  
The Other ◽  
Structural Behavior ◽  
Mean Square ◽  
Average Grain Size ◽  
Afm Analysis

In this paper a CuO thin film, has been deposited using RF sputtering technique, then the thin film has been characterized by XRD, result obtained showed that strongest peak was 48.6503 degree, and FWHM was 0.145 degree, while lattice constant was 4.65 Aº, and the average grain size was 62.78 nm. While AFM analysis showed that the increasing of another four samples temperature led to increase of roughness average from (3.77 to 15.7) nm, root mean square from (4.66 to 18.8) nm and ten points height from (22.6 to 52.6) at 250,300,350 and 400 C respectively. On the other hand granularity cumulation distribution charts showed average diameter has varied from (57.42, to 135.41) nm with grain numbers per line ( 364, to 135) respectively.

Formation of Copper Oxide Nanowires by Thermal Oxidation of Copper Foil

2017 ◽  
Vol 13 (2) ◽  
pp. 78-83 ◽  
Author(s):  
Jaeseung Jo ◽  
Jae Yu Cho ◽  
Jaeyeong Heo
Keyword(s):  
Copper Oxide ◽  
Thermal Oxidation ◽  
Copper Foil ◽  
Oxide Nanowires

Effect of electric field on Fe2O3 nanowire growth during thermal oxidation

2016 ◽  
Vol 30 (06) ◽  
pp. 1650054 ◽  
Author(s):  
Chunwang Zhao ◽  
Yannan Xue ◽  
Yongjun Jin
Keyword(s):  
Solid State ◽  
Thermal Oxidation ◽  
Electric Fields ◽  
Transverse Electric ◽  
Nanowire Growth ◽  
Iron Foil ◽  
Oxide Nanowires ◽  
Oxidation Method ◽  
Diffusion Growth ◽  
Transverse Electric Fields

A direct current of 5 A was applied to narrow strips of iron foil in air to synthesize iron oxide nanowires (NWs) via thermal oxidation route of resistive heating. Transverse electric fields of 0–4000 V/m were applied perpendicularly to the surface of the iron foil during thermal oxidations. Results showed that the Fe2O3 NW array can grow perpendicularly on that surface by using this kind of thermal oxidation method. Transverse electric fields applied during thermal oxidation significantly affected the morphology of the Fe2O3 NW array. With increasing strength of the transverse electric fields, the Fe2O3 NWs became much longer, thinner and denser in distribution, and the diameters became more uniform. Furthermore, solid state based-up diffusion growth mechanism for the Fe2O3 NW array was confirmed by thermal oxidation.

On the growth of copper oxide nanowires by thermal oxidation near the threshold temperature at atmospheric pressure

2021 ◽  
pp. 161130
Author(s):  
Calin Constantin Moise ◽  
Laura-Bianca Enache ◽  
Veronica Anastasoaie ◽  
Oana Andreea Lazar ◽  
Geanina Valentina Mihai ◽  
...  
Keyword(s):  
Copper Oxide ◽  
Thermal Oxidation ◽  
Atmospheric Pressure ◽  
Threshold Temperature ◽  
Oxide Nanowires

Modeling Recrystallization for 3D Multi-Pass Forming Processes

2007 ◽  
Vol 558-559 ◽  
pp. 1201-1206 ◽  
Author(s):  
Mihaela Teodorescu ◽  
Patrice Lasne ◽  
Roland E. Logé
Keyword(s):  
Numerical Simulation ◽  
Grain Size ◽  
Present Model ◽  
Static Recrystallization ◽  
Volume Fraction ◽  
The Other ◽  
Finite Element Code ◽  
3D Numerical Simulation ◽  
Fraction Distribution ◽  
Simulation Results

The present work concerns the simulation of metallurgical evolutions in 3D multi-pass forming processes. In this context, the analyzed problem is twofold. One point refers to the management of the microstructure evolution during each pass or each inter-pass period and the other point concerns the management of the multi-pass aspects (different grain categories, data structure). In this framework, a model is developed and deals with both aspects. The model considers the microstructure as a composite made of a given (discretized) number of phases which have their own specific properties. The grain size distribution and the recrystallized volume fraction distribution of the different phases evolve continuously during a pass or inter-pass period. With this approach it is possible to deal with the heterogeneity of the microstructure and its evolution in multi-pass conditions. Both dynamic and static recrystallization phenomena are taken into account, with typical Avrami-type equations. The present model is implemented in the Finite Element code FORGE2005®. 3D numerical simulation results for a multi-pass process are presented.

Sign in / Sign up

Export Citation Format

Share Document